Interconnect thermal modeling for accurate simulation of circuittiming and reliability.
Resource URI: https://dblp.l3s.de/d2r/resource/publications/journals/tcad/ChenLRK00
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dcterms:
bibliographicCitation
<
http://dblp.uni-trier.de/rec/bibtex/journals/tcad/ChenLRK00
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Danqing_Chen
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Elyse_Rosenbaum
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Erhong_Li
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Sung-Mo_Kang
>
foaf:
homepage
<
http://dx.doi.org/doi.org%2F10.1109%2F43.828548
>
foaf:
homepage
<
https://doi.org/10.1109/43.828548
>
dc:
identifier
DBLP journals/tcad/ChenLRK00
(xsd:string)
dc:
identifier
DOI doi.org%2F10.1109%2F43.828548
(xsd:string)
dcterms:
issued
2000
(xsd:gYear)
swrc:
journal
<
https://dblp.l3s.de/d2r/resource/journals/tcad
>
rdfs:
label
Interconnect thermal modeling for accurate simulation of circuittiming and reliability.
(xsd:string)
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Danqing_Chen
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Elyse_Rosenbaum
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Erhong_Li
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Sung-Mo_Kang
>
swrc:
number
2
(xsd:string)
swrc:
pages
197-205
(xsd:string)
owl:
sameAs
<
http://bibsonomy.org/uri/bibtexkey/journals/tcad/ChenLRK00/dblp
>
owl:
sameAs
<
http://dblp.rkbexplorer.com/id/journals/tcad/ChenLRK00
>
rdfs:
seeAlso
<
http://dblp.uni-trier.de/db/journals/tcad/tcad19.html#ChenLRK00
>
rdfs:
seeAlso
<
https://doi.org/10.1109/43.828548
>
dc:
title
Interconnect thermal modeling for accurate simulation of circuittiming and reliability.
(xsd:string)
dc:
type
<
http://purl.org/dc/dcmitype/Text
>
rdf:
type
swrc:Article
rdf:
type
foaf:Document
swrc:
volume
19
(xsd:string)