Integrated Sensing and Communications With Reconfigurable Intelligent Surfaces: From signal modeling to processing.
Resource URI: https://dblp.l3s.de/d2r/resource/publications/journals/spm/ChepuriSLABE23
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Value
dcterms:
bibliographicCitation
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http://dblp.uni-trier.de/rec/bibtex/journals/spm/ChepuriSLABE23
>
dc:
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https://dblp.l3s.de/d2r/resource/authors/Fan_Liu_0005
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https://dblp.l3s.de/d2r/resource/authors/George_C._Alexandropoulos
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https://dblp.l3s.de/d2r/resource/authors/Nir_Shlezinger
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identifier
DOI doi.org%2F10.1109%2FMSP.2023.3279986
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dcterms:
issued
2023
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swrc:
journal
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https://dblp.l3s.de/d2r/resource/journals/spm
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rdfs:
label
Integrated Sensing and Communications With Reconfigurable Intelligent Surfaces: From signal modeling to processing.
(xsd:string)
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Fan_Liu_0005
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foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/George_C._Alexandropoulos
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foaf:
maker
<
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swrc:
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September
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6
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swrc:
pages
41-62
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seeAlso
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title
Integrated Sensing and Communications With Reconfigurable Intelligent Surfaces: From signal modeling to processing.
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