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GrowBag graphs for keyword ? (Num. hits/coverage)
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The graphs summarize 10 occurrences of 9 keywords
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Results
Found 21 publication records. Showing 21 according to the selection in the facets
Hits ?▲ |
Authors |
Title |
Venue |
Year |
Link |
Author keywords |
74 | Norberto Eiji Nawa, Takeshi Furuhashi |
A study on the effect of transfer of genes for the bacterial evolutionary algorithm. ![Search on Bibsonomy](Pics/bibsonomy.png) |
KES (3) ![In: Knowledge-Based Intelligent Electronic Systems, 2nd International Conference, KES 1998, Adelaide, South Australia, 21-23 April 1998, Proceedings, Part III, pp. 585-590, 1998, IEEE. The full citation details ...](Pics/full.jpeg) |
1998 |
DBLP DOI BibTeX RDF |
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36 | Dong Gun Kam, Joungho Kim, Jiheon Yu, Ho Choi, Kicheol Bae, Choonheung Lee |
Packaging a 40-Gbps Serial Link Using a Wire-Bonded Plastic Ball Grid Array. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Des. Test Comput. ![In: IEEE Des. Test Comput. 23(3), pp. 212-219, 2006. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
wire bonded plastic ball grid array, WB-PBGA, 40 Gb/s Serial Link, chip-to-chip serial link, SiP, System-in-Package |
32 | Shao Jiang, An Tong |
Reliability of PBGA Solder Joints under Random Vibration Load. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Int. J. Perform. Eng. ![In: Int. J. Perform. Eng. 16(10), pp. 1617-1626, 2020. The full citation details ...](Pics/full.jpeg) |
2020 |
DBLP DOI BibTeX RDF |
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32 | Tong An, Chao Fang, Fei Qin, Huaicheng Li, Tao Tang, Pei Chen |
Failure study of Sn37Pb PBGA solder joints using temperature cycling, random vibration and combined temperature cycling and random vibration tests. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 91, pp. 213-226, 2018. The full citation details ...](Pics/full.jpeg) |
2018 |
DBLP DOI BibTeX RDF |
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32 | Yeong K. Kim, Do Soon Hwang |
PBGA packaging reliability assessments under random vibrations for space applications. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 55(1), pp. 172-179, 2015. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
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32 | Chung-Neng Huang, Chong-Ching Chang |
Optimal-Parameter Determination by Inverse Model Based on MANFIS: The Case of Injection Molding for PBGA. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Control. Syst. Technol. ![In: IEEE Trans. Control. Syst. Technol. 19(6), pp. 1596-1603, 2011. The full citation details ...](Pics/full.jpeg) |
2011 |
DBLP DOI BibTeX RDF |
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32 | Ming-Yi Tsai, C. W. Ting, C. Y. Huang, Yi-Shao Lai |
Determination of residual strains of the EMC in PBGA during manufacturing and IR solder reflow processes. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 51(3), pp. 642-648, 2011. The full citation details ...](Pics/full.jpeg) |
2011 |
DBLP DOI BibTeX RDF |
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32 | Yeong K. Kim, In Soo Park, Jooho Choi |
Warpage mechanism analyses of strip panel type PBGA chip packaging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 50(3), pp. 398-406, 2010. The full citation details ...](Pics/full.jpeg) |
2010 |
DBLP DOI BibTeX RDF |
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32 | Mei-Ling Wu |
Design of experiments to investigate reliability for solder joints PBGA package under high cycle fatigue. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 50(1), pp. 127-139, 2010. The full citation details ...](Pics/full.jpeg) |
2010 |
DBLP DOI BibTeX RDF |
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32 | Y. S. Chen, C. S. Wang, Y. J. Yang |
Combining vibration test with finite element analysis for the fatigue life estimation of PBGA components. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 48(4), pp. 638-644, 2008. The full citation details ...](Pics/full.jpeg) |
2008 |
DBLP DOI BibTeX RDF |
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32 | Chi-Hui Chien, Thaiping Chen, Yung-Chang Chen, Yii-Tay Chiou, Chi-Chang Hsieh, Yii-Der Wu |
Stability of the warpage in a PBGA package subjected to hygro-thermal loading. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 46(7), pp. 1139-1147, 2006. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
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32 | Kuo-Ming Chen, Kuo-Hsiung Houng, Kuo-Ning Chiang |
Thermal resistance analysis and validation of flip chip PBGA packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 46(2-4), pp. 440-448, 2006. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
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32 | T. Y. Lin, B. Njoman, D. Crouthamel, K. H. Chua, S. Y. Teo, Y. Y. Ma |
The impact of moisture in mold compound preforms on the warpage of PBGA packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 44(4), pp. 603-609, 2004. The full citation details ...](Pics/full.jpeg) |
2004 |
DBLP DOI BibTeX RDF |
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32 | Chi-Hui Chien, Yung-Chang Chen, Yii-Tay Chiou, Thaiping Chen, Chi-Chang Hsieh, Jia-Jin Yan, Wei-Zhi Chen, Yii-Der Wu |
Influences of the moisture absorption on PBGA package's warpage during IR reflow process. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 43(1), pp. 131-139, 2003. The full citation details ...](Pics/full.jpeg) |
2003 |
DBLP DOI BibTeX RDF |
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32 | Mohandass Sivakumar, Kripesh Vaidyanathan, Chong Ser Choong, Tai Chong Chai, Loon Aik Lim |
Reliability of Wire Bonding on Low-k Dielectric Material in Damascene Copper Integrated Circuits PBGA Assembly. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 42(9-11), pp. 1535-1540, 2002. The full citation details ...](Pics/full.jpeg) |
2002 |
DBLP DOI BibTeX RDF |
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32 | S. C. Hung, P. J. Zheng, S. H. Ho, S. C. Lee, H. N. Chen, J. D. Wu |
Board level reliability of PBGA using flex substrate. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 41(5), pp. 677-687, 2001. The full citation details ...](Pics/full.jpeg) |
2001 |
DBLP DOI BibTeX RDF |
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25 | Sai Zeng, Russell S. Peak, Angran Xiao, Suresh K. Sitaraman |
ZAP: a knowledge-based FEA modeling method for highly coupled variable topology multi-body problems. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Eng. Comput. ![In: Eng. Comput. 24(4), pp. 359-381, 2008. The full citation details ...](Pics/full.jpeg) |
2008 |
DBLP DOI BibTeX RDF |
Design-analysis integration, CAD-FEA interoperability, Product information model, Highly coupled variable topology multi-body (HCVTMB), GeoTran-HC |
25 | Francisco Bellas, José Antonio Becerra, Richard J. Duro |
Internal and External Memory in Neuroevolution for Learning in Non-stationary Problems. ![Search on Bibsonomy](Pics/bibsonomy.png) |
SAB ![In: From Animals to Animats 10, 10th International Conference on Simulation of Adaptive Behavior, SAB 2008, Osaka, Japan, July 7-12, 2008. Proceedings, pp. 62-72, 2008, Springer, 978-3-540-69133-4. The full citation details ...](Pics/full.jpeg) |
2008 |
DBLP DOI BibTeX RDF |
non-stationary problems, learning, evolutionary algorithms, artificial neural networks, autonomous robotics |
25 | Jinwoo Choi, Sung-Hwan Min, Joong-Ho Kim, Madhavan Swaminathan, Wendemagegnehu T. Beyene, Chuck Yuan |
Modeling and Analysis of Power Distribution Networks for Gigabit Applications. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Mob. Comput. ![In: IEEE Trans. Mob. Comput. 2(4), pp. 299-313, 2003. The full citation details ...](Pics/full.jpeg) |
2003 |
DBLP DOI BibTeX RDF |
transmission matrix method, power bus, decoupling, macromodeling, Power distribution network |
25 | Wendemagegnehu T. Beyene, Chuck Yuan, Joong-Ho Kim, Madhavan Swaminathan |
Modeling and Analysis of Power Distribution Networks for Gigabit Applications. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ISQED ![In: 4th International Symposium on Quality of Electronic Design (ISQED 2003), 24-26 March 2003, San Jose, CA, USA, pp. 235-240, 2003, IEEE Computer Society, 0-7695-1881-8. The full citation details ...](Pics/full.jpeg) |
2003 |
DBLP DOI BibTeX RDF |
Macro-modeling, reduced-order modeling and transmission matrix method, power distribution network |
25 | Wendemagegnehu T. Beyene, Chuck Yuan |
On the Use of Windows for Accurate Analysis of Package Interconnects. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ISQED ![In: 3rd International Symposium on Quality of Electronic Design, ISQED 2002, San Jose, CA, USA, March 18-21, 2002, pp. 181-186, 2002, IEEE Computer Society, 0-7695-1561-4. The full citation details ...](Pics/full.jpeg) |
2002 |
DBLP DOI BibTeX RDF |
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