Guest Editorial Selected Papers From the 2023 IEEE International Solid-State Circuits Conference.
Resource URI: https://dblp.l3s.de/d2r/resource/publications/journals/tbcas/BurdettMGG23
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dcterms:
bibliographicCitation
<
http://dblp.uni-trier.de/rec/bibtex/journals/tbcas/BurdettMGG23
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Alison_J._Burdett
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Maysam_Ghovanloo
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Pedram_Mohseni
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Roman_Genov
>
foaf:
homepage
<
http://dx.doi.org/doi.org%2F10.1109%2FTBCAS.2023.3347868
>
foaf:
homepage
<
https://doi.org/10.1109/TBCAS.2023.3347868
>
dc:
identifier
DBLP journals/tbcas/BurdettMGG23
(xsd:string)
dc:
identifier
DOI doi.org%2F10.1109%2FTBCAS.2023.3347868
(xsd:string)
dcterms:
issued
2023
(xsd:gYear)
swrc:
journal
<
https://dblp.l3s.de/d2r/resource/journals/tbcas
>
rdfs:
label
Guest Editorial Selected Papers From the 2023 IEEE International Solid-State Circuits Conference.
(xsd:string)
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Alison_J._Burdett
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Maysam_Ghovanloo
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Pedram_Mohseni
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Roman_Genov
>
swrc:
month
December
(xsd:string)
swrc:
number
6
(xsd:string)
swrc:
pages
1182-1184
(xsd:string)
owl:
sameAs
<
http://bibsonomy.org/uri/bibtexkey/journals/tbcas/BurdettMGG23/dblp
>
owl:
sameAs
<
http://dblp.rkbexplorer.com/id/journals/tbcas/BurdettMGG23
>
rdfs:
seeAlso
<
http://dblp.uni-trier.de/db/journals/tbcas/tbcas17.html#BurdettMGG23
>
rdfs:
seeAlso
<
https://doi.org/10.1109/TBCAS.2023.3347868
>
dc:
title
Guest Editorial Selected Papers From the 2023 IEEE International Solid-State Circuits Conference.
(xsd:string)
dc:
type
<
http://purl.org/dc/dcmitype/Text
>
rdf:
type
swrc:Article
rdf:
type
foaf:Document
swrc:
volume
17
(xsd:string)