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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/tcasII/ShiFWZZW21>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Hui_Wang_0017>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Ming_Zhou>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Qihui_Wu>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Shichao_Zheng>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Wenjie_Feng_0002>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yongrong_Shi>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FTCSII.2020.3022858>
foaf:homepage <https://doi.org/10.1109/TCSII.2020.3022858>
dc:identifier DBLP journals/tcasII/ShiFWZZW21 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FTCSII.2020.3022858 (xsd:string)
dcterms:issued 2021 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/tcasII>
rdfs:label Compact Planar W-Band Front-End Module Based on EBG Packaging and LTCC Circuits. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Hui_Wang_0017>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Ming_Zhou>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Qihui_Wu>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Shichao_Zheng>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Wenjie_Feng_0002>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yongrong_Shi>
swrc:number 3 (xsd:string)
swrc:pages 878-882 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/tcasII/ShiFWZZW21/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/tcasII/ShiFWZZW21>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/tcasII/tcasII68.html#ShiFWZZW21>
rdfs:seeAlso <https://doi.org/10.1109/TCSII.2020.3022858>
dc:title Compact Planar W-Band Front-End Module Based on EBG Packaging and LTCC Circuits. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 68 (xsd:string)