S-Parameters Characterization of Through, Blind, and Buried Via Holes.
Resource URI: https://dblp.l3s.de/d2r/resource/publications/journals/tmc/AntoniniSO03
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2003
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S-Parameters Characterization of Through, Blind, and Buried Via Holes.
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dc:
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Signal integrity, de-embedding technique, buried, blind, and through via holes.
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S-Parameters Characterization of Through, Blind, and Buried Via Holes.
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