Search results for "System-on-Package"

Hits ?▲	Authors	Title	Venue	Year	Link	Author keywords
31	Vijay K. Madisetti	Electronic System, Platform, and Package Codesign.	IEEE Des. Test Comput.	2006	DBLP DOI BibTeX RDF	System-Level Design Automation, Electronic Packaging, System-on-Chip, Platform-Based Design, System-in-Package, System-on-Package
30	Sung Kyu Lim	Physical Design for 3D System on Package.	IEEE Des. Test Comput.	2005	DBLP DOI BibTeX RDF	3D packaging, thermal distribution, crosstalk, placement and routing, decoupling capacitors, System-On-Package
26	Jacob R. Minz, Sung Kyu Lim, Cheng-Kok Koh	3D module placement for congestion and power noise reduction.	ACM Great Lakes Symposium on VLSI	2005	DBLP DOI BibTeX RDF	3D module placement, power noise reduction, congestion, system-on-package
25	Chirag S. Patel	Silicon carrier for computer systems.	DAC	2006	DBLP DOI BibTeX RDF	chip-package co-design, electrical modeling, micro-bumps, silicon carrier, computer system, CMOS scaling, system on package
25	Rao R. Tummala, Vijay K. Madisetti	System on Chip or System on Package?	IEEE Des. Test Comput.	1999	DBLP DOI BibTeX RDF
22	Krishna Bharath, Ege Engin, Madhavan Swaminathan, Kazuhide Uriu, Toru Yamada	Computationally Efficient Power Integrity Simulation for System-on-Package Applications.	DAC	2007	DBLP DOI BibTeX RDF
19	Davide Appello, Paolo Bernardi, Michelangelo Grosso, Matteo Sonza Reorda	System-in-Package Testing: Problems and Solutions.	IEEE Des. Test Comput.	2006	DBLP DOI BibTeX RDF	IEEE1500 SECT, KGD, System-on-Chip, SoC, test access mechanism, SiP, System-in-Package, System-on-Package
17	Eric Wong 0002, Jacob R. Minz, Sung Kyu Lim	Multi-Objective Module Placement For 3-D System-On-Package.	IEEE Trans. Very Large Scale Integr. Syst.	2006	DBLP DOI BibTeX RDF
17	Jacob R. Minz, Sung Kyu Lim	Layer assignment for reliable system-on-package.	ASP-DAC	2004	DBLP DOI BibTeX RDF
12	Li-Rong Zheng 0001, Johan Liu	System-on-package: a broad perspective from system design to technology development.	Microelectron. Reliab.	2003	DBLP DOI BibTeX RDF
11	Lixue Zhou, Wenjie Feng 0002, Dong Wang, Yongrong Shi	A Compact Millimeter-Wave Frequency Conversion SOP (System on Package) Module Based on LTCC Technology.	IEEE Trans. Veh. Technol.	2020	DBLP DOI BibTeX RDF
11	György Bognár, Gábor Takács, Péter G. Szabó, Gábor Rózsás, László Pohl, Balázs Plesz	Integrated Thermal Management in System-on-Package Devices.	Period. Polytech. Electr. Eng. Comput. Sci.	2020	DBLP DOI BibTeX RDF
11	Khawaja Qasim Maqbool, Duona Luo, Xingyun Luo, Huichun Yu, C. Patrick Yue	EMI-Related Common-Mode (CM) Noise Analysis and Prediction of High-Speed Source-Series Terminated (SST) I/O Driver in System-on-Package (SOP).	IEEE Trans. Circuits Syst. II Express Briefs	2018	DBLP DOI BibTeX RDF
11	Gábor Takács, Péter G. Szabó, György Bognár	Thermal management in System-on-Package structures by applying microscale heat sink. Part I: Consideration of the appropriate channel length of microscale heat sink(s).	Microelectron. J.	2015	DBLP DOI BibTeX RDF
11	Jong In Ryu, Se-Hoon Park, Dongsu Kim, Jun Chul Kim, Hyeongdong Kim, Jong Chul Park	A system-on-package module by embedding a mobile TV IC in printed-circuit-board.	RWS	2012	DBLP DOI BibTeX RDF
11	Dong Yun Jung, Won Il Chang, Ji Hoon Kim, Chul Soon Park	A Low Loss Multi-Layer Dielectric Waveguide Filter for 60-GHz System-on-Package Applications.	IEICE Trans. Fundam. Electron. Commun. Comput. Sci.	2006	DBLP DOI BibTeX RDF
11	Jacob R. Minz, Somaskanda Thyagaraja, Sung Kyu Lim	Optical routing for 3D system-on-package.	DATE	2006	DBLP DOI BibTeX RDF
11	John U. Knickerbocker, Paul S. Andry, L. Paivikki Buchwalter, Alina Deutsch, Raymond R. Horton, Keith A. Jenkins, Young Hoon Kwark, Gerald McVicker, Chirag S. Patel, Robert J. Polastre, Christian D. Schuster, Arun Sharma, Sri M. Sri-Jayantha, Christopher W. Surovic, Cornelia K. Tsang, Bucknell C. Webb, Steven L. Wright, Samuel R. McKnight, Edmund J. Sprogis, Bing Dang	Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection.	IBM J. Res. Dev.	2005	DBLP DOI BibTeX RDF
11	Pun Hang Shiu, Ramprasad Ravichandran, Siddharth Easwar, Sung Kyu Lim	Multi-layer floorplanning for reliable system-on-package.	ISCAS (5)	2004	DBLP BibTeX RDF
7	Howard Chen 0001, Louis Hsu	Circuit Design Techniques for On-Chip Power Supply Noise Monitoring System.	PATMOS	2005	DBLP DOI BibTeX RDF
6	Jacob R. Minz, Mohit Pathak, Sung Kyu Lim	Net and Pin Distribution for 3D Package Global Routing.	DATE	2004	DBLP DOI BibTeX RDF