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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/tvlsi/YuSHK08>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Hao_Yu_0001>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Lei_He_0001>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Tanay_Karnik>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yiyu_Shi_0001>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FTVLSI.2008.2001297>
foaf:homepage <https://doi.org/10.1109/TVLSI.2008.2001297>
dc:identifier DBLP journals/tvlsi/YuSHK08 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FTVLSI.2008.2001297 (xsd:string)
dcterms:issued 2008 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/tvlsi>
rdfs:label Thermal Via Allocation for 3-D ICs Considering Temporally and Spatially Variant Thermal Power. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Hao_Yu_0001>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Lei_He_0001>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Tanay_Karnik>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yiyu_Shi_0001>
swrc:number 12 (xsd:string)
swrc:pages 1609-1619 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/tvlsi/YuSHK08/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/tvlsi/YuSHK08>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/tvlsi/tvlsi16.html#YuSHK08>
rdfs:seeAlso <https://doi.org/10.1109/TVLSI.2008.2001297>
dc:title Thermal Via Allocation for 3-D ICs Considering Temporally and Spatially Variant Thermal Power. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 16 (xsd:string)