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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/tcad/YangGZDS07>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Changyun_Zhu>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Li_Shang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Robert_P._Dick>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yonghong_Yang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Zhenyu_%28Peter%29_Gu>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FTCAD.2006.882589>
foaf:homepage <https://doi.org/10.1109/TCAD.2006.882589>
dc:identifier DBLP journals/tcad/YangGZDS07 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FTCAD.2006.882589 (xsd:string)
dcterms:issued 2007 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/tcad>
rdfs:label ISAC: Integrated Space-and-Time-Adaptive Chip-Package Thermal Analysis. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Changyun_Zhu>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Li_Shang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Robert_P._Dick>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yonghong_Yang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Zhenyu_%28Peter%29_Gu>
swrc:number 1 (xsd:string)
swrc:pages 86-99 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/tcad/YangGZDS07/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/tcad/YangGZDS07>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/tcad/tcad26.html#YangGZDS07>
rdfs:seeAlso <https://doi.org/10.1109/TCAD.2006.882589>
dc:title ISAC: Integrated Space-and-Time-Adaptive Chip-Package Thermal Analysis. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 26 (xsd:string)