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Results
Found 625 publication records. Showing 625 according to the selection in the facets
Hits ?▲ |
Authors |
Title |
Venue |
Year |
Link |
Author keywords |
1 | Patrick Leduc, Myriam Assous, Léa Di Cioccio, Marc Zussy, Thomas Signamarcheix, Antonio Roman, Maxime Rousseau, Sophie Verrun, Laurent Bally, David Bouchu, Lionel Cadix, Alexis Farcy, Nicolas Sillon |
First integration of Cu TSV using die-to-wafer direct bonding and planarization. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009, pp. 1-5, 2009, IEEE, 978-1-4244-4511-0. The full citation details ...](Pics/full.jpeg) |
2009 |
DBLP DOI BibTeX RDF |
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1 | Ryusuke Egawa, Jubee Tada, Hiroaki Kobayashi, Gensuke Goto |
Evaluation of fine grain 3-D integrated arithmetic units. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009, pp. 1-8, 2009, IEEE, 978-1-4244-4511-0. The full citation details ...](Pics/full.jpeg) |
2009 |
DBLP DOI BibTeX RDF |
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1 | Yuki Ohara, Akihiro Noriki, Katsuyuki Sakuma, Kang Wook Lee 0002, Mariappan Murugesan, Jichoel Bea, Fumiaki Yamada, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi |
10 µm fine pitch Cu/Sn micro-bumps for 3-D super-chip stack. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009, pp. 1-6, 2009, IEEE, 978-1-4244-4511-0. The full citation details ...](Pics/full.jpeg) |
2009 |
DBLP DOI BibTeX RDF |
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1 | Weng Hong Teh, Raymond Caramto, Jamal Qureshi, Sitaram Arkalgud, M. O'Brien, T. Gilday, Kou Maekawa, T. Saito, Kouichi Maruyama, Thenappan Chidambaram, Wei Wang 0003, David Marx, David Grant, Russ Dudley |
A route towards production-worthy 5 µm × 25 µm and 1 µm × 20 µm non-Bosch through-silicon-via (TSV) etch, TSV metrology, and TSV integration. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009, pp. 1-5, 2009, IEEE, 978-1-4244-4511-0. The full citation details ...](Pics/full.jpeg) |
2009 |
DBLP DOI BibTeX RDF |
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1 | Tomohide Murase, Hiroyuki Aikyou, Fumikazu Mizutani, Yu Shoji, Tomoya Higashihara, Mitsuru Ueda |
Thermotropic liquid crystalline polyimides toward high heat conducting materials for 3D chip stack. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009, pp. 1-4, 2009, IEEE, 978-1-4244-4511-0. The full citation details ...](Pics/full.jpeg) |
2009 |
DBLP DOI BibTeX RDF |
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1 | Dragomir Milojevic, Trevor E. Carlson, Kris Croes, Riko Radojcic, Diana F. Ragett, Dirk Seynhaeve, Federico Angiolini, Geert Van der Plas, Paul Marchal |
Automated Pathfinding tool chain for 3D-stacked integrated circuits: Practical case study. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009, pp. 1-6, 2009, IEEE, 978-1-4244-4511-0. The full citation details ...](Pics/full.jpeg) |
2009 |
DBLP DOI BibTeX RDF |
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1 | Seyyed Ahmad Razavi, Morteza Saheb Zamani, Kia Bazargan |
A tileable switch module architecture for homogeneous 3D FPGAs. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009, pp. 1-4, 2009, IEEE, 978-1-4244-4511-0. The full citation details ...](Pics/full.jpeg) |
2009 |
DBLP DOI BibTeX RDF |
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1 | Kelli Ireland, Donald M. Chiarulli, Steven P. Levitan |
A routerless system level interconnection network for 3D integrated systems. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009, pp. 1-6, 2009, IEEE, 978-1-4244-4511-0. The full citation details ...](Pics/full.jpeg) |
2009 |
DBLP DOI BibTeX RDF |
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1 | Keith Buchanan, Stephen Burgess, Kathrine Giles, Matthew Muggeridge, Hao Zhao |
Etch, dielectrics and metal barrier-seed for low temperature through-silicon via processing. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009, pp. 1-4, 2009, IEEE, 978-1-4244-4511-0. The full citation details ...](Pics/full.jpeg) |
2009 |
DBLP DOI BibTeX RDF |
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1 | Dean L. Lewis, Hsien-Hsin S. Lee |
Architectural evaluation of 3D stacked RRAM caches. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009, pp. 1-4, 2009, IEEE, 978-1-4244-4511-0. The full citation details ...](Pics/full.jpeg) |
2009 |
DBLP DOI BibTeX RDF |
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1 | Matt Grange, Awet Yemane Weldezion, Dinesh Pamunuwa, Roshan Weerasekera, Zhonghai Lu, Axel Jantsch, Dave Shippen |
Physical mapping and performance study of a multi-clock 3-Dimensional Network-on-Chip mesh. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009, pp. 1-7, 2009, IEEE, 978-1-4244-4511-0. The full citation details ...](Pics/full.jpeg) |
2009 |
DBLP DOI BibTeX RDF |
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1 | Thomas Brunschwiler, Stephan Paredes, Ute Drechsler, Bruno Michel, W. Cesar, G. Töral, Yuksel Temiz, Yusuf Leblebici |
Validation of the porous-medium approach to model interlayer-cooled 3D-chip stacks. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009, pp. 1-10, 2009, IEEE, 978-1-4244-4511-0. The full citation details ...](Pics/full.jpeg) |
2009 |
DBLP DOI BibTeX RDF |
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1 | Ric van Doremalen, Piet van Engen, Wouter Jochems, Shi Cheng, Thomas Fritzsch, Walter De Raedt |
Miniature wireless activity monitor using 3D system integration. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009, pp. 1-7, 2009, IEEE, 978-1-4244-4511-0. The full citation details ...](Pics/full.jpeg) |
2009 |
DBLP DOI BibTeX RDF |
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1 | Grzegorz Janczyk, Tomasz Bieniek, Jerzy Szynka, Piotr Grabiec |
Reliability aspects of 3D-oriented heterogeneous device design related to stress sensitivity of MOS transistors. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009, pp. 1-6, 2009, IEEE, 978-1-4244-4511-0. The full citation details ...](Pics/full.jpeg) |
2009 |
DBLP DOI BibTeX RDF |
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1 | Christopher Mineo, William Rhett Davis |
The benefits of 3D networks-on-chip as shown with LDPC decoding. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009, pp. 1-8, 2009, IEEE, 978-1-4244-4511-0. The full citation details ...](Pics/full.jpeg) |
2009 |
DBLP DOI BibTeX RDF |
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1 | Tapobrata Bandyopadhyay, Ritwik Chatterjee, Daehyun Chung, Madhavan Swaminathan, Rao R. Tummala |
Electrical modeling of Through Silicon and Package Vias. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009, pp. 1-8, 2009, IEEE, 978-1-4244-4511-0. The full citation details ...](Pics/full.jpeg) |
2009 |
DBLP DOI BibTeX RDF |
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1 | Thomas Fritzsch, Raul Mrossko, Tobias Baumgartner 0003, Michael Toepper, Matthias Klein, Jürgen Wolf, Bernhard Wunderle, Herbert Reichl |
3-D thin chip integration technology - from technology development to application. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009, pp. 1-8, 2009, IEEE, 978-1-4244-4511-0. The full citation details ...](Pics/full.jpeg) |
2009 |
DBLP DOI BibTeX RDF |
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1 | Ji Chel Bea, Mariappan Murugesan, Yuki Ohara, Akihiro Noriki, Hisashi Kino, Kang Wook Lee 0002, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi |
Micro-Raman spectroscopy analysis and capacitance - time (C-t) measurement of thinned silicon substrates for 3D integration. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009, pp. 1-5, 2009, IEEE, 978-1-4244-4511-0. The full citation details ...](Pics/full.jpeg) |
2009 |
DBLP DOI BibTeX RDF |
|
1 | Claudio Truzzi, Frédéric Raynal, Vincent Mevellec |
Wet-process deposition of TSV liner and metal films. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009, pp. 1-6, 2009, IEEE, 978-1-4244-4511-0. The full citation details ...](Pics/full.jpeg) |
2009 |
DBLP DOI BibTeX RDF |
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1 | G. Williams, Patrick O'Hara, J. Moore, Bart Gordon, J. Rose |
A review of wafer bonding materials and characterizations to enable wafer thinning, backside processing, and laser dicing. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009, pp. 1, 2009, IEEE, 978-1-4244-4511-0. The full citation details ...](Pics/full.jpeg) |
2009 |
DBLP DOI BibTeX RDF |
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1 | Yusuke Funaya, Ryusuke Egawa, Hiroyuki Takizawa, Hiroaki Kobayashi |
3D on-chip memory for the vector architecture. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009, pp. 1-6, 2009, IEEE, 978-1-4244-4511-0. The full citation details ...](Pics/full.jpeg) |
2009 |
DBLP DOI BibTeX RDF |
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1 | Shiv Govind Singh, Chuan Seng Tan |
Impact of thermal through silicon via (TTSV) on the temperature profile of multi-layer 3-D device stack. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009, pp. 1-4, 2009, IEEE, 978-1-4244-4511-0. The full citation details ...](Pics/full.jpeg) |
2009 |
DBLP DOI BibTeX RDF |
|
1 | Matthew Hogan, Dusan Petranovic |
Robust verification of 3D-ICs: Pros, cons and recommendations. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009, pp. 1-6, 2009, IEEE, 978-1-4244-4511-0. The full citation details ...](Pics/full.jpeg) |
2009 |
DBLP DOI BibTeX RDF |
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1 | Eun Chu Oh, Paul D. Franzon |
Technology impact analysis for 3D TCAM. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009, pp. 1-5, 2009, IEEE, 978-1-4244-4511-0. The full citation details ...](Pics/full.jpeg) |
2009 |
DBLP DOI BibTeX RDF |
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1 | Yaoyao Ye, Lian Duan, Jiang Xu 0001, Jin Ouyang, Mo Kwai Hung, Yuan Xie 0001 |
3D optical networks-on-chip (NoC) for multiprocessor systems-on-chip (MPSoC). ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009, pp. 1-6, 2009, IEEE, 978-1-4244-4511-0. The full citation details ...](Pics/full.jpeg) |
2009 |
DBLP DOI BibTeX RDF |
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Displaying result #601 - #625 of 625 (100 per page; Change: ) Pages: [ <<][ 1][ 2][ 3][ 4][ 5][ 6][ 7] |
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