[RDF data]
Home | Example Publications
PropertyValue
dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/tvlsi/KuI07>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Ja_Chun_Ku>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yehea_I._Ismail>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FTVLSI.2007.900749>
foaf:homepage <https://doi.org/10.1109/TVLSI.2007.900749>
dc:identifier DBLP journals/tvlsi/KuI07 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FTVLSI.2007.900749 (xsd:string)
dcterms:issued 2007 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/tvlsi>
rdfs:label Thermal-Aware Methodology for Repeater Insertion in Low-Power VLSI Circuits. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Ja_Chun_Ku>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yehea_I._Ismail>
swrc:number 8 (xsd:string)
swrc:pages 963-970 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/tvlsi/KuI07/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/tvlsi/KuI07>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/tvlsi/tvlsi15.html#KuI07>
rdfs:seeAlso <https://doi.org/10.1109/TVLSI.2007.900749>
dc:title Thermal-Aware Methodology for Repeater Insertion in Low-Power VLSI Circuits. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 15 (xsd:string)