Hits ?▲ |
Authors |
Title |
Venue |
Year |
Link |
Author keywords |
18 | Sheldon X.-D. Tan, Zeyu Sun 0001, Sheriff Sadiqbatcha |
Interconnect Electromigration Modeling and Analysis for Nanometer ICs: From Physics to Full-Chip. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IPSJ Trans. Syst. LSI Des. Methodol. ![In: IPSJ Trans. Syst. LSI Des. Methodol. 13, pp. 42-55, 2020. The full citation details ...](Pics/full.jpeg) |
2020 |
DBLP DOI BibTeX RDF |
|
18 | Steve Bigalke, Jens Lienig |
Avoidance vs. repair: New approaches to increasing electromigration robustness in VLSI routing. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Integr. ![In: Integr. 75, pp. 189-198, 2020. The full citation details ...](Pics/full.jpeg) |
2020 |
DBLP DOI BibTeX RDF |
|
18 | Liang Chen 0025, Sheldon X.-D. Tan, Zeyu Sun 0001, Shaoyi Peng, Min Tang, Junfa Mao |
Fast Analytic Electromigration Analysis for General Multisegment Interconnect Wires. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Very Large Scale Integr. Syst. ![In: IEEE Trans. Very Large Scale Integr. Syst. 28(2), pp. 421-432, 2020. The full citation details ...](Pics/full.jpeg) |
2020 |
DBLP DOI BibTeX RDF |
|
18 | Sheriff Sadiqbatcha, Zeyu Sun 0001, Sheldon X.-D. Tan |
Accelerating Electromigration Aging: Fast Failure Detection for Nanometer ICs. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. ![In: IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 39(4), pp. 885-894, 2020. The full citation details ...](Pics/full.jpeg) |
2020 |
DBLP DOI BibTeX RDF |
|
18 | Sukanta Dey, Sukumar Nandi, Gaurav Trivedi |
Machine Learning Approach for Fast Electromigration Aware Aging Prediction in Incremental Design of Large Scale On-chip Power Grid Network. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ACM Trans. Design Autom. Electr. Syst. ![In: ACM Trans. Design Autom. Electr. Syst. 25(5), pp. 42:1-42:29, 2020. The full citation details ...](Pics/full.jpeg) |
2020 |
DBLP DOI BibTeX RDF |
|
18 | Freddy Gabbay, Avi Mendelson, Yinnon Stav |
Electromigration-Aware Architecture for Modern Microprocessors. ![Search on Bibsonomy](Pics/bibsonomy.png) |
CoRR ![In: CoRR abs/2005.01593, 2020. The full citation details ...](Pics/full.jpeg) |
2020 |
DBLP BibTeX RDF |
|
18 | Sarath Mohanachandran Nair, Rajendra Bishnoi, Mehdi B. Tahoori, Houman Zahedmanesh, Kristof Croes, Kevin Garello, Gouri Sankar Kar, Francky Catthoor |
Physics based modeling of bimodal electromigration failure distributions and variation analysis for VLSI interconnects. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IRPS ![In: 2020 IEEE International Reliability Physics Symposium, IRPS 2020, Dallas, TX, USA, April 28 - May 30, 2020, pp. 1-5, 2020, IEEE, 978-1-7281-3199-3. The full citation details ...](Pics/full.jpeg) |
2020 |
DBLP DOI BibTeX RDF |
|
18 | Yi Ram Kim, Allison T. Osmanson, Hossein Madanipour, Choong-Un Kim, Patrick F. Thompson, Qiao Chen |
Effects of UBM Thickness and Current Flow Configuration on Electromigration Failure Mechanisms in Solder Interconnects. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IRPS ![In: 2020 IEEE International Reliability Physics Symposium, IRPS 2020, Dallas, TX, USA, April 28 - May 30, 2020, pp. 1-5, 2020, IEEE, 978-1-7281-3199-3. The full citation details ...](Pics/full.jpeg) |
2020 |
DBLP DOI BibTeX RDF |
|
18 | Shaobin Ma, Xiaoyi Wang, Sheldon X.-D. Tan, Liang Chen 0025, Jian He |
An Adaptive Electromigration Assessment Algorithm for Full-chip Power/Ground Networks. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ASP-DAC ![In: 25th Asia and South Pacific Design Automation Conference, ASP-DAC 2020, Beijing, China, January 13-16, 2020, pp. 38-43, 2020, IEEE, 978-1-7281-4123-7. The full citation details ...](Pics/full.jpeg) |
2020 |
DBLP DOI BibTeX RDF |
|
18 | Adam Issa, Valeriy Sukharev, Farid N. Najm |
Electromigration Checking Using a Stochastic Effective Current Model. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICCAD ![In: IEEE/ACM International Conference On Computer Aided Design, ICCAD 2020, San Diego, CA, USA, November 2-5, 2020, pp. 5:1-5:8, 2020, IEEE. The full citation details ...](Pics/full.jpeg) |
2020 |
DBLP DOI BibTeX RDF |
|
18 | Mohammadamir Kavousi, Liang Chen 0025, Sheldon X.-D. Tan |
Electromigration Immortality Check considering Joule Heating Effect for Multisegment Wires. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICCAD ![In: IEEE/ACM International Conference On Computer Aided Design, ICCAD 2020, San Diego, CA, USA, November 2-5, 2020, pp. 6:1-6:8, 2020, IEEE. The full citation details ...](Pics/full.jpeg) |
2020 |
DBLP DOI BibTeX RDF |
|
18 | Makoto Yabuuchi, Masao Morimoto, Yasumasa Tsukamoto, Shinji Tanaka |
A 7nm Fin-FET 4.04-Mb/mm2 TCAM with Improved Electromigration Reliability Using Far-Side Driving Scheme and Self-Adjust Reference Match-Line Amplifier. ![Search on Bibsonomy](Pics/bibsonomy.png) |
VLSI Circuits ![In: IEEE Symposium on VLSI Circuits, VLSI Circuits 2020, Honolulu, HI, USA, June 16-19, 2020, pp. 1-2, 2020, IEEE, 978-1-7281-9942-9. The full citation details ...](Pics/full.jpeg) |
2020 |
DBLP DOI BibTeX RDF |
|
18 | Francis G. Wolff, Daniel J. Weyer, Christos A. Papachristou, Steve Clay |
Design Space Exploration Driven by Lifetime Concerns due to Electromigration. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ISQED ![In: 21st International Symposium on Quality Electronic Design, ISQED 2020, Santa Clara, CA, USA, March 25-26, 2020, pp. 73-80, 2020, IEEE, 978-1-7281-4207-4. The full citation details ...](Pics/full.jpeg) |
2020 |
DBLP DOI BibTeX RDF |
|
18 | Akanksha Jat, Shweta Panwalkar, Shweta Meena |
Electromigration and Power Analysis of Digital Circuits at 10 nm Technology Node Before Signoff. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICCCNT ![In: 11th International Conference on Computing, Communication and Networking Technologies, ICCCNT 2020, Kharagpur, India, July 1-3, 2020, pp. 1-5, 2020, IEEE, 978-1-7281-6851-7. The full citation details ...](Pics/full.jpeg) |
2020 |
DBLP DOI BibTeX RDF |
|
18 | Chase Cook, Sheriff Sadiqbatcha, Zeyu Sun 0001, Sheldon X.-D. Tan |
Reliability based hardware Trojan design using physics-based electromigration models. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Integr. ![In: Integr. 66, pp. 9-15, 2019. The full citation details ...](Pics/full.jpeg) |
2019 |
DBLP DOI BibTeX RDF |
|
18 | J. M. Passage, Nabihah Azhari, J. R. Lloyd |
Stress Migration Followed by Electromigration Reliability Testing. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IRPS ![In: IEEE International Reliability Physics Symposium, IRPS 2019, Monterey, CA, USA, March 31 - April 4, 2019, pp. 1-5, 2019, IEEE, 978-1-5386-9504-3. The full citation details ...](Pics/full.jpeg) |
2019 |
DBLP DOI BibTeX RDF |
|
18 | Sarath Mohanachandran Nair, Rajendra Bishnoi, Mehdi Baradaran Tahoori, Houman Zahedmanesh, Kristof Croes, Kevin Garello, Gouri Sankar Kar, Francky Catthoor |
Variation-Aware Physics-Based Electromigration Modeling and Experimental Calibration for VLSI Interconnects. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IRPS ![In: IEEE International Reliability Physics Symposium, IRPS 2019, Monterey, CA, USA, March 31 - April 4, 2019, pp. 1-6, 2019, IEEE, 978-1-5386-9504-3. The full citation details ...](Pics/full.jpeg) |
2019 |
DBLP DOI BibTeX RDF |
|
18 | Young-Joon Park, Jungwoo Joh, Jayhoon Chung, Srikanth Krishnan |
Current Crowding Impact on Electromigration in Al Interconnects. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IRPS ![In: IEEE International Reliability Physics Symposium, IRPS 2019, Monterey, CA, USA, March 31 - April 4, 2019, pp. 1-6, 2019, IEEE, 978-1-5386-9504-3. The full citation details ...](Pics/full.jpeg) |
2019 |
DBLP DOI BibTeX RDF |
|
18 | Shinji Yokogawa, Kyosuke Kunii |
A Simple Prediction Method for Chip-Level Electromigration Lifetime Using Generalized Gamma Distribution. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IRPS ![In: IEEE International Reliability Physics Symposium, IRPS 2019, Monterey, CA, USA, March 31 - April 4, 2019, pp. 1-6, 2019, IEEE, 978-1-5386-9504-3. The full citation details ...](Pics/full.jpeg) |
2019 |
DBLP DOI BibTeX RDF |
|
18 | Sofie Beyne, Olalla Varela Pedreira, Ingrid De Wolf, Zsolt Tökei, Kristof Croes |
Low-Frequency Noise Measurements to Characterize Cu-Electromigration Down to 44nm Metal Pitch. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IRPS ![In: IEEE International Reliability Physics Symposium, IRPS 2019, Monterey, CA, USA, March 31 - April 4, 2019, pp. 1-6, 2019, IEEE, 978-1-5386-9504-3. The full citation details ...](Pics/full.jpeg) |
2019 |
DBLP DOI BibTeX RDF |
|
18 | Farid N. Najm, Valeriy Sukharev |
Efficient Simulation of Electromigration Damage in Large Chip Power Grids Using Accurate Physical Models (Invited Paper). ![Search on Bibsonomy](Pics/bibsonomy.png) |
IRPS ![In: IEEE International Reliability Physics Symposium, IRPS 2019, Monterey, CA, USA, March 31 - April 4, 2019, pp. 1-10, 2019, IEEE, 978-1-5386-9504-3. The full citation details ...](Pics/full.jpeg) |
2019 |
DBLP DOI BibTeX RDF |
|
18 | Hideaki Tsuchiya, Naohito Suzumura, Ryuji Shibata, Hideki Aono, Makoto Ogasawara, Toshihiko Akiba, Kenji Sakata, Kazuyuki Nakagawa, Takuo Funaya |
Electromigration Early Failures for Cu Pillar Interconnections with an ENEPIG Pad Finish and its Suppression. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IRPS ![In: IEEE International Reliability Physics Symposium, IRPS 2019, Monterey, CA, USA, March 31 - April 4, 2019, pp. 1-6, 2019, IEEE, 978-1-5386-9504-3. The full citation details ...](Pics/full.jpeg) |
2019 |
DBLP DOI BibTeX RDF |
|
18 | Wei Ye 0008, Mohamed Baker Alawieh, Yibo Lin, David Z. Pan |
Tackling signal electromigration with learning-based detection and multistage mitigation. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ASP-DAC ![In: Proceedings of the 24th Asia and South Pacific Design Automation Conference, ASPDAC 2019, Tokyo, Japan, January 21-24, 2019, pp. 167-172, 2019, ACM, 978-1-4503-6007-4. The full citation details ...](Pics/full.jpeg) |
2019 |
DBLP DOI BibTeX RDF |
|
18 | Sachin S. Sapatnekar |
Electromigration-Aware Interconnect Design. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ISPD ![In: Proceedings of the 2019 International Symposium on Physical Design, ISPD 2019, San Francisco, CA, USA, April 14-17, 2019, pp. 83-90, 2019, ACM, 978-1-4503-6253-5. The full citation details ...](Pics/full.jpeg) |
2019 |
DBLP DOI BibTeX RDF |
|
18 | Zahi Moudallal, Valeriy Sukharev, Farid N. Najm |
Power Grid Fixing for Electromigration-induced Voltage Failures. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICCAD ![In: Proceedings of the International Conference on Computer-Aided Design, ICCAD 2019, Westminster, CO, USA, November 4-7, 2019, pp. 1-8, 2019, ACM, 9781728123509. The full citation details ...](Pics/full.jpeg) |
2019 |
DBLP DOI BibTeX RDF |
|
18 | Jing Wang, Yici Cai, Ming Yan, Qiang Zhou 0001 |
Composite Optimization for Electromigration Reliability and Noise in Power Grid Networks. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ISCAS ![In: IEEE International Symposium on Circuits and Systems, ISCAS 2019, Sapporo, Japan, May 26-29, 2019, pp. 1-5, 2019, IEEE, 978-1-7281-0397-6. The full citation details ...](Pics/full.jpeg) |
2019 |
DBLP DOI BibTeX RDF |
|
18 | Ali Abbasinasab, Malgorzata Marek-Sadowska |
Non-Uniform Temperature Distribution in Interconnects and Its Impact on Electromigration. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ACM Great Lakes Symposium on VLSI ![In: Proceedings of the 2019 on Great Lakes Symposium on VLSI, GLSVLSI 2019, Tysons Corner, VA, USA, May 9-11, 2019, pp. 117-122, 2019, ACM, 978-1-4503-6252-8. The full citation details ...](Pics/full.jpeg) |
2019 |
DBLP DOI BibTeX RDF |
|
18 | Mohammad Torabi, Lihong Zhang |
Electromigration- and Parasitic-Aware ILP-Based Analog Router. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Very Large Scale Integr. Syst. ![In: IEEE Trans. Very Large Scale Integr. Syst. 26(10), pp. 1854-1867, 2018. The full citation details ...](Pics/full.jpeg) |
2018 |
DBLP DOI BibTeX RDF |
|
18 | Shengcheng Wang, Taeyoung Kim 0001, Zeyu Sun 0001, Sheldon X.-D. Tan, Mehdi Baradaran Tahoori |
Recovery-Aware Proactive TSV Repair for Electromigration Lifetime Enhancement in 3-D ICs. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Very Large Scale Integr. Syst. ![In: IEEE Trans. Very Large Scale Integr. Syst. 26(3), pp. 531-543, 2018. The full citation details ...](Pics/full.jpeg) |
2018 |
DBLP DOI BibTeX RDF |
|
18 | Chase Cook, Zeyu Sun 0001, Ertugrul Demircan, Mehul D. Shroff, Sheldon X.-D. Tan |
Fast Electromigration Stress Evolution Analysis for Interconnect Trees Using Krylov Subspace Method. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Very Large Scale Integr. Syst. ![In: IEEE Trans. Very Large Scale Integr. Syst. 26(5), pp. 969-980, 2018. The full citation details ...](Pics/full.jpeg) |
2018 |
DBLP DOI BibTeX RDF |
|
18 | Hengyang Zhao, Sheldon X.-D. Tan |
Postvoiding FEM Analysis for Electromigration Failure Characterization. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Very Large Scale Integr. Syst. ![In: IEEE Trans. Very Large Scale Integr. Syst. 26(11), pp. 2483-2493, 2018. The full citation details ...](Pics/full.jpeg) |
2018 |
DBLP DOI BibTeX RDF |
|
18 | Zeyu Sun 0001, Ertugrul Demircan, Mehul D. Shroff, Chase Cook, Sheldon X.-D. Tan |
Fast Electromigration Immortality Analysis for Multisegment Copper Interconnect Wires. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. ![In: IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 37(12), pp. 3137-3150, 2018. The full citation details ...](Pics/full.jpeg) |
2018 |
DBLP DOI BibTeX RDF |
|
18 | Sandeep Chatterjee, Valeriy Sukharev, Farid N. Najm |
Power Grid Electromigration Checking Using Physics-Based Models. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. ![In: IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 37(7), pp. 1317-1330, 2018. The full citation details ...](Pics/full.jpeg) |
2018 |
DBLP DOI BibTeX RDF |
|
18 | Yu Tian, Jing Han, Limin Ma, Fu Guo |
The dominant effect of c-axis orientation in tin on the electromigration behaviors in tricrystal Sn-3.0Ag-0.5Cu solder joints. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 80, pp. 7-13, 2018. The full citation details ...](Pics/full.jpeg) |
2018 |
DBLP DOI BibTeX RDF |
|
18 | Sukanta Dey, Satyabrata Dash, Sukumar Nandi, Gaurav Trivedi |
PGIREM: Reliability-Constrained IR Drop Minimization and Electromigration Assessment of VLSI Power Grid Networks Using Cooperative Coevolution. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ISVLSI ![In: 2018 IEEE Computer Society Annual Symposium on VLSI, ISVLSI 2018, Hong Kong, China, July 8-11, 2018, pp. 40-45, 2018, IEEE Computer Society, 978-1-5386-7099-6. The full citation details ...](Pics/full.jpeg) |
2018 |
DBLP DOI BibTeX RDF |
|
18 | Steve Bigalke, Jens Lienig |
FLUTE-EM: Electromigration-Optimized Net Considering Topology Currents and Mechanical Stress. ![Search on Bibsonomy](Pics/bibsonomy.png) |
VLSI-SoC ![In: IFIP/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2018, Verona, Italy, October 8-10, 2018, pp. 225-230, 2018, IEEE, 978-1-5386-4756-1. The full citation details ...](Pics/full.jpeg) |
2018 |
DBLP DOI BibTeX RDF |
|
18 | Chao-Kun Hu, James J. Kelly, Huai Huang, Koichi Motoyama, Hosadurga Shobha, Yuri Ostrovski, James H.-C. Chen, Raghuveer Patlolla, Brown Peethala, Praneet Adusumilli, Terry A. Spooner, Roger Quon, Lynne M. Gignac, Chris M. Breslin, G. Lian, M. Ali, Jacob Benedict, X. S. Lin, S. Smith, Vimal Kamineni, X. Zhang, Frank Wilhelm Mont, Shariq Siddiqui, Frieder H. Baumann |
Future on-chip interconnect metallization and electromigration. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IRPS ![In: IEEE International Reliability Physics Symposium, IRPS 2018, Burlingame, CA, USA, March 11-15, 2018, pp. 4, 2018, IEEE, 978-1-5386-5479-8. The full citation details ...](Pics/full.jpeg) |
2018 |
DBLP DOI BibTeX RDF |
|
18 | Seungman Choi, Cathryn Christiansen, Linjun Cao, James Zhang, Ronald Filippi, Tian Shen, Kong Boon Yeap, Sean P. Ogden, Haojun Zhang, Bianzhu Fu, Patrick Justison |
Effect of metal line width on electromigration of BEOL Cu interconnects. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IRPS ![In: IEEE International Reliability Physics Symposium, IRPS 2018, Burlingame, CA, USA, March 11-15, 2018, pp. 4, 2018, IEEE, 978-1-5386-5479-8. The full citation details ...](Pics/full.jpeg) |
2018 |
DBLP DOI BibTeX RDF |
|
18 | Baozhen Li, Andrew Kim, Paul McLaughlin, Barry P. Linder, Cathryn Christiansen |
Electromigration characteristics of power grid like structures. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IRPS ![In: IEEE International Reliability Physics Symposium, IRPS 2018, Burlingame, CA, USA, March 11-15, 2018, pp. 4, 2018, IEEE, 978-1-5386-5479-8. The full citation details ...](Pics/full.jpeg) |
2018 |
DBLP DOI BibTeX RDF |
|
18 | Christine S. Hau-Riege, Huilin Xu, You-Wen Yau, Manasi S. Kakade, Jianfeng Li, Xiaonan Zhang, Hosain Farr |
Electromigration of multi-solder ball test structures. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IRPS ![In: IEEE International Reliability Physics Symposium, IRPS 2018, Burlingame, CA, USA, March 11-15, 2018, pp. 5, 2018, IEEE, 978-1-5386-5479-8. The full citation details ...](Pics/full.jpeg) |
2018 |
DBLP DOI BibTeX RDF |
|
18 | M. Kraatz, Christoph Sander, André Clausner, M. Hauschildt, Yvonne Standke, Martin Gall, Ehrenfried Zschech |
Analysis of electromigration-induced backflow stresses in Cu(Mn) interconnects using high statistical sampling. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IRPS ![In: IEEE International Reliability Physics Symposium, IRPS 2018, Burlingame, CA, USA, March 11-15, 2018, pp. 4, 2018, IEEE, 978-1-5386-5479-8. The full citation details ...](Pics/full.jpeg) |
2018 |
DBLP DOI BibTeX RDF |
|
18 | Sofie Beyne, Shibesh Dutta, Olalla Varela Pedreira, Niels Bosman, Christoph Adelmann, Ingrid De Wolf, Zsolt Tökei, Kristof Croes |
The first observation of p-type electromigration failure in full ruthenium interconnects. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IRPS ![In: IEEE International Reliability Physics Symposium, IRPS 2018, Burlingame, CA, USA, March 11-15, 2018, pp. 6, 2018, IEEE, 978-1-5386-5479-8. The full citation details ...](Pics/full.jpeg) |
2018 |
DBLP DOI BibTeX RDF |
|
18 | Jae-Gyung Ahn, Ping-Chin Yeh, Jonathan Chang |
Electromigration failure rate of redundant via. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IRPS ![In: IEEE International Reliability Physics Symposium, IRPS 2018, Burlingame, CA, USA, March 11-15, 2018, pp. 1, 2018, IEEE, 978-1-5386-5479-8. The full citation details ...](Pics/full.jpeg) |
2018 |
DBLP DOI BibTeX RDF |
|
18 | Norman Chang, Ajay Baranwal, Hao Zhuang, Ming-Chih Shih, Rahul Rajan, Yaowei Jia, Hui-Lun Liao, Ying-Shiun Li, Ting Ku, Rex Lin |
Machine learning based generic violation waiver system with application on electromigration sign-off. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ASP-DAC ![In: 23rd Asia and South Pacific Design Automation Conference, ASP-DAC 2018, Jeju, Korea (South), January 22-25, 2018, pp. 416-421, 2018, IEEE, 978-1-5090-0602-1. The full citation details ...](Pics/full.jpeg) |
2018 |
DBLP DOI BibTeX RDF |
|
18 | Han Zhou 0002, Yijing Sun, Zeyu Sun 0001, Hengyang Zhao, Sheldon X.-D. Tan |
Electromigration-lifetime constrained power grid optimization considering multi-segment interconnect wires. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ASP-DAC ![In: 23rd Asia and South Pacific Design Automation Conference, ASP-DAC 2018, Jeju, Korea (South), January 22-25, 2018, pp. 399-404, 2018, IEEE, 978-1-5090-0602-1. The full citation details ...](Pics/full.jpeg) |
2018 |
DBLP DOI BibTeX RDF |
|
18 | Zeyu Sun 0001, Sheriff Sadiqbatcha, Hengyang Zhao, Sheldon X.-D. Tan |
Accelerating electromigration aging for fast failure detection for nanometer ICs. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ASP-DAC ![In: 23rd Asia and South Pacific Design Automation Conference, ASP-DAC 2018, Jeju, Korea (South), January 22-25, 2018, pp. 623-630, 2018, IEEE, 978-1-5090-0602-1. The full citation details ...](Pics/full.jpeg) |
2018 |
DBLP DOI BibTeX RDF |
|
18 | Rafael O. Nunes, R. L. de Orio |
Operational Amplifier Performance Degradation and Time-to-Failure due to Electromigration. ![Search on Bibsonomy](Pics/bibsonomy.png) |
SBCCI ![In: 31st Symposium on Integrated Circuits and Systems Design, SBCCI 2018, Bento Gonçalves, RS, Brazil, August 27-31, 2018, pp. 1-6, 2018, IEEE, 978-1-5386-7431-4. The full citation details ...](Pics/full.jpeg) |
2018 |
DBLP DOI BibTeX RDF |
|
18 | Lucas de Paris, Ricardo Reis 0001 |
An automated methodology to fix electromigration violations on a customized design flow. ![Search on Bibsonomy](Pics/bibsonomy.png) |
LASCAS ![In: 9th IEEE Latin American Symposium on Circuits & Systems, LASCAS 2018, Puerto Vallarta, Mexico, February 25-28, 2018, pp. 1-4, 2018, IEEE, 978-1-5386-2311-4. The full citation details ...](Pics/full.jpeg) |
2018 |
DBLP DOI BibTeX RDF |
|
18 | Jens Lienig, Matthias Thiele |
The Pressing Need for Electromigration-Aware Physical Design. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ISPD ![In: Proceedings of the 2018 International Symposium on Physical Design, ISPD 2018, Monterey, CA, USA, March 25-28, 2018, pp. 144-151, 2018, ACM. The full citation details ...](Pics/full.jpeg) |
2018 |
DBLP DOI BibTeX RDF |
|
18 | Sheriff Sadiqbatcha, Chase Cook, Zeyu Sun 0001, Sheldon X.-D. Tan |
Accelerating Electromigration Wear-Out Effects Based on Configurable Sink-Structured Wires. ![Search on Bibsonomy](Pics/bibsonomy.png) |
SMACD ![In: 15th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design, SMACD 2018, Prague, Czech Republic, July 2-5, 2018, pp. 21-24, 2018, IEEE, 978-1-5386-5153-7. The full citation details ...](Pics/full.jpeg) |
2018 |
DBLP DOI BibTeX RDF |
|
18 | Chase Cook, Sheriff Sadiqbatcha, Zeyu Sun 0001, Sheldon X.-D. Tan |
Reliability Based Hardware Trojan Design Using Physics-Based Electromigration Models. ![Search on Bibsonomy](Pics/bibsonomy.png) |
SMACD ![In: 15th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design, SMACD 2018, Prague, Czech Republic, July 2-5, 2018, pp. 5-8, 2018, IEEE, 978-1-5386-5153-7. The full citation details ...](Pics/full.jpeg) |
2018 |
DBLP DOI BibTeX RDF |
|
18 | Hengyang Zhao, Sheldon X.-D. Tan |
Multi-physics-based FEM analysis for post-voiding analysis of electromigration failure effects. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICCAD ![In: Proceedings of the International Conference on Computer-Aided Design, ICCAD 2018, San Diego, CA, USA, November 05-08, 2018, pp. 124, 2018, ACM, 978-1-4503-5950-4. The full citation details ...](Pics/full.jpeg) |
2018 |
DBLP DOI BibTeX RDF |
|
18 | Steve Bigalke, Jens Lienig, Göran Jerke, Jürgen Scheible, Roland Jancke |
The need and opportunities of electromigration-aware integrated circuit design. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICCAD ![In: Proceedings of the International Conference on Computer-Aided Design, ICCAD 2018, San Diego, CA, USA, November 05-08, 2018, pp. 96, 2018, ACM, 978-1-4503-5950-4. The full citation details ...](Pics/full.jpeg) |
2018 |
DBLP DOI BibTeX RDF |
|
18 | Mohammad Torabi, Lihong Zhang |
Electromigration and Parasitic-Aware ILP Router for Analog and RF Circuits. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ISCAS ![In: IEEE International Symposium on Circuits and Systems, ISCAS 2018, 27-30 May 2018, Florence, Italy, pp. 1-5, 2018, IEEE, 978-1-5386-4881-0. The full citation details ...](Pics/full.jpeg) |
2018 |
DBLP DOI BibTeX RDF |
|
18 | Xiaotao Jia, Jing Wang, Yici Cai, Qiang Zhou 0001 |
Electromigration Design Rule aware Global and Detailed Routing Algorithm. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ACM Great Lakes Symposium on VLSI ![In: Proceedings of the 2018 on Great Lakes Symposium on VLSI, GLSVLSI 2018, Chicago, IL, USA, May 23-25, 2018, pp. 267-272, 2018, ACM. The full citation details ...](Pics/full.jpeg) |
2018 |
DBLP DOI BibTeX RDF |
|
18 | Xin Huang 0003, Valeriy Sukharev, Taeyoung Kim 0001, Sheldon X.-D. Tan |
Dynamic electromigration modeling for transient stress evolution and recovery under time-dependent current and temperature stressing. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Integr. ![In: Integr. 58, pp. 518-527, 2017. The full citation details ...](Pics/full.jpeg) |
2017 |
DBLP DOI BibTeX RDF |
|
18 | Palkesh Jain, Vivek Mishra, Sachin S. Sapatnekar |
Fast Stochastic Analysis of Electromigration in Power Distribution Networks. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Very Large Scale Integr. Syst. ![In: IEEE Trans. Very Large Scale Integr. Syst. 25(9), pp. 2512-2524, 2017. The full citation details ...](Pics/full.jpeg) |
2017 |
DBLP DOI BibTeX RDF |
|
18 | Shengcheng Wang, Mehdi Baradaran Tahoori |
Electromigration-Aware Local-Via Allocation in Power/Ground TSVs of 3-D ICs. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Very Large Scale Integr. Syst. ![In: IEEE Trans. Very Large Scale Integr. Syst. 25(10), pp. 2881-2892, 2017. The full citation details ...](Pics/full.jpeg) |
2017 |
DBLP DOI BibTeX RDF |
|
18 | Vivek Mishra, Sachin S. Sapatnekar |
Probabilistic Wire Resistance Degradation Due to Electromigration in Power Grids. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. ![In: IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 36(4), pp. 628-640, 2017. The full citation details ...](Pics/full.jpeg) |
2017 |
DBLP DOI BibTeX RDF |
|
18 | Junjie Gu, Haipeng Fu, Weicong Na, Qijun Zhang, Jianguo Ma |
Fast and Automated Electromigration Analysis for CMOS RF PA Design. ![Search on Bibsonomy](Pics/bibsonomy.png) |
J. Electron. Test. ![In: J. Electron. Test. 33(1), pp. 133-140, 2017. The full citation details ...](Pics/full.jpeg) |
2017 |
DBLP DOI BibTeX RDF |
|
18 | Rafael O. Nunes, R. L. de Orio |
Study of the impact of electromigration on integrated circuit performance and reliability at design level. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 76-77, pp. 75-80, 2017. The full citation details ...](Pics/full.jpeg) |
2017 |
DBLP DOI BibTeX RDF |
|
18 | Fengjiang Wang, Dongyang Li, Shuang Tian, Zhijie Zhang, Jiheng Wang, Chao Yan |
Interfacial behaviors of Sn-Pb, Sn-Ag-Cu Pb-free and mixed Sn-Ag-Cu/Sn-Pb solder joints during electromigration. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 73, pp. 106-115, 2017. The full citation details ...](Pics/full.jpeg) |
2017 |
DBLP DOI BibTeX RDF |
|
18 | Hyeonggeon Lee, Jong Kang Park, Jong Tae Kim |
A unified system level error model of crosstalk and electromigration for on-chip interconnect. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEICE Electron. Express ![In: IEICE Electron. Express 14(5), pp. 20161194, 2017. The full citation details ...](Pics/full.jpeg) |
2017 |
DBLP DOI BibTeX RDF |
|
18 | Ming Yan, Yici Cai, Chenguang Wang 0003, Qiang Zhou 0001 |
An Effective Power Grid Optimization Approach for the Electromigration Reliability. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ISVLSI ![In: 2017 IEEE Computer Society Annual Symposium on VLSI, ISVLSI 2017, Bochum, Germany, July 3-5, 2017, pp. 453-458, 2017, IEEE Computer Society, 978-1-5090-6762-6. The full citation details ...](Pics/full.jpeg) |
2017 |
DBLP DOI BibTeX RDF |
|
18 | Matthias Thiele, Steve Bigalke, Jens Lienig |
Exploring the use of the finite element method for electromigration analysis in future physical design. ![Search on Bibsonomy](Pics/bibsonomy.png) |
VLSI-SoC ![In: 2017 IFIP/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, Abu Dhabi, United Arab Emirates, October 23-25, 2017, pp. 1-6, 2017, IEEE, 978-1-5386-2880-5. The full citation details ...](Pics/full.jpeg) |
2017 |
DBLP DOI BibTeX RDF |
|
18 | Matthias Thiele, Steve Bigalke, Jens Lienig |
Electromigration Analysis of VLSI Circuits Using the Finite Element Method. ![Search on Bibsonomy](Pics/bibsonomy.png) |
VLSI-SoC (Selected Papers) ![In: VLSI-SoC: Opportunities and Challenges Beyond the Internet of Things - 25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, Abu Dhabi, United Arab Emirates, October 23-25, 2017, Revised and Extended Selected Papers, pp. 133-152, 2017, Springer, 978-3-030-15662-6. The full citation details ...](Pics/full.jpeg) |
2017 |
DBLP DOI BibTeX RDF |
|
18 | Xiaoyi Wang, Hongyu Wang, Jian He, Sheldon X.-D. Tan, Yici Cai, Shengqi Yang |
Physics-based electromigration modeling and assessment for multi-segment interconnects in power grid networks. ![Search on Bibsonomy](Pics/bibsonomy.png) |
DATE ![In: Design, Automation & Test in Europe Conference & Exhibition, DATE 2017, Lausanne, Switzerland, March 27-31, 2017, pp. 1727-1732, 2017, IEEE, 978-3-9815370-8-6. The full citation details ...](Pics/full.jpeg) |
2017 |
DBLP DOI BibTeX RDF |
|
18 | Sourav Das, Janardhan Rao Doppa, Partha Pratim Pande, Krishnendu Chakrabarty |
Robust TSV-based 3D NoC design to counteract electromigration and crosstalk noise. ![Search on Bibsonomy](Pics/bibsonomy.png) |
DATE ![In: Design, Automation & Test in Europe Conference & Exhibition, DATE 2017, Lausanne, Switzerland, March 27-31, 2017, pp. 1366-1371, 2017, IEEE, 978-3-9815370-8-6. The full citation details ...](Pics/full.jpeg) |
2017 |
DBLP DOI BibTeX RDF |
|
18 | Shengcheng Wang, Hengyang Zhao, Sheldon X.-D. Tan, Mehdi Baradaran Tahoori |
Recovery-aware proactive TSV repair for electromigration in 3D ICs. ![Search on Bibsonomy](Pics/bibsonomy.png) |
DATE ![In: Design, Automation & Test in Europe Conference & Exhibition, DATE 2017, Lausanne, Switzerland, March 27-31, 2017, pp. 220-225, 2017, IEEE, 978-3-9815370-8-6. The full citation details ...](Pics/full.jpeg) |
2017 |
DBLP DOI BibTeX RDF |
|
18 | Xiaoyi Wang, Yan Yan, Jian He, Sheldon X.-D. Tan, Chase Cook, Shengqi Yang |
Fast physics-based electromigration analysis for multi-branch interconnect trees. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICCAD ![In: 2017 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2017, Irvine, CA, USA, November 13-16, 2017, pp. 169-176, 2017, IEEE, 978-1-5386-3093-8. The full citation details ...](Pics/full.jpeg) |
2017 |
DBLP DOI BibTeX RDF |
|
18 | Shengcheng Wang, Zeyu Sun 0001, Yuan Cheng, Sheldon X.-D. Tan, Mehdi Baradaran Tahoori |
Leveraging recovery effect to reduce electromigration degradation in power/ground TSV. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICCAD ![In: 2017 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2017, Irvine, CA, USA, November 13-16, 2017, pp. 811-818, 2017, IEEE, 978-1-5386-3093-8. The full citation details ...](Pics/full.jpeg) |
2017 |
DBLP DOI BibTeX RDF |
|
18 | Sandeep Chatterjee, Valeriy Sukharev, Farid N. Najm |
Fast physics-based electromigration assessment by efficient solution of linear time-invariant (LTI) systems. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICCAD ![In: 2017 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2017, Irvine, CA, USA, November 13-16, 2017, pp. 659-666, 2017, IEEE, 978-1-5386-3093-8. The full citation details ...](Pics/full.jpeg) |
2017 |
DBLP DOI BibTeX RDF |
|
18 | Wei Ye 0008, Yibo Lin, Xiaoqing Xu, Wuxi Li, Yiwei Fu, Yongsheng Sun, Canhui Zhan, David Z. Pan |
Placement mitigation techniques for power grid electromigration. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ISLPED ![In: 2017 IEEE/ACM International Symposium on Low Power Electronics and Design, ISLPED 2017, Taipei, Taiwan, July 24-26, 2017, pp. 1-6, 2017, IEEE, 978-1-5090-6023-8. The full citation details ...](Pics/full.jpeg) |
2017 |
DBLP DOI BibTeX RDF |
|
18 | Vivek Mishra, Palkesh Jain, Sravan K. Marella, Sachin S. Sapatnekar |
Incorporating the Role of Stress on Electromigration in Power Grids with Via Arrays. ![Search on Bibsonomy](Pics/bibsonomy.png) |
DAC ![In: Proceedings of the 54th Annual Design Automation Conference, DAC 2017, Austin, TX, USA, June 18-22, 2017, pp. 21:1-21:6, 2017, ACM, 978-1-4503-4927-7. The full citation details ...](Pics/full.jpeg) |
2017 |
DBLP DOI BibTeX RDF |
|
18 | Taeyoung Kim 0001 |
System-Level Electromigration-Induced Dynamic Reliability Management. ![Search on Bibsonomy](Pics/bibsonomy.png) |
|
2017 |
RDF |
|
18 | Xin Huang 0003, Valeriy Sukharev, Jun-Ho Choy, Marko Chew, Taeyoung Kim 0001, Sheldon X.-D. Tan |
Electromigration assessment for power grid networks considering temperature and thermal stress effects. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Integr. ![In: Integr. 55, pp. 307-315, 2016. The full citation details ...](Pics/full.jpeg) |
2016 |
DBLP DOI BibTeX RDF |
|
18 | Yuanqing Cheng, Aida Todri-Sanial, Jianlei Yang 0001, Weisheng Zhao |
Alleviating Through-Silicon-Via Electromigration for 3-D Integrated Circuits Taking Advantage of Self-Healing Effect. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Very Large Scale Integr. Syst. ![In: IEEE Trans. Very Large Scale Integr. Syst. 24(11), pp. 3310-3322, 2016. The full citation details ...](Pics/full.jpeg) |
2016 |
DBLP DOI BibTeX RDF |
|
18 | Zhong Guan, Malgorzata Marek-Sadowska |
Incorporating Process Variations Into SRAM Electromigration Reliability Assessment Using Atomic Flux Divergence. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Very Large Scale Integr. Syst. ![In: IEEE Trans. Very Large Scale Integr. Syst. 24(6), pp. 2195-2207, 2016. The full citation details ...](Pics/full.jpeg) |
2016 |
DBLP DOI BibTeX RDF |
|
18 | Palkesh Jain, Jordi Cortadella, Sachin S. Sapatnekar |
A Fast and Retargetable Framework for Logic-IP-Internal Electromigration Assessment Comprehending Advanced Waveform Effects. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Very Large Scale Integr. Syst. ![In: IEEE Trans. Very Large Scale Integr. Syst. 24(6), pp. 2345-2358, 2016. The full citation details ...](Pics/full.jpeg) |
2016 |
DBLP DOI BibTeX RDF |
|
18 | Gracieli Posser, Vivek Mishra, Palkesh Jain, Ricardo Reis 0001, Sachin S. Sapatnekar |
Cell-Internal Electromigration: Analysis and Pin Placement Based Optimization. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. ![In: IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 35(2), pp. 220-231, 2016. The full citation details ...](Pics/full.jpeg) |
2016 |
DBLP DOI BibTeX RDF |
|
18 | Hai-Bao Chen, Sheldon X.-D. Tan, Xin Huang 0003, Taeyoung Kim 0001, Valeriy Sukharev |
Analytical Modeling and Characterization of Electromigration Effects for Multibranch Interconnect Trees. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. ![In: IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 35(11), pp. 1811-1824, 2016. The full citation details ...](Pics/full.jpeg) |
2016 |
DBLP DOI BibTeX RDF |
|
18 | Xin Huang 0003, Armen Kteyan, Sheldon X.-D. Tan, Valeriy Sukharev |
Physics-Based Electromigration Models and Full-Chip Assessment for Power Grid Networks. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. ![In: IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 35(11), pp. 1848-1861, 2016. The full citation details ...](Pics/full.jpeg) |
2016 |
DBLP DOI BibTeX RDF |
|
18 | Yuan Li, Hsin-Tzu Lee, Masumi Saka |
Influence of local thermal dissipation on electromigration in an Al thin-film line. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 65, pp. 178-183, 2016. The full citation details ...](Pics/full.jpeg) |
2016 |
DBLP DOI BibTeX RDF |
|
18 | Shengcheng Wang, Mehdi Baradaran Tahoori, Krishnendu Chakrabarty |
Thermal-aware TSV repair for electromigration in 3D ICs. ![Search on Bibsonomy](Pics/bibsonomy.png) |
DATE ![In: 2016 Design, Automation & Test in Europe Conference & Exhibition, DATE 2016, Dresden, Germany, March 14-18, 2016, pp. 1291-1296, 2016, IEEE, 978-3-9815-3707-9. The full citation details ...](Pics/full.jpeg) |
2016 |
DBLP BibTeX RDF |
|
18 | Xin Huang 0003, Valeriy Sukharev, Taeyoung Kim 0001, Hai-Bao Chen, Sheldon X.-D. Tan |
Electromigration recovery modeling and analysis under time-dependent current and temperature stressing. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ASP-DAC ![In: 21st Asia and South Pacific Design Automation Conference, ASP-DAC 2016, Macao, Macao, January 25-28, 2016, pp. 244-249, 2016, IEEE, 978-1-4673-9569-4. The full citation details ...](Pics/full.jpeg) |
2016 |
DBLP DOI BibTeX RDF |
|
18 | Steve Bigalke, Jens Lienig |
Load-Aware Redundant Via Insertion for Electromigration Avoidance. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ISPD ![In: Proceedings of the 2016 on International Symposium on Physical Design, ISPD 2016, Santa Rosa, CA, USA, April 3-6, 2016, pp. 99-106, 2016, ACM, 978-1-4503-4039-7. The full citation details ...](Pics/full.jpeg) |
2016 |
DBLP DOI BibTeX RDF |
|
18 | Chase Cook, Zeyu Sun 0001, Taeyoung Kim 0001, Sheldon X.-D. Tan |
Finite difference method for electromigration analysis of multi-branch interconnects. ![Search on Bibsonomy](Pics/bibsonomy.png) |
SMACD ![In: 13th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design, SMACD 2016, Lisbon, Portugal, June 27-30, 2016, pp. 1-4, 2016, IEEE, 978-1-5090-0490-4. The full citation details ...](Pics/full.jpeg) |
2016 |
DBLP DOI BibTeX RDF |
|
18 | Sandeep Chatterjee, Valeriy Sukharev, Farid N. Najm |
Fast physics-based electromigration checking for on-die power grids. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICCAD ![In: Proceedings of the 35th International Conference on Computer-Aided Design, ICCAD 2016, Austin, TX, USA, November 7-10, 2016, pp. 110, 2016, ACM, 978-1-4503-4466-1. The full citation details ...](Pics/full.jpeg) |
2016 |
DBLP DOI BibTeX RDF |
|
18 | Zeyu Sun 0001, Ertugrul Demircan, Mehul D. Shroff, Taeyoung Kim 0001, Xin Huang 0003, Sheldon X.-D. Tan |
Voltage-based electromigration immortality check for general multi-branch interconnects. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICCAD ![In: Proceedings of the 35th International Conference on Computer-Aided Design, ICCAD 2016, Austin, TX, USA, November 7-10, 2016, pp. 113, 2016, ACM, 978-1-4503-4466-1. The full citation details ...](Pics/full.jpeg) |
2016 |
DBLP DOI BibTeX RDF |
|
18 | Lucas de Paris, Gracieli Posser, Ricardo Reis 0001 |
Electromigration aware circuits by using special signal non-default routing rules. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ISCAS ![In: IEEE International Symposium on Circuits and Systems, ISCAS 2016, Montréal, QC, Canada, May 22-25, 2016, pp. 2795-2798, 2016, IEEE, 978-1-4799-5341-7. The full citation details ...](Pics/full.jpeg) |
2016 |
DBLP DOI BibTeX RDF |
|
18 | Tiantao Lu, Zhiyuan Yang 0001, Ankur Srivastava 0001 |
Electromigration-aware placement for 3D-ICs. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ISQED ![In: 17th International Symposium on Quality Electronic Design, ISQED 2016, Santa Clara, CA, USA, March 15-16, 2016, pp. 35-40, 2016, IEEE, 978-1-5090-1213-8. The full citation details ...](Pics/full.jpeg) |
2016 |
DBLP DOI BibTeX RDF |
|
18 | Taeyoung Kim 0001, Zeyu Sun 0001, Chase Cook, Hengyang Zhao, Ruiwen Li, Daniel Wong 0001, Sheldon X.-D. Tan |
Invited - Cross-layer modeling and optimization for electromigration induced reliability. ![Search on Bibsonomy](Pics/bibsonomy.png) |
DAC ![In: Proceedings of the 53rd Annual Design Automation Conference, DAC 2016, Austin, TX, USA, June 5-9, 2016, pp. 30:1-30:6, 2016, ACM, 978-1-4503-4236-0. The full citation details ...](Pics/full.jpeg) |
2016 |
DBLP DOI BibTeX RDF |
|
18 | Vivek Mishra, Sachin S. Sapatnekar |
Predicting electromigration mortality under temperature and product lifetime specifications. ![Search on Bibsonomy](Pics/bibsonomy.png) |
DAC ![In: Proceedings of the 53rd Annual Design Automation Conference, DAC 2016, Austin, TX, USA, June 5-9, 2016, pp. 43:1-43:6, 2016, ACM, 978-1-4503-4236-0. The full citation details ...](Pics/full.jpeg) |
2016 |
DBLP DOI BibTeX RDF |
|
18 | Siyuan Frank Yang, Wei-Ting Kary Chien |
Electromigration Lifetime Optimization by Uniform Designs and a New Lifetime Index. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Reliab. ![In: IEEE Trans. Reliab. 64(4), pp. 1158-1163, 2015. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
18 | Di-An Li, Malgorzata Marek-Sadowska, Sani R. Nassif |
A Method for Improving Power Grid Resilience to Electromigration-Caused via Failures. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Very Large Scale Integr. Syst. ![In: IEEE Trans. Very Large Scale Integr. Syst. 23(1), pp. 118-130, 2015. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
18 | Di-An Li, Malgorzata Marek-Sadowska, Sani R. Nassif |
T-VEMA: A Temperature- and Variation-Aware Electromigration Power Grid Analysis Tool. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Very Large Scale Integr. Syst. ![In: IEEE Trans. Very Large Scale Integr. Syst. 23(10), pp. 2327-2331, 2015. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
18 | Sandeep Chatterjee, Mohammad Fawaz, Farid N. Najm |
Redundancy-Aware Power Grid Electromigration Checking Under Workload Uncertainties. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. ![In: IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 34(9), pp. 1509-1522, 2015. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
18 | James C. E. Mertens, Antony Kirubanandham, Nikhilesh Chawla |
In situ fixture for multi-modal characterization during electromigration and thermal testing of wire-like microscale specimens. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 55(11), pp. 2345-2353, 2015. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
18 | Takuya Kadoguchi, Keisuke Gotou, Kimihiro Yamanaka, Shijo Nagao, Katsuaki Suganuma |
Electromigration behavior in Cu/Ni-P/Sn-Cu based joint system with low current density. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 55(12), pp. 2554-2559, 2015. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
18 | Simon Gousseau, Stéphane Moreau, David Bouchu, Alexis Farcy, Pierre Montmitonnet, Karim Inal, François Bay, Marc Zelsmann, Emmanuel Picard, Mathieu Salaün |
Electromigration-induced failure in operando characterization of 3D interconnects: microstructure influence. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 55(8), pp. 1205-1213, 2015. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|