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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/phd/it/Zhang13>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yabin_Zhang_0003>
foaf:homepage <https://opac.bncf.firenze.sbn.it/bncf-prod/resource?uri=CFI0898268>
dc:identifier DBLP phd/it/Zhang13 (xsd:string)
dcterms:issued 2013 (xsd:gYear)
rdfs:label Modeling Methodology for Reliability-Concerned Current Density Analysis of PCB Tracks and Thermal Analysis of PCB Structure. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yabin_Zhang_0003>
dc:publisher University of Pisa, Italy (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/phd/it/Zhang13/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/phd/it/Zhang13>
rdfs:seeAlso <https://opac.bncf.firenze.sbn.it/bncf-prod/resource?uri=CFI0898268>
dc:title Modeling Methodology for Reliability-Concerned Current Density Analysis of PCB Tracks and Thermal Analysis of PCB Structure. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:PhDThesis
rdf:type foaf:Document