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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/tc/YaghiniEYBG16>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Ashkan_Eghbal>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Michael_M._Green>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Nader_Bagherzadeh>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Pooria_M._Yaghini>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Siavash_S._Yazdi>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FTC.2015.2498550>
foaf:homepage <https://doi.org/10.1109/TC.2015.2498550>
dc:identifier DBLP journals/tc/YaghiniEYBG16 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FTC.2015.2498550 (xsd:string)
dcterms:issued 2016 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/tc>
rdfs:label Capacitive and Inductive TSV-to-TSV Resilient Approaches for 3D ICs. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Ashkan_Eghbal>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Michael_M._Green>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Nader_Bagherzadeh>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Pooria_M._Yaghini>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Siavash_S._Yazdi>
swrc:number 3 (xsd:string)
swrc:pages 693-705 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/tc/YaghiniEYBG16/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/tc/YaghiniEYBG16>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/tc/tc65.html#YaghiniEYBG16>
rdfs:seeAlso <https://doi.org/10.1109/TC.2015.2498550>
dc:title Capacitive and Inductive TSV-to-TSV Resilient Approaches for 3D ICs. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 65 (xsd:string)