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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/pami/CapsonE88>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/David_W._Capson>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Sai-Kit_Eng>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2F34.3902>
foaf:homepage <https://doi.org/10.1109/34.3902>
dc:identifier DBLP journals/pami/CapsonE88 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2F34.3902 (xsd:string)
dcterms:issued 1988 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/pami>
rdfs:label A Tiered-Color Illumination Approach for Machine Inspection of Solder Joints. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/David_W._Capson>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Sai-Kit_Eng>
swrc:number 3 (xsd:string)
swrc:pages 387-393 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/pami/CapsonE88/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/pami/CapsonE88>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/pami/pami10.html#CapsonE88>
rdfs:seeAlso <https://doi.org/10.1109/34.3902>
dc:subject PCB inspection; computerised pattern recognition; tiered-color illumination; machine inspection; solder joints; color vision; printed circuit boards; color contours; binary image; flaw detection; colour vision; computer vision; computerised pattern recognition; inspection; printed circuit manufacture; soldering; statistical analysis (xsd:string)
dc:title A Tiered-Color Illumination Approach for Machine Inspection of Solder Joints. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 10 (xsd:string)