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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/sensors/ChenYZ22>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Daquan_Yu>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yi_Zhong>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Zuohuan_Chen>
foaf:homepage <http://dx.doi.org/doi.org%2F10.3390%2Fs22062114>
foaf:homepage <https://doi.org/10.3390/s22062114>
dc:identifier DBLP journals/sensors/ChenYZ22 (xsd:string)
dc:identifier DOI doi.org%2F10.3390%2Fs22062114 (xsd:string)
dcterms:issued 2022 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/sensors>
rdfs:label Development of 3D Wafer Level Hermetic Packaging with Through Glass Vias (TGVs) and Transient Liquid Phase Bonding Technology for RF Filter. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Daquan_Yu>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yi_Zhong>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Zuohuan_Chen>
swrc:number 6 (xsd:string)
swrc:pages 2114 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/sensors/ChenYZ22/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/sensors/ChenYZ22>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/sensors/sensors22.html#ChenYZ22>
rdfs:seeAlso <https://doi.org/10.3390/s22062114>
dc:title Development of 3D Wafer Level Hermetic Packaging with Through Glass Vias (TGVs) and Transient Liquid Phase Bonding Technology for RF Filter. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 22 (xsd:string)