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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/tcad/SayalAMSK20>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Aseem_Sayal>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jaydeep_P._Kulkarni>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Mark_W._McDermott>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Paras_Ajay>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/S._V._Sreenivasan>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FTCAD.2020.2982621>
foaf:homepage <https://doi.org/10.1109/TCAD.2020.2982621>
dc:identifier DBLP journals/tcad/SayalAMSK20 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FTCAD.2020.2982621 (xsd:string)
dcterms:issued 2020 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/tcad>
rdfs:label M2A2: Microscale Modular Assembled ASICs for High-Mix, Low-Volume, Heterogeneously Integrated Designs. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Aseem_Sayal>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jaydeep_P._Kulkarni>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Mark_W._McDermott>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Paras_Ajay>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/S._V._Sreenivasan>
swrc:number 12 (xsd:string)
swrc:pages 4760-4776 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/tcad/SayalAMSK20/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/tcad/SayalAMSK20>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/tcad/tcad39.html#SayalAMSK20>
rdfs:seeAlso <https://doi.org/10.1109/TCAD.2020.2982621>
dc:title M2A2: Microscale Modular Assembled ASICs for High-Mix, Low-Volume, Heterogeneously Integrated Designs. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 39 (xsd:string)