Search results for "electromigration"

Hits ?▲	Authors	Title	Venue	Year	Link
18	Sheldon X.-D. Tan, Zeyu Sun 0001, Sheriff Sadiqbatcha	Interconnect Electromigration Modeling and Analysis for Nanometer ICs: From Physics to Full-Chip.	IPSJ Trans. Syst. LSI Des. Methodol.	2020	DBLP DOI BibTeX RDF
18	Steve Bigalke, Jens Lienig	Avoidance vs. repair: New approaches to increasing electromigration robustness in VLSI routing.	Integr.	2020	DBLP DOI BibTeX RDF
18	Liang Chen 0025, Sheldon X.-D. Tan, Zeyu Sun 0001, Shaoyi Peng, Min Tang, Junfa Mao	Fast Analytic Electromigration Analysis for General Multisegment Interconnect Wires.	IEEE Trans. Very Large Scale Integr. Syst.	2020	DBLP DOI BibTeX RDF
18	Sheriff Sadiqbatcha, Zeyu Sun 0001, Sheldon X.-D. Tan	Accelerating Electromigration Aging: Fast Failure Detection for Nanometer ICs.	IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.	2020	DBLP DOI BibTeX RDF
18	Sukanta Dey, Sukumar Nandi, Gaurav Trivedi	Machine Learning Approach for Fast Electromigration Aware Aging Prediction in Incremental Design of Large Scale On-chip Power Grid Network.	ACM Trans. Design Autom. Electr. Syst.	2020	DBLP DOI BibTeX RDF
18	Freddy Gabbay, Avi Mendelson, Yinnon Stav	Electromigration-Aware Architecture for Modern Microprocessors.	CoRR	2020	DBLP BibTeX RDF
18	Sarath Mohanachandran Nair, Rajendra Bishnoi, Mehdi B. Tahoori, Houman Zahedmanesh, Kristof Croes, Kevin Garello, Gouri Sankar Kar, Francky Catthoor	Physics based modeling of bimodal electromigration failure distributions and variation analysis for VLSI interconnects.	IRPS	2020	DBLP DOI BibTeX RDF
18	Yi Ram Kim, Allison T. Osmanson, Hossein Madanipour, Choong-Un Kim, Patrick F. Thompson, Qiao Chen	Effects of UBM Thickness and Current Flow Configuration on Electromigration Failure Mechanisms in Solder Interconnects.	IRPS	2020	DBLP DOI BibTeX RDF
18	Shaobin Ma, Xiaoyi Wang, Sheldon X.-D. Tan, Liang Chen 0025, Jian He	An Adaptive Electromigration Assessment Algorithm for Full-chip Power/Ground Networks.	ASP-DAC	2020	DBLP DOI BibTeX RDF
18	Adam Issa, Valeriy Sukharev, Farid N. Najm	Electromigration Checking Using a Stochastic Effective Current Model.	ICCAD	2020	DBLP DOI BibTeX RDF
18	Mohammadamir Kavousi, Liang Chen 0025, Sheldon X.-D. Tan	Electromigration Immortality Check considering Joule Heating Effect for Multisegment Wires.	ICCAD	2020	DBLP DOI BibTeX RDF
18	Makoto Yabuuchi, Masao Morimoto, Yasumasa Tsukamoto, Shinji Tanaka	A 7nm Fin-FET 4.04-Mb/mm2 TCAM with Improved Electromigration Reliability Using Far-Side Driving Scheme and Self-Adjust Reference Match-Line Amplifier.	VLSI Circuits	2020	DBLP DOI BibTeX RDF
18	Francis G. Wolff, Daniel J. Weyer, Christos A. Papachristou, Steve Clay	Design Space Exploration Driven by Lifetime Concerns due to Electromigration.	ISQED	2020	DBLP DOI BibTeX RDF
18	Akanksha Jat, Shweta Panwalkar, Shweta Meena	Electromigration and Power Analysis of Digital Circuits at 10 nm Technology Node Before Signoff.	ICCCNT	2020	DBLP DOI BibTeX RDF
18	Chase Cook, Sheriff Sadiqbatcha, Zeyu Sun 0001, Sheldon X.-D. Tan	Reliability based hardware Trojan design using physics-based electromigration models.	Integr.	2019	DBLP DOI BibTeX RDF
18	J. M. Passage, Nabihah Azhari, J. R. Lloyd	Stress Migration Followed by Electromigration Reliability Testing.	IRPS	2019	DBLP DOI BibTeX RDF
18	Sarath Mohanachandran Nair, Rajendra Bishnoi, Mehdi Baradaran Tahoori, Houman Zahedmanesh, Kristof Croes, Kevin Garello, Gouri Sankar Kar, Francky Catthoor	Variation-Aware Physics-Based Electromigration Modeling and Experimental Calibration for VLSI Interconnects.	IRPS	2019	DBLP DOI BibTeX RDF
18	Young-Joon Park, Jungwoo Joh, Jayhoon Chung, Srikanth Krishnan	Current Crowding Impact on Electromigration in Al Interconnects.	IRPS	2019	DBLP DOI BibTeX RDF
18	Shinji Yokogawa, Kyosuke Kunii	A Simple Prediction Method for Chip-Level Electromigration Lifetime Using Generalized Gamma Distribution.	IRPS	2019	DBLP DOI BibTeX RDF
18	Sofie Beyne, Olalla Varela Pedreira, Ingrid De Wolf, Zsolt Tökei, Kristof Croes	Low-Frequency Noise Measurements to Characterize Cu-Electromigration Down to 44nm Metal Pitch.	IRPS	2019	DBLP DOI BibTeX RDF
18	Farid N. Najm, Valeriy Sukharev	Efficient Simulation of Electromigration Damage in Large Chip Power Grids Using Accurate Physical Models (Invited Paper).	IRPS	2019	DBLP DOI BibTeX RDF
18	Hideaki Tsuchiya, Naohito Suzumura, Ryuji Shibata, Hideki Aono, Makoto Ogasawara, Toshihiko Akiba, Kenji Sakata, Kazuyuki Nakagawa, Takuo Funaya	Electromigration Early Failures for Cu Pillar Interconnections with an ENEPIG Pad Finish and its Suppression.	IRPS	2019	DBLP DOI BibTeX RDF
18	Wei Ye 0008, Mohamed Baker Alawieh, Yibo Lin, David Z. Pan	Tackling signal electromigration with learning-based detection and multistage mitigation.	ASP-DAC	2019	DBLP DOI BibTeX RDF
18	Sachin S. Sapatnekar	Electromigration-Aware Interconnect Design.	ISPD	2019	DBLP DOI BibTeX RDF
18	Zahi Moudallal, Valeriy Sukharev, Farid N. Najm	Power Grid Fixing for Electromigration-induced Voltage Failures.	ICCAD	2019	DBLP DOI BibTeX RDF
18	Jing Wang, Yici Cai, Ming Yan, Qiang Zhou 0001	Composite Optimization for Electromigration Reliability and Noise in Power Grid Networks.	ISCAS	2019	DBLP DOI BibTeX RDF
18	Ali Abbasinasab, Malgorzata Marek-Sadowska	Non-Uniform Temperature Distribution in Interconnects and Its Impact on Electromigration.	ACM Great Lakes Symposium on VLSI	2019	DBLP DOI BibTeX RDF
18	Mohammad Torabi, Lihong Zhang	Electromigration- and Parasitic-Aware ILP-Based Analog Router.	IEEE Trans. Very Large Scale Integr. Syst.	2018	DBLP DOI BibTeX RDF
18	Shengcheng Wang, Taeyoung Kim 0001, Zeyu Sun 0001, Sheldon X.-D. Tan, Mehdi Baradaran Tahoori	Recovery-Aware Proactive TSV Repair for Electromigration Lifetime Enhancement in 3-D ICs.	IEEE Trans. Very Large Scale Integr. Syst.	2018	DBLP DOI BibTeX RDF
18	Chase Cook, Zeyu Sun 0001, Ertugrul Demircan, Mehul D. Shroff, Sheldon X.-D. Tan	Fast Electromigration Stress Evolution Analysis for Interconnect Trees Using Krylov Subspace Method.	IEEE Trans. Very Large Scale Integr. Syst.	2018	DBLP DOI BibTeX RDF
18	Hengyang Zhao, Sheldon X.-D. Tan	Postvoiding FEM Analysis for Electromigration Failure Characterization.	IEEE Trans. Very Large Scale Integr. Syst.	2018	DBLP DOI BibTeX RDF
18	Zeyu Sun 0001, Ertugrul Demircan, Mehul D. Shroff, Chase Cook, Sheldon X.-D. Tan	Fast Electromigration Immortality Analysis for Multisegment Copper Interconnect Wires.	IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.	2018	DBLP DOI BibTeX RDF
18	Sandeep Chatterjee, Valeriy Sukharev, Farid N. Najm	Power Grid Electromigration Checking Using Physics-Based Models.	IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.	2018	DBLP DOI BibTeX RDF
18	Yu Tian, Jing Han, Limin Ma, Fu Guo	The dominant effect of c-axis orientation in tin on the electromigration behaviors in tricrystal Sn-3.0Ag-0.5Cu solder joints.	Microelectron. Reliab.	2018	DBLP DOI BibTeX RDF
18	Sukanta Dey, Satyabrata Dash, Sukumar Nandi, Gaurav Trivedi	PGIREM: Reliability-Constrained IR Drop Minimization and Electromigration Assessment of VLSI Power Grid Networks Using Cooperative Coevolution.	ISVLSI	2018	DBLP DOI BibTeX RDF
18	Steve Bigalke, Jens Lienig	FLUTE-EM: Electromigration-Optimized Net Considering Topology Currents and Mechanical Stress.	VLSI-SoC	2018	DBLP DOI BibTeX RDF
18	Chao-Kun Hu, James J. Kelly, Huai Huang, Koichi Motoyama, Hosadurga Shobha, Yuri Ostrovski, James H.-C. Chen, Raghuveer Patlolla, Brown Peethala, Praneet Adusumilli, Terry A. Spooner, Roger Quon, Lynne M. Gignac, Chris M. Breslin, G. Lian, M. Ali, Jacob Benedict, X. S. Lin, S. Smith, Vimal Kamineni, X. Zhang, Frank Wilhelm Mont, Shariq Siddiqui, Frieder H. Baumann	Future on-chip interconnect metallization and electromigration.	IRPS	2018	DBLP DOI BibTeX RDF
18	Seungman Choi, Cathryn Christiansen, Linjun Cao, James Zhang, Ronald Filippi, Tian Shen, Kong Boon Yeap, Sean P. Ogden, Haojun Zhang, Bianzhu Fu, Patrick Justison	Effect of metal line width on electromigration of BEOL Cu interconnects.	IRPS	2018	DBLP DOI BibTeX RDF
18	Baozhen Li, Andrew Kim, Paul McLaughlin, Barry P. Linder, Cathryn Christiansen	Electromigration characteristics of power grid like structures.	IRPS	2018	DBLP DOI BibTeX RDF
18	Christine S. Hau-Riege, Huilin Xu, You-Wen Yau, Manasi S. Kakade, Jianfeng Li, Xiaonan Zhang, Hosain Farr	Electromigration of multi-solder ball test structures.	IRPS	2018	DBLP DOI BibTeX RDF
18	M. Kraatz, Christoph Sander, André Clausner, M. Hauschildt, Yvonne Standke, Martin Gall, Ehrenfried Zschech	Analysis of electromigration-induced backflow stresses in Cu(Mn) interconnects using high statistical sampling.	IRPS	2018	DBLP DOI BibTeX RDF
18	Sofie Beyne, Shibesh Dutta, Olalla Varela Pedreira, Niels Bosman, Christoph Adelmann, Ingrid De Wolf, Zsolt Tökei, Kristof Croes	The first observation of p-type electromigration failure in full ruthenium interconnects.	IRPS	2018	DBLP DOI BibTeX RDF
18	Jae-Gyung Ahn, Ping-Chin Yeh, Jonathan Chang	Electromigration failure rate of redundant via.	IRPS	2018	DBLP DOI BibTeX RDF
18	Norman Chang, Ajay Baranwal, Hao Zhuang, Ming-Chih Shih, Rahul Rajan, Yaowei Jia, Hui-Lun Liao, Ying-Shiun Li, Ting Ku, Rex Lin	Machine learning based generic violation waiver system with application on electromigration sign-off.	ASP-DAC	2018	DBLP DOI BibTeX RDF
18	Han Zhou 0002, Yijing Sun, Zeyu Sun 0001, Hengyang Zhao, Sheldon X.-D. Tan	Electromigration-lifetime constrained power grid optimization considering multi-segment interconnect wires.	ASP-DAC	2018	DBLP DOI BibTeX RDF
18	Zeyu Sun 0001, Sheriff Sadiqbatcha, Hengyang Zhao, Sheldon X.-D. Tan	Accelerating electromigration aging for fast failure detection for nanometer ICs.	ASP-DAC	2018	DBLP DOI BibTeX RDF
18	Rafael O. Nunes, R. L. de Orio	Operational Amplifier Performance Degradation and Time-to-Failure due to Electromigration.	SBCCI	2018	DBLP DOI BibTeX RDF
18	Lucas de Paris, Ricardo Reis 0001	An automated methodology to fix electromigration violations on a customized design flow.	LASCAS	2018	DBLP DOI BibTeX RDF
18	Jens Lienig, Matthias Thiele	The Pressing Need for Electromigration-Aware Physical Design.	ISPD	2018	DBLP DOI BibTeX RDF
18	Sheriff Sadiqbatcha, Chase Cook, Zeyu Sun 0001, Sheldon X.-D. Tan	Accelerating Electromigration Wear-Out Effects Based on Configurable Sink-Structured Wires.	SMACD	2018	DBLP DOI BibTeX RDF
18	Chase Cook, Sheriff Sadiqbatcha, Zeyu Sun 0001, Sheldon X.-D. Tan	Reliability Based Hardware Trojan Design Using Physics-Based Electromigration Models.	SMACD	2018	DBLP DOI BibTeX RDF
18	Hengyang Zhao, Sheldon X.-D. Tan	Multi-physics-based FEM analysis for post-voiding analysis of electromigration failure effects.	ICCAD	2018	DBLP DOI BibTeX RDF
18	Steve Bigalke, Jens Lienig, Göran Jerke, Jürgen Scheible, Roland Jancke	The need and opportunities of electromigration-aware integrated circuit design.	ICCAD	2018	DBLP DOI BibTeX RDF
18	Mohammad Torabi, Lihong Zhang	Electromigration and Parasitic-Aware ILP Router for Analog and RF Circuits.	ISCAS	2018	DBLP DOI BibTeX RDF
18	Xiaotao Jia, Jing Wang, Yici Cai, Qiang Zhou 0001	Electromigration Design Rule aware Global and Detailed Routing Algorithm.	ACM Great Lakes Symposium on VLSI	2018	DBLP DOI BibTeX RDF
18	Xin Huang 0003, Valeriy Sukharev, Taeyoung Kim 0001, Sheldon X.-D. Tan	Dynamic electromigration modeling for transient stress evolution and recovery under time-dependent current and temperature stressing.	Integr.	2017	DBLP DOI BibTeX RDF
18	Palkesh Jain, Vivek Mishra, Sachin S. Sapatnekar	Fast Stochastic Analysis of Electromigration in Power Distribution Networks.	IEEE Trans. Very Large Scale Integr. Syst.	2017	DBLP DOI BibTeX RDF
18	Shengcheng Wang, Mehdi Baradaran Tahoori	Electromigration-Aware Local-Via Allocation in Power/Ground TSVs of 3-D ICs.	IEEE Trans. Very Large Scale Integr. Syst.	2017	DBLP DOI BibTeX RDF
18	Vivek Mishra, Sachin S. Sapatnekar	Probabilistic Wire Resistance Degradation Due to Electromigration in Power Grids.	IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.	2017	DBLP DOI BibTeX RDF
18	Junjie Gu, Haipeng Fu, Weicong Na, Qijun Zhang, Jianguo Ma	Fast and Automated Electromigration Analysis for CMOS RF PA Design.	J. Electron. Test.	2017	DBLP DOI BibTeX RDF
18	Rafael O. Nunes, R. L. de Orio	Study of the impact of electromigration on integrated circuit performance and reliability at design level.	Microelectron. Reliab.	2017	DBLP DOI BibTeX RDF
18	Fengjiang Wang, Dongyang Li, Shuang Tian, Zhijie Zhang, Jiheng Wang, Chao Yan	Interfacial behaviors of Sn-Pb, Sn-Ag-Cu Pb-free and mixed Sn-Ag-Cu/Sn-Pb solder joints during electromigration.	Microelectron. Reliab.	2017	DBLP DOI BibTeX RDF
18	Hyeonggeon Lee, Jong Kang Park, Jong Tae Kim	A unified system level error model of crosstalk and electromigration for on-chip interconnect.	IEICE Electron. Express	2017	DBLP DOI BibTeX RDF
18	Ming Yan, Yici Cai, Chenguang Wang 0003, Qiang Zhou 0001	An Effective Power Grid Optimization Approach for the Electromigration Reliability.	ISVLSI	2017	DBLP DOI BibTeX RDF
18	Matthias Thiele, Steve Bigalke, Jens Lienig	Exploring the use of the finite element method for electromigration analysis in future physical design.	VLSI-SoC	2017	DBLP DOI BibTeX RDF
18	Matthias Thiele, Steve Bigalke, Jens Lienig	Electromigration Analysis of VLSI Circuits Using the Finite Element Method.	VLSI-SoC (Selected Papers)	2017	DBLP DOI BibTeX RDF
18	Xiaoyi Wang, Hongyu Wang, Jian He, Sheldon X.-D. Tan, Yici Cai, Shengqi Yang	Physics-based electromigration modeling and assessment for multi-segment interconnects in power grid networks.	DATE	2017	DBLP DOI BibTeX RDF
18	Sourav Das, Janardhan Rao Doppa, Partha Pratim Pande, Krishnendu Chakrabarty	Robust TSV-based 3D NoC design to counteract electromigration and crosstalk noise.	DATE	2017	DBLP DOI BibTeX RDF
18	Shengcheng Wang, Hengyang Zhao, Sheldon X.-D. Tan, Mehdi Baradaran Tahoori	Recovery-aware proactive TSV repair for electromigration in 3D ICs.	DATE	2017	DBLP DOI BibTeX RDF
18	Xiaoyi Wang, Yan Yan, Jian He, Sheldon X.-D. Tan, Chase Cook, Shengqi Yang	Fast physics-based electromigration analysis for multi-branch interconnect trees.	ICCAD	2017	DBLP DOI BibTeX RDF
18	Shengcheng Wang, Zeyu Sun 0001, Yuan Cheng, Sheldon X.-D. Tan, Mehdi Baradaran Tahoori	Leveraging recovery effect to reduce electromigration degradation in power/ground TSV.	ICCAD	2017	DBLP DOI BibTeX RDF
18	Sandeep Chatterjee, Valeriy Sukharev, Farid N. Najm	Fast physics-based electromigration assessment by efficient solution of linear time-invariant (LTI) systems.	ICCAD	2017	DBLP DOI BibTeX RDF
18	Wei Ye 0008, Yibo Lin, Xiaoqing Xu, Wuxi Li, Yiwei Fu, Yongsheng Sun, Canhui Zhan, David Z. Pan	Placement mitigation techniques for power grid electromigration.	ISLPED	2017	DBLP DOI BibTeX RDF
18	Vivek Mishra, Palkesh Jain, Sravan K. Marella, Sachin S. Sapatnekar	Incorporating the Role of Stress on Electromigration in Power Grids with Via Arrays.	DAC	2017	DBLP DOI BibTeX RDF
18	Taeyoung Kim 0001	System-Level Electromigration-Induced Dynamic Reliability Management.		2017	RDF
18	Xin Huang 0003, Valeriy Sukharev, Jun-Ho Choy, Marko Chew, Taeyoung Kim 0001, Sheldon X.-D. Tan	Electromigration assessment for power grid networks considering temperature and thermal stress effects.	Integr.	2016	DBLP DOI BibTeX RDF
18	Yuanqing Cheng, Aida Todri-Sanial, Jianlei Yang 0001, Weisheng Zhao	Alleviating Through-Silicon-Via Electromigration for 3-D Integrated Circuits Taking Advantage of Self-Healing Effect.	IEEE Trans. Very Large Scale Integr. Syst.	2016	DBLP DOI BibTeX RDF
18	Zhong Guan, Malgorzata Marek-Sadowska	Incorporating Process Variations Into SRAM Electromigration Reliability Assessment Using Atomic Flux Divergence.	IEEE Trans. Very Large Scale Integr. Syst.	2016	DBLP DOI BibTeX RDF
18	Palkesh Jain, Jordi Cortadella, Sachin S. Sapatnekar	A Fast and Retargetable Framework for Logic-IP-Internal Electromigration Assessment Comprehending Advanced Waveform Effects.	IEEE Trans. Very Large Scale Integr. Syst.	2016	DBLP DOI BibTeX RDF
18	Gracieli Posser, Vivek Mishra, Palkesh Jain, Ricardo Reis 0001, Sachin S. Sapatnekar	Cell-Internal Electromigration: Analysis and Pin Placement Based Optimization.	IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.	2016	DBLP DOI BibTeX RDF
18	Hai-Bao Chen, Sheldon X.-D. Tan, Xin Huang 0003, Taeyoung Kim 0001, Valeriy Sukharev	Analytical Modeling and Characterization of Electromigration Effects for Multibranch Interconnect Trees.	IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.	2016	DBLP DOI BibTeX RDF
18	Xin Huang 0003, Armen Kteyan, Sheldon X.-D. Tan, Valeriy Sukharev	Physics-Based Electromigration Models and Full-Chip Assessment for Power Grid Networks.	IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.	2016	DBLP DOI BibTeX RDF
18	Yuan Li, Hsin-Tzu Lee, Masumi Saka	Influence of local thermal dissipation on electromigration in an Al thin-film line.	Microelectron. Reliab.	2016	DBLP DOI BibTeX RDF
18	Shengcheng Wang, Mehdi Baradaran Tahoori, Krishnendu Chakrabarty	Thermal-aware TSV repair for electromigration in 3D ICs.	DATE	2016	DBLP BibTeX RDF
18	Xin Huang 0003, Valeriy Sukharev, Taeyoung Kim 0001, Hai-Bao Chen, Sheldon X.-D. Tan	Electromigration recovery modeling and analysis under time-dependent current and temperature stressing.	ASP-DAC	2016	DBLP DOI BibTeX RDF
18	Steve Bigalke, Jens Lienig	Load-Aware Redundant Via Insertion for Electromigration Avoidance.	ISPD	2016	DBLP DOI BibTeX RDF
18	Chase Cook, Zeyu Sun 0001, Taeyoung Kim 0001, Sheldon X.-D. Tan	Finite difference method for electromigration analysis of multi-branch interconnects.	SMACD	2016	DBLP DOI BibTeX RDF
18	Sandeep Chatterjee, Valeriy Sukharev, Farid N. Najm	Fast physics-based electromigration checking for on-die power grids.	ICCAD	2016	DBLP DOI BibTeX RDF
18	Zeyu Sun 0001, Ertugrul Demircan, Mehul D. Shroff, Taeyoung Kim 0001, Xin Huang 0003, Sheldon X.-D. Tan	Voltage-based electromigration immortality check for general multi-branch interconnects.	ICCAD	2016	DBLP DOI BibTeX RDF
18	Lucas de Paris, Gracieli Posser, Ricardo Reis 0001	Electromigration aware circuits by using special signal non-default routing rules.	ISCAS	2016	DBLP DOI BibTeX RDF
18	Tiantao Lu, Zhiyuan Yang 0001, Ankur Srivastava 0001	Electromigration-aware placement for 3D-ICs.	ISQED	2016	DBLP DOI BibTeX RDF
18	Taeyoung Kim 0001, Zeyu Sun 0001, Chase Cook, Hengyang Zhao, Ruiwen Li, Daniel Wong 0001, Sheldon X.-D. Tan	Invited - Cross-layer modeling and optimization for electromigration induced reliability.	DAC	2016	DBLP DOI BibTeX RDF
18	Vivek Mishra, Sachin S. Sapatnekar	Predicting electromigration mortality under temperature and product lifetime specifications.	DAC	2016	DBLP DOI BibTeX RDF
18	Siyuan Frank Yang, Wei-Ting Kary Chien	Electromigration Lifetime Optimization by Uniform Designs and a New Lifetime Index.	IEEE Trans. Reliab.	2015	DBLP DOI BibTeX RDF
18	Di-An Li, Malgorzata Marek-Sadowska, Sani R. Nassif	A Method for Improving Power Grid Resilience to Electromigration-Caused via Failures.	IEEE Trans. Very Large Scale Integr. Syst.	2015	DBLP DOI BibTeX RDF
18	Di-An Li, Malgorzata Marek-Sadowska, Sani R. Nassif	T-VEMA: A Temperature- and Variation-Aware Electromigration Power Grid Analysis Tool.	IEEE Trans. Very Large Scale Integr. Syst.	2015	DBLP DOI BibTeX RDF
18	Sandeep Chatterjee, Mohammad Fawaz, Farid N. Najm	Redundancy-Aware Power Grid Electromigration Checking Under Workload Uncertainties.	IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.	2015	DBLP DOI BibTeX RDF
18	James C. E. Mertens, Antony Kirubanandham, Nikhilesh Chawla	In situ fixture for multi-modal characterization during electromigration and thermal testing of wire-like microscale specimens.	Microelectron. Reliab.	2015	DBLP DOI BibTeX RDF
18	Takuya Kadoguchi, Keisuke Gotou, Kimihiro Yamanaka, Shijo Nagao, Katsuaki Suganuma	Electromigration behavior in Cu/Ni-P/Sn-Cu based joint system with low current density.	Microelectron. Reliab.	2015	DBLP DOI BibTeX RDF
18	Simon Gousseau, Stéphane Moreau, David Bouchu, Alexis Farcy, Pierre Montmitonnet, Karim Inal, François Bay, Marc Zelsmann, Emmanuel Picard, Mathieu Salaün	Electromigration-induced failure in operando characterization of 3D interconnects: microstructure influence.	Microelectron. Reliab.	2015	DBLP DOI BibTeX RDF