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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/tim/XiaoXCQZW23>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Baojun_Qiu>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Han_Wang_0017>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Meng_Xiao>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Nian_Cai>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Pan_Xiao>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Shuai_Zhou>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FTIM.2023.3235435>
foaf:homepage <https://doi.org/10.1109/TIM.2023.3235435>
dc:identifier DBLP journals/tim/XiaoXCQZW23 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FTIM.2023.3235435 (xsd:string)
dcterms:issued 2023 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/tim>
rdfs:label Adaptive Hybrid Framework for Multiscale Void Inspection of Chip Resistor Solder Joints. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Baojun_Qiu>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Han_Wang_0017>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Meng_Xiao>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Nian_Cai>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Pan_Xiao>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Shuai_Zhou>
swrc:pages 1-12 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/tim/XiaoXCQZW23/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/tim/XiaoXCQZW23>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/tim/tim72.html#XiaoXCQZW23>
rdfs:seeAlso <https://doi.org/10.1109/TIM.2023.3235435>
dc:title Adaptive Hybrid Framework for Multiscale Void Inspection of Chip Resistor Solder Joints. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 72 (xsd:string)