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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/tcasII/XiaoCA23>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Fengwei_An>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Lanxiang_Xiao>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Lei_Chen_0001>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FTCSII.2022.3176278>
foaf:homepage <https://doi.org/10.1109/TCSII.2022.3176278>
dc:identifier DBLP journals/tcasII/XiaoCA23 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FTCSII.2022.3176278 (xsd:string)
dcterms:issued 2023 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/tcasII>
rdfs:label An 11.6aF/kPa Mechanical Stress Sensor With 0.808% Temperature-Drift Oscillator for Flip-Chip Packaging. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Fengwei_An>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Lanxiang_Xiao>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Lei_Chen_0001>
swrc:month February (xsd:string)
swrc:number 2 (xsd:string)
swrc:pages 391-395 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/tcasII/XiaoCA23/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/tcasII/XiaoCA23>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/tcasII/tcasII70.html#XiaoCA23>
rdfs:seeAlso <https://doi.org/10.1109/TCSII.2022.3176278>
dc:title An 11.6aF/kPa Mechanical Stress Sensor With 0.808% Temperature-Drift Oscillator for Flip-Chip Packaging. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 70 (xsd:string)