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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/ral/HsiehLLCA20>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Fan-Tien_Cheng>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jing-Wen_Lu>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Muhammad_Adnan_0004>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Rung_Lu>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yu-Ming_Hsieh>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FLRA.2020.3000678>
foaf:homepage <https://doi.org/10.1109/LRA.2020.3000678>
dc:identifier DBLP journals/ral/HsiehLLCA20 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FLRA.2020.3000678 (xsd:string)
dcterms:issued 2020 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/ral>
rdfs:label Automated Classification Scheme plus AVM for Wafer Sawing Processes. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Fan-Tien_Cheng>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jing-Wen_Lu>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Muhammad_Adnan_0004>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Rung_Lu>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yu-Ming_Hsieh>
swrc:number 3 (xsd:string)
swrc:pages 4525-4532 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/ral/HsiehLLCA20/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/ral/HsiehLLCA20>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/ral/ral5.html#HsiehLLCA20>
rdfs:seeAlso <https://doi.org/10.1109/LRA.2020.3000678>
dc:title Automated Classification Scheme plus AVM for Wafer Sawing Processes. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 5 (xsd:string)