High-speed solder bump inspection system using a laser scanner and CCD camera.
Resource URI: https://dblp.l3s.de/d2r/resource/publications/journals/scjapan/TsukaharaNTFNA00
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dcterms:
issued
2000
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swrc:
journal
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High-speed solder bump inspection system using a laser scanner and CCD camera.
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High-speed solder bump inspection system using a laser scanner and CCD camera.
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31
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