Real-Time Average Junction Temperature Estimation for Multichip IGBT Modules With Low Computational Cost.
Resource URI: https://dblp.l3s.de/d2r/resource/publications/journals/tie/GuoMWXWCC23
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dcterms:
bibliographicCitation
<
http://dblp.uni-trier.de/rec/bibtex/journals/tie/GuoMWXWCC23
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Hai_Wang_0004
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Hanyu_Wang
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Mingyao_Ma
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Nianwen_Xiang
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Weisheng_Guo
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Wenjie_Chen
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Zhaoxiang_Chen
>
foaf:
homepage
<
http://dx.doi.org/doi.org%2F10.1109%2FTIE.2022.3176284
>
foaf:
homepage
<
https://doi.org/10.1109/TIE.2022.3176284
>
dc:
identifier
DBLP journals/tie/GuoMWXWCC23
(xsd:string)
dc:
identifier
DOI doi.org%2F10.1109%2FTIE.2022.3176284
(xsd:string)
dcterms:
issued
2023
(xsd:gYear)
swrc:
journal
<
https://dblp.l3s.de/d2r/resource/journals/tie
>
rdfs:
label
Real-Time Average Junction Temperature Estimation for Multichip IGBT Modules With Low Computational Cost.
(xsd:string)
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Hai_Wang_0004
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Hanyu_Wang
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Mingyao_Ma
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Nianwen_Xiang
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Weisheng_Guo
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Wenjie_Chen
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Zhaoxiang_Chen
>
swrc:
number
4
(xsd:string)
swrc:
pages
4175-4185
(xsd:string)
owl:
sameAs
<
http://bibsonomy.org/uri/bibtexkey/journals/tie/GuoMWXWCC23/dblp
>
owl:
sameAs
<
http://dblp.rkbexplorer.com/id/journals/tie/GuoMWXWCC23
>
rdfs:
seeAlso
<
http://dblp.uni-trier.de/db/journals/tie/tie70.html#GuoMWXWCC23
>
rdfs:
seeAlso
<
https://doi.org/10.1109/TIE.2022.3176284
>
dc:
title
Real-Time Average Junction Temperature Estimation for Multichip IGBT Modules With Low Computational Cost.
(xsd:string)
dc:
type
<
http://purl.org/dc/dcmitype/Text
>
rdf:
type
swrc:Article
rdf:
type
foaf:Document
swrc:
volume
70
(xsd:string)