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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/symmetry/ChenYWLLX23>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Changqing_Xu>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Di_Li_0003>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Dongdong_Chen_0010>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Xianglong_Wang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yi_Liang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yintang_Yang>
foaf:homepage <http://dx.doi.org/doi.org%2F10.3390%2Fsym15020264>
foaf:homepage <https://doi.org/10.3390/sym15020264>
dc:identifier DBLP journals/symmetry/ChenYWLLX23 (xsd:string)
dc:identifier DOI doi.org%2F10.3390%2Fsym15020264 (xsd:string)
dcterms:issued 2023 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/symmetry>
rdfs:label Thermal-Stress Coupling Optimization for Coaxial through Silicon Via. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Changqing_Xu>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Di_Li_0003>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Dongdong_Chen_0010>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Xianglong_Wang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yi_Liang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yintang_Yang>
swrc:month February (xsd:string)
swrc:number 2 (xsd:string)
swrc:pages 264 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/symmetry/ChenYWLLX23/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/symmetry/ChenYWLLX23>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/symmetry/symmetry15.html#ChenYWLLX23>
rdfs:seeAlso <https://doi.org/10.3390/sym15020264>
dc:title Thermal-Stress Coupling Optimization for Coaxial through Silicon Via. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 15 (xsd:string)