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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/tii/LiTZCLZ18>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Haoliang_Zhang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Junhui_Li>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Qing_Tian>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Wenhui_Zhu>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Xiaohe_Liu>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Xinxin_Chen>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FTII.2018.2805297>
foaf:homepage <https://doi.org/10.1109/TII.2018.2805297>
dc:identifier DBLP journals/tii/LiTZCLZ18 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FTII.2018.2805297 (xsd:string)
dcterms:issued 2018 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/tii>
rdfs:label Study on Dipping Mathematical Models for the Solder Flip-Chip Bonding in Microelectronics Packaging. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Haoliang_Zhang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Junhui_Li>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Qing_Tian>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Wenhui_Zhu>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Xiaohe_Liu>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Xinxin_Chen>
swrc:number 11 (xsd:string)
swrc:pages 4746-4754 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/tii/LiTZCLZ18/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/tii/LiTZCLZ18>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/tii/tii14.html#LiTZCLZ18>
rdfs:seeAlso <https://doi.org/10.1109/TII.2018.2805297>
dc:title Study on Dipping Mathematical Models for the Solder Flip-Chip Bonding in Microelectronics Packaging. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 14 (xsd:string)