ISAC: Integrated Space-and-Time-Adaptive Chip-Package Thermal Analysis.
Resource URI: https://dblp.l3s.de/d2r/resource/publications/journals/tcad/YangGZDS07
Home
|
Example Publications
Property
Value
dcterms:
bibliographicCitation
<
http://dblp.uni-trier.de/rec/bibtex/journals/tcad/YangGZDS07
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Changyun_Zhu
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Li_Shang
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Robert_P._Dick
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Yonghong_Yang
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Zhenyu_%28Peter%29_Gu
>
foaf:
homepage
<
http://dx.doi.org/doi.org%2F10.1109%2FTCAD.2006.882589
>
foaf:
homepage
<
https://doi.org/10.1109/TCAD.2006.882589
>
dc:
identifier
DBLP journals/tcad/YangGZDS07
(xsd:string)
dc:
identifier
DOI doi.org%2F10.1109%2FTCAD.2006.882589
(xsd:string)
dcterms:
issued
2007
(xsd:gYear)
swrc:
journal
<
https://dblp.l3s.de/d2r/resource/journals/tcad
>
rdfs:
label
ISAC: Integrated Space-and-Time-Adaptive Chip-Package Thermal Analysis.
(xsd:string)
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Changyun_Zhu
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Li_Shang
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Robert_P._Dick
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Yonghong_Yang
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Zhenyu_%28Peter%29_Gu
>
swrc:
number
1
(xsd:string)
swrc:
pages
86-99
(xsd:string)
owl:
sameAs
<
http://bibsonomy.org/uri/bibtexkey/journals/tcad/YangGZDS07/dblp
>
owl:
sameAs
<
http://dblp.rkbexplorer.com/id/journals/tcad/YangGZDS07
>
rdfs:
seeAlso
<
http://dblp.uni-trier.de/db/journals/tcad/tcad26.html#YangGZDS07
>
rdfs:
seeAlso
<
https://doi.org/10.1109/TCAD.2006.882589
>
dc:
title
ISAC: Integrated Space-and-Time-Adaptive Chip-Package Thermal Analysis.
(xsd:string)
dc:
type
<
http://purl.org/dc/dcmitype/Text
>
rdf:
type
swrc:Article
rdf:
type
foaf:Document
swrc:
volume
26
(xsd:string)