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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/pieee/ColomboPP09>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Alexey_Petrushin>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Davide_Paleari>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Luigi_Pietro_Maria_Colombo>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FJPROC.2008.2007466>
foaf:homepage <https://doi.org/10.1109/JPROC.2008.2007466>
dc:identifier DBLP journals/pieee/ColomboPP09 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FJPROC.2008.2007466 (xsd:string)
dcterms:issued 2009 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/pieee>
rdfs:label A Model of BGA Thermal Vias as an Example of Lumped Parameter Analysis in Thermal Modeling of SiPs and Stacked Die Packages. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Alexey_Petrushin>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Davide_Paleari>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Luigi_Pietro_Maria_Colombo>
swrc:number 1 (xsd:string)
swrc:pages 70-77 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/pieee/ColomboPP09/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/pieee/ColomboPP09>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/pieee/pieee97.html#ColomboPP09>
rdfs:seeAlso <https://doi.org/10.1109/JPROC.2008.2007466>
dc:title A Model of BGA Thermal Vias as an Example of Lumped Parameter Analysis in Thermal Modeling of SiPs and Stacked Die Packages. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 97 (xsd:string)