Search results for "bump"

Hits ?▲	Authors	Title	Venue	Year	Link
19	Hanqing Guan, Kai Feng, Ke Yu, Dongling Sun, Yuanlong Cao	Real-Time Control of Rotor Vibrations With Active Bump-Type Foil Bearings.	IEEE Trans. Ind. Electron.	2021	DBLP DOI BibTeX RDF
19	Jakob Schober, Constanze Eulenkamp, Karl Nicolaus, Gregor Feiertag	Reliability Study of Miniaturized Surface Acoustic Wave RF-Filters With Copper Pillar Bump Interconnections.	IEEE Access	2021	DBLP DOI BibTeX RDF
19	Brett Geiger, Kathryn R. Hedrick	Integration of Additive Self-Motion Inputs in a General Bump Attractor Model.	SIAM J. Appl. Dyn. Syst.	2021	DBLP DOI BibTeX RDF
19	Yunrui Han, Ying Zhao 0010, Peng Wang 0046	Finite-time rate anti-bump switching control for switched systems.	Appl. Math. Comput.	2021	DBLP DOI BibTeX RDF
19	Mitsuhito Ando, Ryusuke Tokumine, Toshinobu Takei, Hiromi Mochiyama	Tactile Scanning for Detecting Micro Bump by Strain-Sensitive Artificial Skin.	IEEE Robotics Autom. Lett.	2021	DBLP DOI BibTeX RDF
19	Blaz Bortolato, Barry M. Dillon, Jernej F. Kamenik, Aleks Smolkovic	Bump Hunting in Latent Space.	CoRR	2021	DBLP BibTeX RDF
19	Yoshihiko Horio, Takemori Orima, Koji Kiyoyama, Mitsumasa Koyanagi	Implementation of a Chaotic Neural Network Reservoir on a TSV/$\mu\text{Bump}$ Stacked 3D Cyclic Neural Network Integrated Circuit.	3DIC	2021	DBLP DOI BibTeX RDF
19	Bing Wang, Hemant Kumar Singh, Tapabrata Ray	Bridging kriging believer and expected improvement using bump hunting for expensive black-box optimization.	GECCO Companion	2021	DBLP DOI BibTeX RDF
19	Shujun Wang, Jiang Liu, Zhenyang Liu, Pengcheng Li, Yihang Ran	Research on Multi-peaks Non-fuzzy Tracking Algorithm of BOC Signal Based on Improved Bump-jumping Method.	ICDSP	2021	DBLP DOI BibTeX RDF
19	Vassilis Alimisis, Marios Gourdouparis, Christos Dimas, Paul P. Sotiriadis	Ultra-Low Power, Low-Voltage, Fully-Tunable, Bulk-Controlled Bump Circuit.	MOCAST	2021	DBLP DOI BibTeX RDF
19	Christian Robert Huyck, Alberto Arturo Vergani	Hot coffee: associative memory with bump attractor cell assemblies of spiking neurons.	J. Comput. Neurosci.	2020	DBLP DOI BibTeX RDF
19	Alberto Arturo Vergani, Christian Robert Huyck	Critical Limits in a Bump Attractor Network of Spiking Neurons.	CoRR	2020	DBLP BibTeX RDF
19	Benjamin K. Johnson, Angel Udvardi, Allison Eden, Judith E. Rosenbaum	Spoilers Go Bump in the Night.	J. Media Psychol. Theor. Methods Appl.	2020	DBLP DOI BibTeX RDF
19	Qingxia Zhang, Jilin Hou, Lukasz Jankowski	Bridge Damage Identification Using Vehicle Bump Based on Additional Virtual Masses.	Sensors	2020	DBLP DOI BibTeX RDF
19	José A. Carrillo 0001, Xinfu Chen, Qi Wang 0007, Zhian Wang, Lu Zhang 0037	Phase Transitions and Bump Solutions of the Keller-Segel Model with Volume Exclusion.	SIAM J. Appl. Math.	2020	DBLP DOI BibTeX RDF
19	Lakshmi Madathil Hari, Venugopal Gopinathakaimal, Ramakrishnan Swaminathan	Analysis of Isometric Muscle Contractions using Analytic Bump Continuous Wavelet Transform.	EMBC	2020	DBLP DOI BibTeX RDF
19	John K. Lindstedt, Wayne D. Gray	The "cognitive speed-bump": How world champion Tetris players trade milliseconds for seconds.	CogSci	2020	DBLP BibTeX RDF
19	Yixuan He, Minsu Choi, Kyung Ki Kim, Yong-Bin Kim	An Ultra-Low-Power Tunable Bump Circuit using Source-Degenerated Differential Transconductor.	ISOCC	2020	DBLP DOI BibTeX RDF
19	Somayeh Rahimipour, Runjie Zhang, Ke Wang 0011, Kevin Skadron, Fakhrul Zaman Rokhani, Mircea R. Stan	MTTF Enhancement Power-C4 Bump Placement Optimization.	IEEE Trans. Very Large Scale Integr. Syst.	2019	DBLP DOI BibTeX RDF
19	Ana Luisa Ballinas-Hernández, Iván Olmos Pineda, J. Arturo Olvera-López	Speed Bump Detection on Roads using Artificial Vision.	Res. Comput. Sci.	2019	DBLP BibTeX RDF
19	Mario A. Aguirre-López, Filiberto Hueyotl-Zahuantitla, Javier Morales-Castillo, Gerardo J. Escalera Santos, F.-Javier Almaguer	Simulating the flow around a baseball: Study of a 2D-cylinder with a single bump.	Comput. Math. Appl.	2019	DBLP DOI BibTeX RDF
19	Sean W. Gart, Chen Li	Body-terrain interaction affects large bump traversal of insects and legged robots.	CoRR	2019	DBLP BibTeX RDF
19	Janghyeon Lee, Si-Hyung Lim	Development of Open-Tubular-Type Micro Gas Chromatography Column with Bump Structures.	Sensors	2019	DBLP DOI BibTeX RDF
19	Admir Kaknjo, Muzaffar Rao, Edin Omerdic, Thomas Newe, Daniel Toal	Real-Time Secure/Unsecure Video Latency Measurement/Analysis with FPGA-Based Bump-in-the-Wire Security.	Sensors	2019	DBLP DOI BibTeX RDF
19	Donggyun Kim, MyeonGyu Jeong, ByungGuk Bae, Changsun Ahn	Design of a Human Evaluator Model for the Ride Comfort of Vehicle on a Speed Bump Using a Neural Artistic Style Extraction.	Sensors	2019	DBLP DOI BibTeX RDF
19	Mehdi Sabraoui, Jeffrey L. Hieb, Adrian P. Lauf, James Graham	Modeling and Machine-Checking Bump-in-the-Wire Security for Industrial Control Systems.	Critical Infrastructure Protection	2019	DBLP DOI BibTeX RDF
19	Makoto Motoyoshi, Kohki Yanagimura, Taikoh Fushimi, Shunta Endo	Stacked Pixel Sensor/Detector Technology using Au Micro-Bump Junction.	3DIC	2019	DBLP DOI BibTeX RDF
19	Jo Hae Joon, Dionysius Aldion Renata, Su Hyun Yoon, Youngjune Choi, Yalew Zelalem Jembre	Data Mining for Speed Bump Detection from Car Wheels and GPS Sensors using Random Forest.	ICTC	2019	DBLP DOI BibTeX RDF
19	Claudia Krogmeier, Christos Mousas, David Whittinghill	Human, Virtual Human, Bump! A Preliminary Study on Haptic Feedback.	VR	2019	DBLP DOI BibTeX RDF
19		Bump Hunting Technique.	Encyclopedia of Social Network Analysis and Mining. 2nd Ed.	2018	DBLP DOI BibTeX RDF
19	Muzaffar Rao, Thomas Newe, Edin Omerdic, Admir Kaknjo, Walid Elgenaidi, Avijit Mathur, Gerard Dooly, Elfed Lewis, Daniel Toal	Bump in the wire (BITW) security solution for a marine ROV remote control application.	J. Inf. Secur. Appl.	2018	DBLP DOI BibTeX RDF
19	Xuan Zhao 0001, Shu Wang, Man Yu, Qiang Yu, Chenyu Zhou	The position of speed bump in front of truck scale based on vehicle vibration performance.	J. Intell. Fuzzy Syst.	2018	DBLP DOI BibTeX RDF
19	Minho Nam, Kyoung-Rok Cho	Implementation of real-time image edge detector based on a bump circuit and active pixels in a CMOS image sensor.	Integr.	2018	DBLP DOI BibTeX RDF
19	Anouar Ragragui, Adnane Ouazzani Chahdi, Akram Halli, Khalid Satori	Revolution mapping with bump mapping support.	Graph. Model.	2018	DBLP DOI BibTeX RDF
19	Fei Chong Ng, Aizat Abas, Mohd Zulkifly Abdullah	Effect of solder bump shapes on underfill flow in flip-chip encapsulation using analytical, numerical and PIV experimental approaches.	Microelectron. Reliab.	2018	DBLP DOI BibTeX RDF
19	José M. Celaya-Padilla, Carlos Eric Galván-Tejada, Francisco Eneldo López-Monteagudo, Omero Alonso-González, Arturo Moreno-Báez, Antonio Martínez-Torteya, Jorge I. Galván-Tejada, José G. Arceo-Olague, Huizilopoztli Luna-García, Hamurabi Gamboa Rosales	Speed Bump Detection Using Accelerometric Features: A Genetic Algorithm Approach.	Sensors	2018	DBLP DOI BibTeX RDF
19	Lay Wai Kong, Osborne A. Martin	Known void size micro-bump, a novel standard of 3D X-ray computed tomography in-line metrology for accuracy assessment and monitoring.	I2MTC	2018	DBLP DOI BibTeX RDF
19	Jan Anlauff, Taeyong Kim, Jeremy R. Cooperstock	Feel-a-bump: Haptic feedback for foot-based angular menu selection.	HAPTICS	2018	DBLP DOI BibTeX RDF
19	Po-Yi Wu, Wai-Kei Mak, Ting-Chi Wang, Cheng Zhuo, Kassan Unda, Yiyu Shi 0001	A routing framework for technology migration with bump encroachment.	Integr.	2017	DBLP DOI BibTeX RDF
19	Aristides Gionis, Michael Mathioudakis, Antti Ukkonen	Bump Hunting in the Dark: Local Discrepancy Maximization on Graphs.	IEEE Trans. Knowl. Data Eng.	2017	DBLP DOI BibTeX RDF
19	N. van Veen, W. Luiten	Force and collapsed shape of a liquid solder bump under load.	Microelectron. Reliab.	2017	DBLP DOI BibTeX RDF
19	Samson Melamed, Naoya Watanabe, Shunsuke Nemoto, Haruo Shimamoto, Katsuya Kikuchi, Masahiro Aoyagi	Thermal impact of extreme die thinning in bump-bonded three-dimensional integrated circuits.	Microelectron. Reliab.	2017	DBLP DOI BibTeX RDF
19	Kin Hing Lo, Konstantinos Kontis	Flow visualisation of a normal shock impinging over a rounded contour bump in a Mach 1.3 free-stream.	J. Vis.	2017	DBLP DOI BibTeX RDF
19	August Romeo, Hans Supèr	Bump competition and lattice solutions in two-dimensional neural fields.	Neural Networks	2017	DBLP DOI BibTeX RDF
19	Diego Thomas, Akihiro Sugimoto	Parametric Surface Representation with Bump Image for Dense 3D Modeling Using an RBG-D Camera.	Int. J. Comput. Vis.	2017	DBLP DOI BibTeX RDF
19	Nan Chen 0005, Tingcun Wei, Hyun Jun Jung	A self-start power management circuit for the piezoelectric energy harvester of speed bump.	MWSCAS	2017	DBLP DOI BibTeX RDF
19	Yu-Min Lee, Chi-Han Lee, Yan-Cheng Zhu	Yield-driven redundant power bump assignment for power network robustness.	ASP-DAC	2017	DBLP DOI BibTeX RDF
19	Erik Jan Marinissen, Ferenc Fodor, Bart De Wachter, Jorg Kiesewetter, Eric Hill, Ken Smith	A fully automatic test system for characterizing large-array fine-pitch micro-bump probe cards.	ITC-Asia	2017	DBLP DOI BibTeX RDF
19	Theodora S. Brisimi, Christos G. Cassandras, Chris Osgood, Ioannis Ch. Paschalidis, Yue Zhang 0019	Sensing and Classifying Roadway Obstacles in Smart Cities: The Street Bump System.	IEEE Access	2016	DBLP DOI BibTeX RDF
19	Daniel B. Poll, Khanh Nguyen, Zachary P. Kilpatrick	Sensory feedback in a bump attractor model of path integration.	J. Comput. Neurosci.	2016	DBLP DOI BibTeX RDF
19	Runjie Zhang, Brett H. Meyer, Ke Wang 0011, Mircea R. Stan, Kevin Skadron	Tolerating the Consequences of Multiple EM-Induced C4 Bump Failures.	IEEE Trans. Very Large Scale Integr. Syst.	2016	DBLP DOI BibTeX RDF
19	Samson Melamed, Naoya Watanabe, Shunsuke Nemoto, Haruo Shimamoto, Katsuya Kikuchi, Masahiro Aoyagi	Impact of thinning stacked dies on the thermal resistance of bump-bonded three-dimensional integrated circuits.	Microelectron. Reliab.	2016	DBLP DOI BibTeX RDF
19	Hongjun Ji, Jiao Wang, Mingyu Li	Microstructure and reliability of hybrid interconnects by Au stud bump with Sn-0.7Cu solder for flip chip power device packaging.	Microelectron. Reliab.	2016	DBLP DOI BibTeX RDF
19	Aizat Abas, Muhammad Hafifi Hafiz Ishak, Mohd Zulkifly Abdullah, F. Che Ani, Soon Fuat Khor	Lattice Boltzmann method study of bga bump arrangements on void formation.	Microelectron. Reliab.	2016	DBLP DOI BibTeX RDF
19	Evgenii Burlakov, John Wyller, Arcady Ponosov	Two-dimensional Amari neural field model with periodic microstructure: Rotationally symmetric bump solutions.	Commun. Nonlinear Sci. Numer. Simul.	2016	DBLP DOI BibTeX RDF
19	Jean-Eudes J. Dazard, Michael Choe, Michael LeBlanc, J. Sunil Rao	Cross-validation and peeling strategies for survival bump hunting using recursive peeling methods.	Stat. Anal. Data Min.	2016	DBLP DOI BibTeX RDF
19	Makoto Motoyoshi, Kohki Yanagimura, Taikoh Fushimi, Junichi Takanohashi, Mariappan Murugesan, Masahiro Aoyagi, Mitsumasa Koyanagi	3 Dimensional stacked pixel detector and sensor technology using less than 3-μmφ robust bump junctions.	3DIC	2016	DBLP DOI BibTeX RDF
19	Natsuno Aoki, Kentaro Nakatani	A Study of the Bump Alternation in Japanese from the Perspective of Extended/Onset Causation.	CogALex@COLING	2016	DBLP BibTeX RDF
19	Cheng-Yu Ho, Huei-Yung Lin, Lu-Ting Wu	Intelligent speed bump system with dynamic license plate recognition.	ICIT	2016	DBLP DOI BibTeX RDF
19	Mariacarla Memeo, Luca Giulio Brayda	Mind the Bump: Effect of Geometrical Descriptors on the Perception of Curved Surfaces with a Novel Tactile Mouse.	EuroHaptics (2)	2016	DBLP DOI BibTeX RDF
19	Bradley A. Minch	A simple variable-width CMOS bump circuit.	ISCAS	2016	DBLP DOI BibTeX RDF
19	Chao-Ping Dong	Folded bump diagrams for partitions of classical types.	Adv. Appl. Math.	2015	DBLP DOI BibTeX RDF
19	Elena Malyutina, Arcady Ponosov, John Wyller	Numerical analysis of bump solutions for neural field equations with periodic microstructure.	Appl. Math. Comput.	2015	DBLP DOI BibTeX RDF
19	Yang Qi, Michael Breakspear, Pulin Gong	Subdiffusive Dynamics of Bump Attractors: Mechanisms and Functional Roles.	Neural Comput.	2015	DBLP DOI BibTeX RDF
19	Min Li 0012, Sudeep Gaddam, Xiaolin Li 0001, Yinan Zhao, Jingzhe Ma, Jian Ge	Identifying the Absorption Bump with Deep Learning.	CoRR	2015	DBLP BibTeX RDF
19	Hsiu-Min Lin, Cheng-Ying Ho, Wen-Lin Chen, Yi-Hsin Wu, De-Hui Wang, Jun-Ren Lin, Yu-Hui Wu, Huei-Cheng Hong, Zhi-Wei Lin, Jenq-Gong Duh	Interfacial reaction and mechanical evaluation in multi-level assembly joints with ENEPIG under bump metallization via drop and high speed impact test.	Microelectron. Reliab.	2015	DBLP DOI BibTeX RDF
19	Guanglan Liao, Pengfei Chen, Li Du, Lei Su 0002, Zhiping Liu, Zirong Tang, Tielin Shi	Using SOM neural network for X-ray inspection of missing-bump defects in three-dimensional integration.	Microelectron. Reliab.	2015	DBLP DOI BibTeX RDF
19	Jiwon Shin, Il Kim, Yong-Won Choi, Young Soon Kim, Un Byung Kang, Young Kun Jee, Kyung-Wook Paik	Non-conductive film with Zn-nanoparticles (Zn-NCF) for 40 μm pitch Cu-pillar/Sn-Ag bump interconnection.	Microelectron. Reliab.	2015	DBLP DOI BibTeX RDF
19	Aristides Gionis, Michael Mathioudakis, Antti Ukkonen	Bump hunting in the dark: Local discrepancy maximization on graphs.	ICDE	2015	DBLP DOI BibTeX RDF
19	Cody Chu, Claudia Beatriz Rébola, James Kao	BUMP: bridging unmet modes of participation.	BCS HCI	2015	DBLP DOI BibTeX RDF
19	Jongwoo Park 0001, Jungpyo Hong, Miji Lee, Dongyoon Sun, Kyung Kang, Taesung Kim, Seungwon Kim, Sujin Kwon, Changkyu Joo, Sangsu Ha, Wooyeon Kim, Jongsu Ryu, Sangwoo Pae	Contact resistance of solder bump with low cost photosensitive polyimide for high performance SoC.	IRPS	2015	DBLP DOI BibTeX RDF
19	Nicola Liberati	Augmented "Ouch!". How to Create Intersubjective Augmented Objects into Which We can Bump.	ISMAR-MASH'D	2015	DBLP DOI BibTeX RDF
19	Samson Melamed, Katsuya Kikuchi, Masahiro Aoyagi	Investigation of effects of metalization on heat spreading in bump-bonded 3D systems.	3DIC	2015	DBLP DOI BibTeX RDF
19	Keiichiro Iwanabe, Tanemasa Asano	Room-temperature bonding mechanism of compliant bump with ultrasonic assist.	3DIC	2015	DBLP DOI BibTeX RDF
19	Theodora S. Brisimi, Setareh Ariafar, Yue Zhang 0019, Christos G. Cassandras, Ioannis Ch. Paschalidis	Sensing and classifying roadway obstacles: The street bump anomaly detection and decision support system.	CASE	2015	DBLP DOI BibTeX RDF
19	Kentaro Yasu, Yuichiro Katsumoto	Bump ahead: easy-to-design haptic surface using magnet array.	SIGGRAPH Asia Emerging Technologies	2015	DBLP DOI BibTeX RDF
19	Hsu-Nan Yen, Min-Jyun Syu	Inspection of polarizer tiny bump defects using computer vision.	ICCE	2015	DBLP DOI BibTeX RDF
19	Jale Nur Mertoglu, Tuna Orhanli	Speed bump detection system by autothresholding method.	SIU	2015	DBLP DOI BibTeX RDF
19		Bump Hunting Technique.	Encyclopedia of Social Network Analysis and Mining	2014	DBLP DOI BibTeX RDF
19	Samuel Carroll, Kresimir Josic, Zachary P. Kilpatrick	Encoding certainty in bump attractors.	J. Comput. Neurosci.	2014	DBLP DOI BibTeX RDF
19	Cheoljon Jang, Jaehwan Kim, Jong-Wha Chong	Power-aware floorplanning-based power throughsilicon- via technology and bump minimisation for three-dimensional power delivery network.	IET Comput. Digit. Tech.	2014	DBLP DOI BibTeX RDF
19	Guang Tan, Mingming Lu, Fangsheng Jiang, Kongyang Chen, Xiaoxia Huang, Jie Wu 0001	Bumping: A Bump-Aided Inertial Navigation Method for Indoor Vehicles Using Smartphones.	IEEE Trans. Parallel Distributed Syst.	2014	DBLP DOI BibTeX RDF
19	Lei Jia, Xinjun Sheng, Zhenhua Xiong, Zhiping Wang, Han Ding 0001	Particle on Bump (POB) technique for ultra-fine pitch chip on glass (COG) applications by conductive particles and adhesives.	Microelectron. Reliab.	2014	DBLP DOI BibTeX RDF
19	Hsi-Kuei Cheng, Shien-Ping Feng, Yi-Jen Lai, Kuo-Chio Liu, Ying-Lang Wang, Tzeng-Feng Liu, Chih-Ming Chen 0002	Effect of polyimide baking on bump resistance in flip-chip solder joints.	Microelectron. Reliab.	2014	DBLP DOI BibTeX RDF
19	C. Y. Khor, Mohd Zulkifly Abdullah, Chun-Sean Lau, W. C. Leong, M. S. Abdul Aziz	Influence of solder bump arrangements on molded IC encapsulation.	Microelectron. Reliab.	2014	DBLP DOI BibTeX RDF
19	Yu Aizawa, Hideo Hirose	Bias Correction for the Trade-Off Curve in the Tree-Ga Bump Hunting.	IIAI-AAI	2014	DBLP DOI BibTeX RDF
19	Stavros Volos, Javier Picorel, Babak Falsafi, Boris Grot	BuMP: Bulk Memory Access Prediction and Streaming.	MICRO	2014	DBLP DOI BibTeX RDF
19	Meng-Ling Chen, Tu-Hsiung Tsai, Hung-Ming Chen, Shi-Hao Chen	Routability-driven bump assignment for chip-package co-design.	ASP-DAC	2014	DBLP DOI BibTeX RDF
19	Kuan-Te Wu, Jin-Fu Li 0001, Yun-Chao Yu, Chih-Sheng Hou, Chi-Chun Yang, Ding-Ming Kwai, Yung-Fa Chou, Chih-Yen Lo	Intra-channel Reconfigurable Interface for TSV and Micro Bump Fault Tolerance in 3-D RAMs.	ATS	2014	DBLP DOI BibTeX RDF
19	Hua-Tsung Chen, Chun-Yu Lai, Chun-Chieh Hsu, Suh-Yin Lee, Bao-Shuh Paul Lin, Chien-Peng Ho	Vision-Based Road Bump Detection Using a Front-Mounted Car Camcorder.	ICPR	2014	DBLP DOI BibTeX RDF
19	Jin-Tai Yan, Yu-Jen Tseng, Chia-Heng Yen	Efficient micro-bump assignment for RDL routing in 3DICs.	ICECS	2014	DBLP DOI BibTeX RDF
19	Afshan Kirmani, Rowanne Fleck	"People don't bump": sharing around mobile phones in close proximity.	Mobile HCI	2014	DBLP DOI BibTeX RDF
19	Andrea Pirisi, Marco Mussetta, Francesco Grimaccia, Riccardo Enrico Zich	Novel Speed-Bump Design and Optimization for Energy Harvesting From Traffic.	IEEE Trans. Intell. Transp. Syst.	2013	DBLP DOI BibTeX RDF
19	Hironori Tohmyoh, Shoho Ishikawa, Satoshi Watanabe, Motohisa Kuroha, Yoshikatsu Nakano	Estimation and visualization of the fatigue life of Pb-free SAC solder bump joints under thermal cycling.	Microelectron. Reliab.	2013	DBLP DOI BibTeX RDF
19	Seong-Hun Na, Seung-Kyu Lim, Jin-Soo Kim, Hwa-Sun Park, Heung-Jae Oh, Jin-Won Choi, Su-Jeong Suh	Experimental study of bump void formation according to process conditions.	Microelectron. Reliab.	2013	DBLP DOI BibTeX RDF
19	F. L. Lau, Riko I. Made, Wahyuaji Narottama Putra, J. Z. Lim, V. C. Nachiappan, J. L. Aw, Chee Lip Gan	Electrical behavior of Au-Ge eutectic solder under aging for solder bump application in high temperature Electronics.	Microelectron. Reliab.	2013	DBLP DOI BibTeX RDF
19	Y. W. Chang, H. Y. Peng, R. W. Yang, Chih Chen, T. C. Chang, Chau-Jie Zhan, Jin-Ye Juang, Annie T. Huang	Analysis of bump resistance and current distribution of ultra-fine-pitch microbumps.	Microelectron. Reliab.	2013	DBLP DOI BibTeX RDF
19	Biao Wu 0004, Longcheng Liu, Enyu Yao	Minimizing the maximum bump cost in linear extensions of a poset.	J. Comb. Optim.	2013	DBLP DOI BibTeX RDF
19	Masayuki Goto, Kenjiro Takemura	Tactile bump display using electro-rheological fluid.	IROS	2013	DBLP DOI BibTeX RDF
19	Akihiro Ikeda, L. J. Qiu, K. Nakahara, Tanemasa Asano	Surface passivation of Cu cone bump by self-assembled-monolayer for room temperature Cu-Cu bonding.	3DIC	2013	DBLP DOI BibTeX RDF