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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/tr/YeoYYA24>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Ho_Kwang_Yow>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Keat_Hoe_Yeoh>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Siang_Miang_Yeo>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Siti_Nur_Farhana_Mohamad_Azenal>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FTR.2023.3294224>
foaf:homepage <https://doi.org/10.1109/TR.2023.3294224>
dc:identifier DBLP journals/tr/YeoYYA24 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FTR.2023.3294224 (xsd:string)
dcterms:issued 2024 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/tr>
rdfs:label Elimination of Die-Pop Defect by Vacuum Reflow for Ultrathin Die With Warpage in Semiconductor Packaging Assembly. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Ho_Kwang_Yow>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Keat_Hoe_Yeoh>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Siang_Miang_Yeo>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Siti_Nur_Farhana_Mohamad_Azenal>
swrc:month March (xsd:string)
swrc:number 1 (xsd:string)
swrc:pages 784-791 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/tr/YeoYYA24/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/tr/YeoYYA24>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/tr/tr73.html#YeoYYA24>
rdfs:seeAlso <https://doi.org/10.1109/TR.2023.3294224>
dc:title Elimination of Die-Pop Defect by Vacuum Reflow for Ultrathin Die With Warpage in Semiconductor Packaging Assembly. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 73 (xsd:string)