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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/tcad/LiPAC06>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Lawrence_T._Pileggi>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Mehdi_Asheghi>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Peng_Li_0001>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Rajit_Chandra>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FTCAD.2005.858276>
foaf:homepage <https://doi.org/10.1109/TCAD.2005.858276>
dc:identifier DBLP journals/tcad/LiPAC06 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FTCAD.2005.858276 (xsd:string)
dcterms:issued 2006 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/tcad>
rdfs:label IC thermal simulation and modeling via efficient multigrid-based approaches. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Lawrence_T._Pileggi>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Mehdi_Asheghi>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Peng_Li_0001>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Rajit_Chandra>
swrc:number 9 (xsd:string)
swrc:pages 1763-1776 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/tcad/LiPAC06/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/tcad/LiPAC06>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/tcad/tcad25.html#LiPAC06>
rdfs:seeAlso <https://doi.org/10.1109/TCAD.2005.858276>
dc:title IC thermal simulation and modeling via efficient multigrid-based approaches. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 25 (xsd:string)