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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/tie/KimKK09>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Bong-Hwan_Kim>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jong-Bok_Kim>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jong-Hyun_Kim>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FTIE.2008.2003366>
foaf:homepage <https://doi.org/10.1109/TIE.2008.2003366>
dc:identifier DBLP journals/tie/KimKK09 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FTIE.2008.2003366 (xsd:string)
dcterms:issued 2009 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/tie>
rdfs:label A Highly Manufacturable Large Area Array MEMS Probe Card Using Electroplating and Flipchip Bonding. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Bong-Hwan_Kim>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jong-Bok_Kim>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jong-Hyun_Kim>
swrc:number 4 (xsd:string)
swrc:pages 1079-1085 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/tie/KimKK09/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/tie/KimKK09>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/tie/tie56.html#KimKK09>
rdfs:seeAlso <https://doi.org/10.1109/TIE.2008.2003366>
dc:title A Highly Manufacturable Large Area Array MEMS Probe Card Using Electroplating and Flipchip Bonding. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 56 (xsd:string)