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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/tcad/BoningHW91>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Alexander_S._Wong>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Duane_S._Boning>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Michael_L._Heytens>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2F43.85761>
foaf:homepage <https://doi.org/10.1109/43.85761>
dc:identifier DBLP journals/tcad/BoningHW91 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2F43.85761 (xsd:string)
dcterms:issued 1991 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/tcad>
rdfs:label The intertool profile interchange format: an object-oriented approach [semiconductor technology CAD/CAM]. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Alexander_S._Wong>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Duane_S._Boning>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Michael_L._Heytens>
swrc:number 9 (xsd:string)
swrc:pages 1150-1156 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/tcad/BoningHW91/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/tcad/BoningHW91>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/tcad/tcad10.html#BoningHW91>
rdfs:seeAlso <https://doi.org/10.1109/43.85761>
dc:title The intertool profile interchange format: an object-oriented approach [semiconductor technology CAD/CAM]. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 10 (xsd:string)