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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/pieee/Esch06>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jim_Esch>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FJPROC.2006.888852>
foaf:homepage <https://doi.org/10.1109/JPROC.2006.888852>
dc:identifier DBLP journals/pieee/Esch06 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FJPROC.2006.888852 (xsd:string)
dcterms:issued 2006 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/pieee>
rdfs:label Prolog to Wafer Direct Bonding: From Advance Substrate Engineering to Future Applications in Micro/Nanoelectronics. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jim_Esch>
swrc:number 12 (xsd:string)
swrc:pages 2058-2059 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/pieee/Esch06/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/pieee/Esch06>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/pieee/pieee94.html#Esch06>
rdfs:seeAlso <https://doi.org/10.1109/JPROC.2006.888852>
dc:title Prolog to Wafer Direct Bonding: From Advance Substrate Engineering to Future Applications in Micro/Nanoelectronics. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 94 (xsd:string)