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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/tim/BaikLYP22>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jinhwan_Baik>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Sangyong_Lee>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Sunchoel_Yang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Sung-Min_Park_0001>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2Ftim.2022.3154817>
foaf:homepage <https://doi.org/10.1109/tim.2022.3154817>
dc:identifier DBLP journals/tim/BaikLYP22 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2Ftim.2022.3154817 (xsd:string)
dcterms:issued 2022 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/tim>
rdfs:label Modularized Electrosurgical System With a Hybrid CPU-FPGA Chip for Real-Time Thermal Lesion Approximation. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jinhwan_Baik>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Sangyong_Lee>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Sunchoel_Yang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Sung-Min_Park_0001>
swrc:pages 1-10 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/tim/BaikLYP22/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/tim/BaikLYP22>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/tim/tim71.html#BaikLYP22>
rdfs:seeAlso <https://doi.org/10.1109/tim.2022.3154817>
dc:title Modularized Electrosurgical System With a Hybrid CPU-FPGA Chip for Real-Time Thermal Lesion Approximation. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 71 (xsd:string)