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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/tcad/FengRK05>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Evgenii_B._Rudnyi>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jan_G._Korvink>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Lihong_Feng>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FTCAD.2005.852660>
foaf:homepage <https://doi.org/10.1109/TCAD.2005.852660>
dc:identifier DBLP journals/tcad/FengRK05 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FTCAD.2005.852660 (xsd:string)
dcterms:issued 2005 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/tcad>
rdfs:label Preserving the film coefficient as a parameter in the compact thermal model for fast electrothermal simulation. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Evgenii_B._Rudnyi>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jan_G._Korvink>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Lihong_Feng>
swrc:number 12 (xsd:string)
swrc:pages 1838-1847 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/tcad/FengRK05/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/tcad/FengRK05>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/tcad/tcad24.html#FengRK05>
rdfs:seeAlso <https://doi.org/10.1109/TCAD.2005.852660>
dc:title Preserving the film coefficient as a parameter in the compact thermal model for fast electrothermal simulation. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 24 (xsd:string)