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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/tvlsi/HuangGVSSS06>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Karthik_Sankaranarayanan>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Kevin_Skadron>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Mircea_R._Stan>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Shougata_Ghosh>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Sivakumar_Velusamy>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Wei_Huang_0004>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FTVLSI.2006.876103>
foaf:homepage <https://doi.org/10.1109/TVLSI.2006.876103>
dc:identifier DBLP journals/tvlsi/HuangGVSSS06 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FTVLSI.2006.876103 (xsd:string)
dcterms:issued 2006 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/tvlsi>
rdfs:label HotSpot: A Compact Thermal Modeling Methodology for Early-Stage VLSI Design. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Karthik_Sankaranarayanan>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Kevin_Skadron>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Mircea_R._Stan>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Shougata_Ghosh>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Sivakumar_Velusamy>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Wei_Huang_0004>
swrc:number 5 (xsd:string)
swrc:pages 501-513 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/tvlsi/HuangGVSSS06/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/tvlsi/HuangGVSSS06>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/tvlsi/tvlsi14.html#HuangGVSSS06>
rdfs:seeAlso <https://doi.org/10.1109/TVLSI.2006.876103>
dc:title HotSpot: A Compact Thermal Modeling Methodology for Early-Stage VLSI Design. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 14 (xsd:string)