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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/tvlsi/ChenM15>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Chang-Chih_Chen>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Linda_S._Milor>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FTVLSI.2014.2357756>
foaf:homepage <https://doi.org/10.1109/TVLSI.2014.2357756>
dc:identifier DBLP journals/tvlsi/ChenM15 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FTVLSI.2014.2357756 (xsd:string)
dcterms:issued 2015 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/tvlsi>
rdfs:label Microprocessor Aging Analysis and Reliability Modeling Due to Back-End Wearout Mechanisms. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Chang-Chih_Chen>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Linda_S._Milor>
swrc:number 10 (xsd:string)
swrc:pages 2065-2076 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/tvlsi/ChenM15/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/tvlsi/ChenM15>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/tvlsi/tvlsi23.html#ChenM15>
rdfs:seeAlso <https://doi.org/10.1109/TVLSI.2014.2357756>
dc:title Microprocessor Aging Analysis and Reliability Modeling Due to Back-End Wearout Mechanisms. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 23 (xsd:string)