A Wearable Ultrasonic Neurostimulator - Part II: A 2D CMUT Phased Array System With a Flip-Chip Bonded ASIC.
Resource URI: https://dblp.l3s.de/d2r/resource/publications/journals/tbcas/SeokABYO21
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A Wearable Ultrasonic Neurostimulator - Part II: A 2D CMUT Phased Array System With a Flip-Chip Bonded ASIC.
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A Wearable Ultrasonic Neurostimulator - Part II: A 2D CMUT Phased Array System With a Flip-Chip Bonded ASIC.
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