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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/tcad/FangC10>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jia-Wei_Fang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yao-Wen_Chang>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FTCAD.2010.2043586>
foaf:homepage <https://doi.org/10.1109/TCAD.2010.2043586>
dc:identifier DBLP journals/tcad/FangC10 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FTCAD.2010.2043586 (xsd:string)
dcterms:issued 2010 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/tcad>
rdfs:label Area-I/O Flip-Chip Routing for Chip-Package Co-Design Considering Signal Skews. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jia-Wei_Fang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yao-Wen_Chang>
swrc:number 5 (xsd:string)
swrc:pages 711-721 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/tcad/FangC10/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/tcad/FangC10>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/tcad/tcad29.html#FangC10>
rdfs:seeAlso <https://doi.org/10.1109/TCAD.2010.2043586>
dc:title Area-I/O Flip-Chip Routing for Chip-Package Co-Design Considering Signal Skews. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 29 (xsd:string)