Efficient thermal-oriented 3D floorplanning and thermal via planning for two-stacked-die integration.
Resource URI: https://dblp.l3s.de/d2r/resource/publications/journals/todaes/LiHZBYP06
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dcterms:
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2006
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Efficient thermal-oriented 3D floorplanning and thermal via planning for two-stacked-die integration.
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3D IC, floorplanning, thermal
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Efficient thermal-oriented 3D floorplanning and thermal via planning for two-stacked-die integration.
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