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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/tmc/Ricchiuti03>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Vittorio_Ricchiuti>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FTMC.2003.1255646>
foaf:homepage <https://doi.org/10.1109/TMC.2003.1255646>
dc:identifier DBLP journals/tmc/Ricchiuti03 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FTMC.2003.1255646 (xsd:string)
dcterms:issued 2003 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/tmc>
rdfs:label Power Bus Signal Integrity Improvement and EMI Mitigation on Multilayer High-Speed Digital PCBs with Embedded Capacitance. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Vittorio_Ricchiuti>
swrc:number 4 (xsd:string)
swrc:pages 314-321 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/tmc/Ricchiuti03/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/tmc/Ricchiuti03>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/tmc/tmc2.html#Ricchiuti03>
rdfs:seeAlso <https://doi.org/10.1109/TMC.2003.1255646>
dc:subject Embedded capacitance, power bus, power/ground layers, power supply decoupling, S-parameters, electric field strength. (xsd:string)
dc:title Power Bus Signal Integrity Improvement and EMI Mitigation on Multilayer High-Speed Digital PCBs with Embedded Capacitance. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 2 (xsd:string)