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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/tvlsi/ZhangDPLFJ22>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Huawei_Li_0001>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jianhui_Jiang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Masahiro_Fujita>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yi_Ding>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Ying_Zhang_0040>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Zebo_Peng>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FTVLSI.2022.3186946>
foaf:homepage <https://doi.org/10.1109/TVLSI.2022.3186946>
dc:identifier DBLP journals/tvlsi/ZhangDPLFJ22 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FTVLSI.2022.3186946 (xsd:string)
dcterms:issued 2022 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/tvlsi>
rdfs:label BMC-Based Temperature-Aware SBST for Worst-Case Delay Fault Testing Under High Temperature. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Huawei_Li_0001>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jianhui_Jiang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Masahiro_Fujita>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yi_Ding>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Ying_Zhang_0040>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Zebo_Peng>
swrc:number 11 (xsd:string)
swrc:pages 1677-1690 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/tvlsi/ZhangDPLFJ22/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/tvlsi/ZhangDPLFJ22>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/tvlsi/tvlsi30.html#ZhangDPLFJ22>
rdfs:seeAlso <https://doi.org/10.1109/TVLSI.2022.3186946>
dc:title BMC-Based Temperature-Aware SBST for Worst-Case Delay Fault Testing Under High Temperature. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 30 (xsd:string)