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Venues (Conferences, Journals, ...)
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GrowBag graphs for keyword ? (Num. hits/coverage)
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The graphs summarize 5 occurrences of 3 keywords
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Results
Found 3 publication records. Showing 3 according to the selection in the facets
Hits ?▲ |
Authors |
Title |
Venue |
Year |
Link |
Author keywords |
1 | Shinobu Fujita, Shinichi Yasuda, Daesung Lee 0002, Xiangyu Chen, Deji Akinwande, H.-S. Philip Wong |
Detachable nano-carbon chip with ultra low power. ![Search on Bibsonomy](Pics/bibsonomy.png) |
DAC ![In: Proceedings of the 47th Design Automation Conference, DAC 2010, Anaheim, California, USA, July 13-18, 2010, pp. 631-632, 2010, ACM, 978-1-4503-0002-5. The full citation details ...](Pics/full.jpeg) |
2010 |
DBLP DOI BibTeX RDF |
NEMS, ultra-low power, 3D-IC |
1 | Viet H. Nguyen, Phillip Christie |
The impact of interstratal interconnect density on the performance of three-dimensional integrated circuits. ![Search on Bibsonomy](Pics/bibsonomy.png) |
SLIP ![In: The Seventh International Workshop on System-Level Interconnect Prediction (SLIP 2005), San Francisco, CA, USA, April 2-3, 2005, Proceedings, pp. 73-78, 2005, ACM, 1-59593-033-7. The full citation details ...](Pics/full.jpeg) |
2005 |
DBLP DOI BibTeX RDF |
interstratal interconnect, 3D-IC, system-level |
1 | Yangdong Steve Deng, Wojciech Maly |
2.5D system integration: a design driven system implementation schema. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ASP-DAC ![In: Proceedings of the 2004 Conference on Asia South Pacific Design Automation: Electronic Design and Solution Fair 2004, Yokohama, Japan, January 27-30, 2004, pp. 450-455, 2004, IEEE Computer Society, 0-7803-8175-0. The full citation details ...](Pics/full.jpeg) |
2004 |
DBLP DOI BibTeX RDF |
2.5D System Integration, 3D stacking, 3D-IC |
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