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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/tcad/ZhangSOAT22>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Hussam_Amrouch>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jinwei_Zhang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Michael_O%27Dea>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Sheldon_X.-D._Tan>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Sheriff_Sadiqbatcha>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FTCAD.2021.3088081>
foaf:homepage <https://doi.org/10.1109/TCAD.2021.3088081>
dc:identifier DBLP journals/tcad/ZhangSOAT22 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FTCAD.2021.3088081 (xsd:string)
dcterms:issued 2022 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/tcad>
rdfs:label Full-Chip Power Density and Thermal Map Characterization for Commercial Microprocessors Under Heat Sink Cooling. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Hussam_Amrouch>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jinwei_Zhang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Michael_O%27Dea>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Sheldon_X.-D._Tan>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Sheriff_Sadiqbatcha>
swrc:number 5 (xsd:string)
swrc:pages 1453-1466 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/tcad/ZhangSOAT22/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/tcad/ZhangSOAT22>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/tcad/tcad41.html#ZhangSOAT22>
rdfs:seeAlso <https://doi.org/10.1109/TCAD.2021.3088081>
dc:title Full-Chip Power Density and Thermal Map Characterization for Commercial Microprocessors Under Heat Sink Cooling. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 41 (xsd:string)