Search results for "micro-bumps"

Found 13 publication records. Showing 13 according to the selection in the facets

Hits ?▲	Authors	Title	Venue	Year	Link	Author keywords
55	Hsiu-Ming Chang 0001, Jiun-Lang Huang, Ding-Ming Kwai, Kwang-Ting (Tim) Cheng, Cheng-Wen Wu	An error tolerance scheme for 3D CMOS imagers.	DAC	2010	DBLP DOI BibTeX RDF	image sensor, error tolerance, 3D IC
46	Chirag S. Patel	Silicon carrier for computer systems.	DAC	2006	DBLP DOI BibTeX RDF	chip-package co-design, electrical modeling, micro-bumps, silicon carrier, computer system, CMOS scaling, system on package
32	Vassilios Gerousis	Physical design implementation for 3D IC: methodology and tools.	ISPD	2010	DBLP DOI BibTeX RDF	3D IC stack, micro-bump, physical design tools, silicon interposer, methodology, tsv
30	Fengwei Dai, David Wei Zhang, Yangyang Yan, Guojun Wang 0001, Liqiang Cao	Research on Ni3Sn4 intermetallic compound for 5μm diameter Cu/Ni/Sn-3.0Ag micro bumps.	IEICE Electron. Express	2022	DBLP DOI BibTeX RDF
30	Jin-Tai Yan, Chia-Heng Yen	Feasible Assignment of Micro-Bumps in 3D ICs.	NEWCAS	2018	DBLP DOI BibTeX RDF
30	Tomokazu Takahashi, Masato Suzuki, Seiji Aoyagi	Octopus bioinspired vacuum gripper with micro bumps.	NEMS	2016	DBLP DOI BibTeX RDF
30	Lionel Dantas de Morais, Sophie Chevalliez, Stephanie Mouleres	Low temperature FIB cross section: Application to indium micro bumps.	Microelectron. Reliab.	2014	DBLP DOI BibTeX RDF
30	Myong-Hoon Roh, Jae Pil Jung, Won Joong Kim	Microstructure, shear strength, and nanoindentation property of electroplated Sn-Bi micro-bumps.	Microelectron. Reliab.	2014	DBLP DOI BibTeX RDF
30	Erik Jan Marinissen, Bart De Wachter, Ken Smith, Jorg Kiesewetter, Mottaqiallah Taouil, Said Hamdioui	Direct probing on large-array fine-pitch micro-bumps of a wide-I/O logic-memory interface.	ITC	2014	DBLP DOI BibTeX RDF
30	Masahiro Aoyagi, Naoya Watanabe, Motohiro Suzuki, Katsuya Kikuchi, Shunsuke Nemoto, Noriaki Arima, Misaki Ishizuka, Koji Suzuki, Toshio Shiomi	New optical three dimensional structure measurement method of cone shape micro bumps used for 3D LSI chip stacking.	3DIC	2013	DBLP DOI BibTeX RDF
30	Ran Wang 0002, Krishnendu Chakrabarty, Bill Eklow	Post-bond Testing of the Silicon Interposer and Micro-bumps in 2.5D ICs.	Asian Test Symposium	2013	DBLP DOI BibTeX RDF
30	Yuki Ohara, Akihiro Noriki, Katsuyuki Sakuma, Kang Wook Lee 0002, Mariappan Murugesan, Jichoel Bea, Fumiaki Yamada, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi	10 µm fine pitch Cu/Sn micro-bumps for 3-D super-chip stack.	3DIC	2009	DBLP DOI BibTeX RDF
22	Syed M. Alam, Robert E. Jones, Shahid Rauf, Ritwik Chatterjee	Inter-Strata Connection Characteristics and Signal Transmission in Three-Dimensional (3D) Integration Technology.	ISQED	2007	DBLP DOI BibTeX RDF