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Searching for phrase WB-PBGA (changed automatically) with no syntactic query expansion in all metadata.

Publication years (Num. hits)
1998-2010 (16) 2011-2020 (5)
Publication types (Num. hits)
article(17) inproceedings(4)
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The graphs summarize 10 occurrences of 9 keywords

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Found 21 publication records. Showing 21 according to the selection in the facets
Hits ? Authors Title Venue Year Link Author keywords
74Norberto Eiji Nawa, Takeshi Furuhashi A study on the effect of transfer of genes for the bacterial evolutionary algorithm. Search on Bibsonomy KES (3) The full citation details ... 1998 DBLP  DOI  BibTeX  RDF
36Dong Gun Kam, Joungho Kim, Jiheon Yu, Ho Choi, Kicheol Bae, Choonheung Lee Packaging a 40-Gbps Serial Link Using a Wire-Bonded Plastic Ball Grid Array. Search on Bibsonomy IEEE Des. Test Comput. The full citation details ... 2006 DBLP  DOI  BibTeX  RDF wire bonded plastic ball grid array, WB-PBGA, 40 Gb/s Serial Link, chip-to-chip serial link, SiP, System-in-Package
32Shao Jiang, An Tong Reliability of PBGA Solder Joints under Random Vibration Load. Search on Bibsonomy Int. J. Perform. Eng. The full citation details ... 2020 DBLP  DOI  BibTeX  RDF
32Tong An, Chao Fang, Fei Qin, Huaicheng Li, Tao Tang, Pei Chen Failure study of Sn37Pb PBGA solder joints using temperature cycling, random vibration and combined temperature cycling and random vibration tests. Search on Bibsonomy Microelectron. Reliab. The full citation details ... 2018 DBLP  DOI  BibTeX  RDF
32Yeong K. Kim, Do Soon Hwang PBGA packaging reliability assessments under random vibrations for space applications. Search on Bibsonomy Microelectron. Reliab. The full citation details ... 2015 DBLP  DOI  BibTeX  RDF
32Chung-Neng Huang, Chong-Ching Chang Optimal-Parameter Determination by Inverse Model Based on MANFIS: The Case of Injection Molding for PBGA. Search on Bibsonomy IEEE Trans. Control. Syst. Technol. The full citation details ... 2011 DBLP  DOI  BibTeX  RDF
32Ming-Yi Tsai, C. W. Ting, C. Y. Huang, Yi-Shao Lai Determination of residual strains of the EMC in PBGA during manufacturing and IR solder reflow processes. Search on Bibsonomy Microelectron. Reliab. The full citation details ... 2011 DBLP  DOI  BibTeX  RDF
32Yeong K. Kim, In Soo Park, Jooho Choi Warpage mechanism analyses of strip panel type PBGA chip packaging. Search on Bibsonomy Microelectron. Reliab. The full citation details ... 2010 DBLP  DOI  BibTeX  RDF
32Mei-Ling Wu Design of experiments to investigate reliability for solder joints PBGA package under high cycle fatigue. Search on Bibsonomy Microelectron. Reliab. The full citation details ... 2010 DBLP  DOI  BibTeX  RDF
32Y. S. Chen, C. S. Wang, Y. J. Yang Combining vibration test with finite element analysis for the fatigue life estimation of PBGA components. Search on Bibsonomy Microelectron. Reliab. The full citation details ... 2008 DBLP  DOI  BibTeX  RDF
32Chi-Hui Chien, Thaiping Chen, Yung-Chang Chen, Yii-Tay Chiou, Chi-Chang Hsieh, Yii-Der Wu Stability of the warpage in a PBGA package subjected to hygro-thermal loading. Search on Bibsonomy Microelectron. Reliab. The full citation details ... 2006 DBLP  DOI  BibTeX  RDF
32Kuo-Ming Chen, Kuo-Hsiung Houng, Kuo-Ning Chiang Thermal resistance analysis and validation of flip chip PBGA packages. Search on Bibsonomy Microelectron. Reliab. The full citation details ... 2006 DBLP  DOI  BibTeX  RDF
32T. Y. Lin, B. Njoman, D. Crouthamel, K. H. Chua, S. Y. Teo, Y. Y. Ma The impact of moisture in mold compound preforms on the warpage of PBGA packages. Search on Bibsonomy Microelectron. Reliab. The full citation details ... 2004 DBLP  DOI  BibTeX  RDF
32Chi-Hui Chien, Yung-Chang Chen, Yii-Tay Chiou, Thaiping Chen, Chi-Chang Hsieh, Jia-Jin Yan, Wei-Zhi Chen, Yii-Der Wu Influences of the moisture absorption on PBGA package's warpage during IR reflow process. Search on Bibsonomy Microelectron. Reliab. The full citation details ... 2003 DBLP  DOI  BibTeX  RDF
32Mohandass Sivakumar, Kripesh Vaidyanathan, Chong Ser Choong, Tai Chong Chai, Loon Aik Lim Reliability of Wire Bonding on Low-k Dielectric Material in Damascene Copper Integrated Circuits PBGA Assembly. Search on Bibsonomy Microelectron. Reliab. The full citation details ... 2002 DBLP  DOI  BibTeX  RDF
32S. C. Hung, P. J. Zheng, S. H. Ho, S. C. Lee, H. N. Chen, J. D. Wu Board level reliability of PBGA using flex substrate. Search on Bibsonomy Microelectron. Reliab. The full citation details ... 2001 DBLP  DOI  BibTeX  RDF
25Sai Zeng, Russell S. Peak, Angran Xiao, Suresh K. Sitaraman ZAP: a knowledge-based FEA modeling method for highly coupled variable topology multi-body problems. Search on Bibsonomy Eng. Comput. The full citation details ... 2008 DBLP  DOI  BibTeX  RDF Design-analysis integration, CAD-FEA interoperability, Product information model, Highly coupled variable topology multi-body (HCVTMB), GeoTran-HC
25Francisco Bellas, José Antonio Becerra, Richard J. Duro Internal and External Memory in Neuroevolution for Learning in Non-stationary Problems. Search on Bibsonomy SAB The full citation details ... 2008 DBLP  DOI  BibTeX  RDF non-stationary problems, learning, evolutionary algorithms, artificial neural networks, autonomous robotics
25Jinwoo Choi, Sung-Hwan Min, Joong-Ho Kim, Madhavan Swaminathan, Wendemagegnehu T. Beyene, Chuck Yuan Modeling and Analysis of Power Distribution Networks for Gigabit Applications. Search on Bibsonomy IEEE Trans. Mob. Comput. The full citation details ... 2003 DBLP  DOI  BibTeX  RDF transmission matrix method, power bus, decoupling, macromodeling, Power distribution network
25Wendemagegnehu T. Beyene, Chuck Yuan, Joong-Ho Kim, Madhavan Swaminathan Modeling and Analysis of Power Distribution Networks for Gigabit Applications. Search on Bibsonomy ISQED The full citation details ... 2003 DBLP  DOI  BibTeX  RDF Macro-modeling, reduced-order modeling and transmission matrix method, power distribution network
25Wendemagegnehu T. Beyene, Chuck Yuan On the Use of Windows for Accurate Analysis of Package Interconnects. Search on Bibsonomy ISQED The full citation details ... 2002 DBLP  DOI  BibTeX  RDF
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