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Venues (Conferences, Journals, ...)
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GrowBag graphs for keyword ? (Num. hits/coverage)
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The graphs summarize 8 occurrences of 7 keywords
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Results
Found 14 publication records. Showing 14 according to the selection in the facets
Hits ?▲ |
Authors |
Title |
Venue |
Year |
Link |
Author keywords |
86 | Richard H. Stern |
Coming down the home stretch in the Rambus standardization skullduggery saga: To levy or not to levy royalties. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Micro ![In: IEEE Micro 27(2), pp. 80-82, 2007. The full citation details ...](Pics/full.jpeg) |
2007 |
DBLP DOI BibTeX RDF |
Rambus, antitrust violation, skullduggery, Secret Squirrel, DDR SDRAM, JEDEC, standardization, law, patents, SDRAM |
74 | Richard H. Stern |
Another Update on Standardization Skullduggery. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Micro ![In: IEEE Micro 21(5), pp. 8-10, 2001. The full citation details ...](Pics/full.jpeg) |
2001 |
DBLP DOI BibTeX RDF |
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49 | Richard H. Stern |
More standardization skullduggery. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Micro ![In: IEEE Micro 21(4), pp. 12-15, 2001. The full citation details ...](Pics/full.jpeg) |
2001 |
DBLP DOI BibTeX RDF |
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35 | Tim McDonald, Stephanie Watts Butler |
Progress and Current Topics of JEDEC JC-70.1 Power GaN Device Quality and Reliability Standards Activity: Or: What is the Avalanche capability of your GaN Transistor? ![Search on Bibsonomy](Pics/bibsonomy.png) |
IRPS ![In: IEEE International Reliability Physics Symposium, IRPS 2021, Monterey, CA, USA, March 21-25, 2021, pp. 1-6, 2021, IEEE, 978-1-7281-6893-7. The full citation details ...](Pics/full.jpeg) |
2021 |
DBLP DOI BibTeX RDF |
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35 | Carlos Bernal, Manuel Jiménez, Fabio Andrade 0001 |
Evaluating the JEDEC Standard JEP173, Dynamic RDSON Test Method for GaN HEMTs. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ISCAS ![In: IEEE International Symposium on Circuits and Systems, ISCAS 2020, Sevilla, Spain, October 10-21, 2020, pp. 1-4, 2020, IEEE, 978-1-7281-3320-1. The full citation details ...](Pics/full.jpeg) |
2020 |
DBLP DOI BibTeX RDF |
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35 | J. W. McPherson |
Brief history of JEDEC qualification standards for silicon technology and their applicability(?) to WBG semiconductors. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IRPS ![In: IEEE International Reliability Physics Symposium, IRPS 2018, Burlingame, CA, USA, March 11-15, 2018, pp. 3, 2018, IEEE, 978-1-5386-5479-8. The full citation details ...](Pics/full.jpeg) |
2018 |
DBLP DOI BibTeX RDF |
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35 | Manuel Kaufmann, Timm Ostermann |
Simulation model based on JEDEC JS-001-2014 for circuit simulation of HBM ESD pulses on IC level. ![Search on Bibsonomy](Pics/bibsonomy.png) |
EMC Compo ![In: 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, EMC Compo 2015, Edinburgh, UK, November 10-13, 2015, pp. 202-206, 2015, IEEE, 978-1-4673-7897-0. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
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35 | Sergej Deutsch, Brion L. Keller, Vivek Chickermane, Subhasish Mukherjee, Navdeep Sood, Sandeep Kumar Goel, Ji-Jan Chen, Ashok Mehta, Frank Lee, Erik Jan Marinissen |
DfT architecture and ATPG for Interconnect tests of JEDEC Wide-I/O memory-on-logic die stacks. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ITC ![In: 2012 IEEE International Test Conference, ITC 2012, Anaheim, CA, USA, November 5-8, 2012, pp. 1-10, 2012, IEEE Computer Society, 978-1-4673-1594-4. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
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35 | Yi-Shao Lai, Ping-Feng Yang, Chang-Lin Yeh |
Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 46(2-4), pp. 645-650, 2006. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
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35 | Chang-Lin Yeh, Yi-Shao Lai |
Support excitation scheme for transient analysis of JEDEC board-level drop test. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 46(2-4), pp. 626-636, 2006. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
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35 | Peter Alpern, Kheng Chooi Lee, Rainer Tilgner |
Effect of long and short Pb-free soldering profiles of IPC/JEDEC J-STD-020 on plastic SMD packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 44(9-11), pp. 1293-1297, 2004. The full citation details ...](Pics/full.jpeg) |
2004 |
DBLP DOI BibTeX RDF |
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25 | Daniel Schmidt 0001, Norbert Wehn |
DRAM power management and energy consumption: a critical assessment. ![Search on Bibsonomy](Pics/bibsonomy.png) |
SBCCI ![In: Proceedings of the 22st Annual Symposium on Integrated Circuits and Systems Design: Chip on the Dunes, SBCCI 2009, Natal, Brazil, August 31 - September 3, 2009, 2009, ACM, 978-1-60558-705-9. The full citation details ...](Pics/full.jpeg) |
2009 |
DBLP DOI BibTeX RDF |
modelling, measurement, power management, SDRAM |
25 | John Goodenough 0001 |
Design Automation Standards: The IP Providers Perspective. ![Search on Bibsonomy](Pics/bibsonomy.png) |
VLSI Design ![In: 21st International Conference on VLSI Design (VLSI Design 2008), 4-8 January 2008, Hyderabad, India, pp. 730, 2008, IEEE Computer Society, 0-7695-3083-4. The full citation details ...](Pics/full.jpeg) |
2008 |
DBLP DOI BibTeX RDF |
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25 | Brian A. Box, John Nieznanski |
Common processor element packaging for CHAMP. ![Search on Bibsonomy](Pics/bibsonomy.png) |
FCCM ![In: 3rd IEEE Symposium on Field-Programmable Custom Computing Machines (FCCM '95), 19-21 April 1995, Napa Valley, CA, USA, pp. 39-44, 1995, IEEE Computer Society, 0-8186-7086-X. The full citation details ...](Pics/full.jpeg) |
1995 |
DBLP DOI BibTeX RDF |
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