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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/tase/LiuTLT19>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Chek_Sing_Teo>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Dong_Liu>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Kok_Kiong_Tan>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Wenyu_Liang>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FTASE.2018.2848635>
foaf:homepage <https://doi.org/10.1109/TASE.2018.2848635>
dc:identifier DBLP journals/tase/LiuTLT19 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FTASE.2018.2848635 (xsd:string)
dcterms:issued 2019 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/tase>
rdfs:label Soft-Acting, Noncontact Gripping Method for Ultrathin Wafers Using Distributed Bernoulli Principle. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Chek_Sing_Teo>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Dong_Liu>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Kok_Kiong_Tan>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Wenyu_Liang>
swrc:number 2 (xsd:string)
swrc:pages 668-677 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/tase/LiuTLT19/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/tase/LiuTLT19>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/tase/tase16.html#LiuTLT19>
rdfs:seeAlso <https://doi.org/10.1109/TASE.2018.2848635>
dc:title Soft-Acting, Noncontact Gripping Method for Ultrathin Wafers Using Distributed Bernoulli Principle. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 16 (xsd:string)