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Venues (Conferences, Journals, ...)
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GrowBag graphs for keyword ? (Num. hits/coverage)
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The graphs summarize 682 occurrences of 533 keywords
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Results
Found 1665 publication records. Showing 1665 according to the selection in the facets
Hits ?▲ |
Authors |
Title |
Venue |
Year |
Link |
Author keywords |
14 | Maurits Diephuis, Svyatoslav Voloshynovskiy, Taras Holotyak, Nabil Stendardo, Bruno Keel |
A framework for fast and secure packaging identification on mobile phones. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Media Watermarking, Security, and Forensics ![In: Media Watermarking, Security, and Forensics 2014, San Francisco, CA, USA, February 2, 2014, Proceedings, pp. 90280T, 2014, SPIE, 978-0-8194-9945-5. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
14 | John W. Poulton, William J. Dally, Xi Chen 0033, John G. Eyles, Thomas H. Greer, Stephen G. Tell, John M. Wilson 0002, C. Thomas Gray |
A 0.54 pJ/b 20 Gb/s Ground-Referenced Single-Ended Short-Reach Serial Link in 28 nm CMOS for Advanced Packaging Applications. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE J. Solid State Circuits ![In: IEEE J. Solid State Circuits 48(12), pp. 3206-3218, 2013. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
14 | Ping Yang, Dongjing Liu, Yanfang Zhao, Yunqing Tang, Huan Wang |
Approach on the Life-Prediction of Solder Joint for Electronic Packaging Under Combined Loading. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Reliab. ![In: IEEE Trans. Reliab. 62(4), pp. 870-875, 2013. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
14 | Paul W. Coteus, Shawn Hall, Todd Takken, Rick A. Rand, S. Tian, Gerard V. Kopcsay, Randy Bickford, Francis P. Giordano, Christopher Marroquin, Mark J. Jeanson |
Packaging the IBM Blue Gene/Q supercomputer. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IBM J. Res. Dev. ![In: IBM J. Res. Dev. 57(1/2), pp. 2, 2013. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
14 | Wei-Ling Wang, Chiao-Tzu Huang, Shu-Jen Wang, Chia-Pao Chang, Hui-Wen Liao |
Application of RFID on equipment parts readiness management system of semiconductor packaging plant. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Int. J. Inf. Technol. Manag. ![In: Int. J. Inf. Technol. Manag. 12(1/2), pp. 67-84, 2013. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
14 | Huang-Kuang Kung, Hung-Shyong Chen, Ming-Cheng Lu |
The wire sag problem in wire bonding technology for semiconductor packaging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 53(2), pp. 288-296, 2013. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
14 | Charles E. Bauer, Herbert J. Neuhaus |
Embedded packaging and assembly; Reliability and supply chain implications. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 53(9-11), pp. 1179-1182, 2013. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
14 | Didier Chicot, K. Tilkin, K. Jankowski, Artur Wymyslowski |
Reliability analysis of solder joints due to creep and fatigue in microelectronic packaging using microindentation technique. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 53(5), pp. 761-766, 2013. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
14 | Pierre-Louis Charvet, P. Nicolas, D. Bloch, B. Savornin |
MEMS packaging reliability assessment: Residual Gas Analysis of gaseous species trapped inside MEMS cavities. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 53(9-11), pp. 1622-1627, 2013. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
14 | Gang Chen 0028, Ze-Sheng Zhang, Yun-Hui Mei, Xin Li 0039, Guo-Quan Lu, Xu Chen |
Ratcheting behavior of sandwiched assembly joined by sintered nanosilver for power electronics packaging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 53(4), pp. 645-651, 2013. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
14 | Peter Dietrich |
Trends in automotive power semiconductor packaging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 53(9-11), pp. 1681-1686, 2013. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
14 | J. Keller, Raul Mrossko, H. Dobrinski, J. Stürmann, Ralf Döring, Rainer Dudek, Sven Rzepka, Bernd Michel |
Effect of moisture swelling on MEMS packaging and integrated sensors. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 53(9-11), pp. 1648-1654, 2013. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
14 | C. Y. Khor, Mohd Zulkifly Abdullah |
Analysis of fluid/structure interaction: Influence of silicon chip thickness in moulded packaging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 53(2), pp. 334-347, 2013. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
14 | Yao Yao 0003, Leon M. Keer |
Cohesive fracture mechanics based numerical analysis to BGA packaging and lead free solders under drop impact. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 53(4), pp. 629-637, 2013. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
14 | Wen-Hwa Chen, Ching-Feng Yu, Hsien-Chie Cheng, Yu-min Tsai, Su-Tsai Lu |
IMC growth reaction and its effects on solder joint thermal cycling reliability of 3D chip stacking packaging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 53(1), pp. 30-40, 2013. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
14 | Xingming Long, Rui-Jin Liao, Jing Zhou, Zhi Zeng |
Thermal uniformity of packaging multiple light-emitting diodes embedded in aluminum-core printed circuit boards. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 53(4), pp. 544-553, 2013. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
14 | Xiang Xi, Xuezhong Wu, Yulie Wu, Yongmeng Zhang, Yi Tao, Yu Zheng 0003, Dingbang Xiao |
Structural-Acoustic Coupling Effects on the Non-Vacuum Packaging Vibratory Cylinder Gyroscope. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Sensors ![In: Sensors 13(12), pp. 17176-17192, 2013. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
14 | Yong-Liang Yang, Qi-Xing Huang |
TrayGen: Arranging Objects for Exhibition and Packaging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Comput. Graph. Forum ![In: Comput. Graph. Forum 32(7), pp. 187-195, 2013. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
14 | Juhi Agarwal, R. H. Goudar, Nishkarsh Sharma, Pratik Kumar, Vishesh Parshav, Robin Sharma, Sreenivasa Rao |
Cost effective dynamic packaging systems in E-tourism using semantic web. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICACCI ![In: International Conference on Advances in Computing, Communications and Informatics, ICACCI 2013, Mysore, India, August 22-25, 2013, pp. 1196-1200, 2013, IEEE, 978-1-4799-2432-5. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
14 | Clara Ceppa, Gian Paolo Marino |
A Virtual Web Net to Eco-manage Food Packaging Waste. ![Search on Bibsonomy](Pics/bibsonomy.png) |
CSDM ![In: Complex Systems Design & Management, Proceedings of the Fourth International Conference on Complex Systems Design & Management CSD&M 2013, Paris, France, December 4-6, 2013, pp. 63-72, 2013, Springer, 978-3-319-02811-8. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
14 | Marius Bazu, Virgil Emil Ilian, Dragos Varsescu, Lucian Galateanu, Vili Sikio, Meelis Reimets, Volker Uhl, Manuel Weiss |
Reliability tests for discriminating between technological variants of QFN packaging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ESSDERC ![In: Proceedings of the European Solid-State Device Research Conference, ESSDERC 2013, Bucharest, Romania, September 16-20, 2013, pp. 226-229, 2013, IEEE. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
14 | Manja Lohse, Britta Wrede, Lars Schillingmann |
Enabling robots to make use of the structure of human actions - A user study employing Acoustic Packaging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
RO-MAN ![In: IEEE International Symposium on Robot and Human Interactive Communication, IEEE RO-MAN 2013, Gyeongju, South Korea, August 26-29, 2013, pp. 490-495, 2013, IEEE, 978-1-4799-0507-2. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
14 | Jürgen Blume, Alexander Bannat, Gerhard Rigoll, M. Rooker, A. Angerer, Claus Lenz |
Programming concept for an industrial HRI packaging cell. ![Search on Bibsonomy](Pics/bibsonomy.png) |
RO-MAN ![In: IEEE International Symposium on Robot and Human Interactive Communication, IEEE RO-MAN 2013, Gyeongju, South Korea, August 26-29, 2013, pp. 93-98, 2013, IEEE, 978-1-4799-0507-2. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
14 | Sébastien Destercke, Patrice Buche, Brigitte Charnomordic, Valérie Guillard |
Decision support system using flexible query and reliability assessment - application to biodegradable and biosourced packaging design. ![Search on Bibsonomy](Pics/bibsonomy.png) |
FUZZ-IEEE ![In: FUZZ-IEEE 2013, IEEE International Conference on Fuzzy Systems, Hyderabad, India, 7-10 July, 2013, Proceedings., 2013, IEEE, 978-1-4799-0020-6. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
14 | Katsuya Kikuchi, Fumiki Kato, Shunsuke Nemoto, Hiroshi Nakagawa, Masahiro Aoyagi, Youtaro Yasu, Kohji Koshiji |
Investigation of optimized high-density flip-chip interconnect design including micro Au bumps for 3-D stacked LSI packaging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013, pp. 1-4, 2013, IEEE, 978-1-4673-6484-3. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
14 | Kentaro Mori, Yoshihiro Ono, Shinji Watanabe 0004, Toshikazu Ishikawa, Michiaki Sugiyama, Satoshi Imasu, Toshihiko Ochiai, Ryo Mori, Tsuyoshi Kida, Tomoaki Hashimoto, Hideki Tanaka, Michitaka Kimura |
High density and reliable packaging technology with Non Conductive Film for 3D/TSV. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013, pp. 1-7, 2013, IEEE, 978-1-4673-6484-3. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
14 | Yuri Sylvester, Luke Hunter, Bruce Johnson, Raleigh Estrada |
3D X-ray microscopy: A near-SEM non-destructive imaging technology used in the development of 3D IC packaging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013, pp. 1-7, 2013, IEEE, 978-1-4673-6484-3. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
14 | Seung Hwan Park, Cheong-Sool Park, Jun-Seok Kim, Sung-Shick Kim, Jun-Geol Baek, Daewoong An |
Data Mining Approaches for Packaging Yield Prediction in the Post-fabrication Process. ![Search on Bibsonomy](Pics/bibsonomy.png) |
BigData Congress ![In: IEEE International Congress on Big Data, BigData Congress 2013, Santa Clara, CA, USA, June 27 2013-July 2, 2013, pp. 363-368, 2013, IEEE Computer Society, 978-0-7695-5006-0. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
14 | Yichao Xu, Guanjiang Wang, Xin Sun 0003, Runiu Fang, Min Miao, Yufeng Jin |
In-line testing of blind TSVs for 3D IC integration and M/NEMS packaging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
NEMS ![In: 8th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2013, Suzhou, China, April 7-10, 2013, pp. 233-236, 2013, IEEE. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
14 | Mengying Zhang, Lidong Du, Zhan Zhao, Zhen Fang 0003 |
Low-stress packaging for a MEMS atmosphere pressure sensor. ![Search on Bibsonomy](Pics/bibsonomy.png) |
NEMS ![In: 8th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2013, Suzhou, China, April 7-10, 2013, pp. 665-668, 2013, IEEE. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
14 | Xu Mao, Zhiqiang Fang, Zhe Zhang, Jinling Yan, Zhimei Qi, Fuhua Yang |
Sn-rich Au-Sn hermetic packaging at wafer level and its application in SPR sensor. ![Search on Bibsonomy](Pics/bibsonomy.png) |
NEMS ![In: 8th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2013, Suzhou, China, April 7-10, 2013, pp. 244-247, 2013, IEEE. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
14 | Camilla Baj-Rossi, Enver G. Kilinc, Sara S. Ghoreishizadeh, Daniele Casarino, Tanja Rezzonico Jost, Catherine Dehollain, Fabio Grassi, Laura Pastorino, Giovanni De Micheli, Sandro Carrara |
Fabrication and packaging of a fully implantable biosensor array. ![Search on Bibsonomy](Pics/bibsonomy.png) |
BioCAS ![In: 2013 IEEE Biomedical Circuits and Systems Conference (BioCAS), Rotterdam, The Netherlands, October 31 - Nov. 2, 2013, pp. 166-169, 2013, IEEE. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
14 | Roman P. Bazylevych, Lubov Bazylevych |
The methodology and algorithms for solving the very large-scale physical design automation problems: Partitioning, packaging, placement and routing. ![Search on Bibsonomy](Pics/bibsonomy.png) |
MECO ![In: 2nd Mediterranean Conference on Embedded Computing, MECO 2013, Budva, Montenegro, June 15-20, 2013, pp. 1-2, 2013, IEEE. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
14 | Ricardo Morales, Francisco J. Badesa, Nicolás García Aracil, Richard Bormann, Jan Fischer, Birgit Graf |
Bimanual Robot Manipulation and Packaging of Shoes in Footwear Industry. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ROBOT (1) ![In: ROBOT 2013: First Iberian Robotics Conference - Advances in Robotics, Vol. 1, Madrid, Spain, 28-29 November 2013, pp. 315-329, 2013, Springer, 978-3-319-03412-6. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
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14 | Zhengyu Ba, X. Yuan, Lei Jia, Xinjun Sheng, Zhenhua Xiong, Han Ding 0001 |
A Novel Conductive Particle Dispersing Method via EHDA for POB-COG Packaging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICIRA (2) ![In: Intelligent Robotics and Applications - 6th International Conference, ICIRA 2013, Busan, South Korea, September 25-28, 2013, Proceedings, Part II, pp. 397-408, 2013, Springer, 978-3-642-40848-9. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
14 | John W. Poulton, William J. Dally, Xi Chen 0033, John G. Eyles, Thomas H. Greer, Stephen G. Tell, C. Thomas Gray |
A 0.54pJ/b 20Gb/s ground-referenced single-ended short-haul serial link in 28nm CMOS for advanced packaging applications. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ISSCC ![In: 2013 IEEE International Solid-State Circuits Conference - Digest of Technical Papers, ISSCC 2013, San Francisco, CA, USA, February 17-21, 2013, pp. 404-405, 2013, IEEE, 978-1-4673-4515-6. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
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14 | Luigi Biagiotti, Claudio Melchiorri, M. Pilati, G. Mazzuchetti, G. Collepalumbo, P. Ragazzini |
Integration of robotic systems in a packaging machine: A tool for design and simulation of efficient motion trajectories. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ETFA ![In: Proceedings of 2013 IEEE 18th Conference on Emerging Technologies & Factory Automation, ETFA 2013, Cagliari, Italy, September 10-13, 2013, pp. 1-4, 2013, IEEE, 978-1-4799-0864-6. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
14 | Casey Robinson, Douglas Thain |
Automated packaging of bioinformatics workflows for portability and durability using makeflow. ![Search on Bibsonomy](Pics/bibsonomy.png) |
WORKS@SC ![In: Proceedings of WORKS 2013: 8th Workshop On Workflows in Support of Large-Scale Science, Held in conjunction with SC13, Denver, CO, USA, November 17, 2013, pp. 98-105, 2013, ACM, 978-1-4503-2502-8. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
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14 | Kawai Chui, Hsiang-Lin Yeh, Wen-Chun Lan, Yu-Han Cheng |
Clausal-Packaging of Path of Motion in Second Language Acquisition of Russian and Spanish. ![Search on Bibsonomy](Pics/bibsonomy.png) |
PACLIC ![In: Proceedings of the 27th Pacific Asia Conference on Language, Information and Computation, PACLIC 27, Taipei, Taiwan, November 21-24, 2013, 2013, National Chengchi University, Taiwan. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP BibTeX RDF |
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14 | Shane Loughlin, John McGrory |
A method of classifying industrial assembly and packaging equipment. ![Search on Bibsonomy](Pics/bibsonomy.png) |
INDIN ![In: 11th IEEE International Conference on Industrial Informatics, INDIN 2013, Bochum, Germany, July 29-31, 2013, pp. 293-298, 2013, IEEE, 978-1-4799-0752-6. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
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14 | Miroslav Kotzev |
Probing and fixturing techniques for wideband multiport measurements in digital packaging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
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2013 |
RDF |
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14 | Giacomo Langfelder, Stefano Dellea, Federico Zaraga, Dario Cucchi, Mikel Azpeitia Urquia |
The Dependence of Fatigue in Microelectromechanical Systems on the Environment and the Industrial Packaging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Ind. Electron. ![In: IEEE Trans. Ind. Electron. 59(12), pp. 4938-4948, 2012. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
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14 | Richard Bloss |
PACK EXPO show highlighted how important robotics are to packaging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Ind. Robot ![In: Ind. Robot 39(4), pp. 335-339, 2012. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
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14 | Martin George Wynn, Oludotun Olubanjo |
Demand-supply chain management: systems implications in an SME packaging business in the UK. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Int. J. Manuf. Res. ![In: Int. J. Manuf. Res. 7(2), pp. 198-212, 2012. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
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14 | Patrick W. Ruch, Thomas Brunschwiler, Werner Escher, Stephan Paredes, Bruno Michel |
Bionic Packaging: A Promising Paradigm for Future Computing. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ERCIM News ![In: ERCIM News 2012(89), 2012. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP BibTeX RDF |
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14 | Jun Wang 0029, Yasir Khan, L. X. Lu, Z. W. Wang |
Inner resonance of a coupled hyperbolic tangent nonlinear oscillator arising in a packaging system. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Appl. Math. Comput. ![In: Appl. Math. Comput. 218(15), pp. 7876-7879, 2012. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
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14 | Osanori Koyama, Ryou Sougen, Keisuke Ikushima, Makoto Yamada, Yutaka Katsuyama |
Optical Fan-Out Adapter for Compact Packaging of Components by a Jacket Removing System with a CO2 Laser. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEICE Trans. Commun. ![In: IEICE Trans. Commun. 95-B(1), pp. 143-151, 2012. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
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14 | Thomas Strach, Frank E. Bosco, Kenneth L. Christian, Kevin R. Covi, Martin Eckert, Gregory R. Edlund, Roland Frech, Hubert Harrer, Andreas Huber, Dierk Kaller, Martin Kindscher, A. Z. Muszynski, G. A. Peterson, Claudio Siviero, Jochen Supper, Otto A. Torreiter, Thomas-Michael Winkel |
Electronic packaging of the IBM System z196 enterprise-class server processor cage. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IBM J. Res. Dev. ![In: IBM J. Res. Dev. 56(1), pp. 2, 2012. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
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14 | Daisuke Inoue, Yoshitaka Yanagihara, Hiroshi Ueno, Shin'ichiro Nishida |
Model Tests of Regolith Packaging Mechanism. ![Search on Bibsonomy](Pics/bibsonomy.png) |
J. Robotics Mechatronics ![In: J. Robotics Mechatronics 24(6), pp. 1023-1030, 2012. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
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14 | Mu-Chien Chou, Regina W. Y. Wang |
Displayability: An assessment of differentiation design for the findability of bottle packaging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Displays ![In: Displays 33(3), pp. 146-156, 2012. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
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14 | He-Yau Kang, Amy H. I. Lee, Cheng-Yan Yang |
A fuzzy ANP model for supplier selection as applied to IC packaging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
J. Intell. Manuf. ![In: J. Intell. Manuf. 23(5), pp. 1477-1488, 2012. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
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14 | Tolga Aydinliyim, Michael S. Pangburn |
Reducing Packaging Waste and Cost via Consumer Price Discounts. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Decis. Sci. ![In: Decis. Sci. 43(6), pp. 1063-1089, 2012. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
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14 | George J. Besseris |
Profiling effects in industrial data mining by non-parametric DOE methods: An application on screening checkweighing systems in packaging operations. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Eur. J. Oper. Res. ![In: Eur. J. Oper. Res. 220(1), pp. 147-161, 2012. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
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14 | Dario Pacciarelli, Andrea D'Ariano |
Increasing the Reliability of Production Schedules in a Pharmaceutical Packaging Department. ![Search on Bibsonomy](Pics/bibsonomy.png) |
J. Medical Syst. ![In: J. Medical Syst. 36(6), pp. 3407-3421, 2012. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
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14 | Ching-Hsiang Chang, Yeong-Lin Lai, Chih-Cheng Chen |
Implement the RFID Position Based System of Automatic Tablets Packaging Machine for Patient Safety. ![Search on Bibsonomy](Pics/bibsonomy.png) |
J. Medical Syst. ![In: J. Medical Syst. 36(6), pp. 3463-3471, 2012. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
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14 | E. J. Cheng, Yu-Lin Shen |
Thermal expansion behavior of through-silicon-via structures in three-dimensional microelectronic packaging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 52(3), pp. 534-540, 2012. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
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14 | Andrej Ivankovic, Kris Vanstreels, Daniel Vanderstraeten, Guy Brizar, Renaud Gillon, Eddy Blansaer, Bart Vandevelde |
Comparison of experimental methods for the extraction of the elastic modulus of molding compounds used in IC packaging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 52(11), pp. 2677-2684, 2012. The full citation details ...](Pics/full.jpeg) |
2012 |
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14 | Cheng-Yi Liu, S. W. Ricky Lee, Moo Whan Shin, Yi-Shao Lai |
Reliability of high-power LED packaging and assembly. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 52(5), pp. 761, 2012. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
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14 | Minseok Ha, Samuel Graham |
Development of a thermal resistance model for chip-on-board packaging of high power LED arrays. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 52(5), pp. 836-844, 2012. The full citation details ...](Pics/full.jpeg) |
2012 |
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14 | Harrie A. C. Tilmans, Jeroen De Coster, Philippe Hélin, Vladimir Cherman, Anne Jourdain, Piet De Moor, Bart Vandevelde, Nga P. Pham, Joseph Zekry, Ann Witvrouw, Ingrid De Wolf |
MEMS packaging and reliability: An undividable couple. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 52(9-10), pp. 2228-2234, 2012. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
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14 | E. R. Weltevreden, S. J. Tesarski, Artur Wymyslowski, Müge Erinc, Alexander W. J. Gielen |
A multi-scale approach of the thermo-mechanical properties of silica-filled epoxies used in electronic packaging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 52(7), pp. 1300-1305, 2012. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
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14 | Michael Ferrara, Michael Stephens, Leslie Marchut, Chris Yang, Ventony Fryar, Preston Scott |
Analysis of in situ monitored thermal cycling benefits for wireless packaging early reliability evaluation. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 52(1), pp. 9-15, 2012. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
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14 | C. Y. Khor, Mohd Zulkifly Abdullah, H. J. Tony Tan, W. C. Leong, D. Ramdan |
Investigation of the fluid/structure interaction phenomenon in IC packaging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 52(1), pp. 241-252, 2012. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
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14 | Tadatomo Suga, Jenn-Ming Song, Yi-Shao Lai |
Guest Editorial - Low Temperature Processing for Microelectronics and Microsystems Packaging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 52(2), pp. 301, 2012. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
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14 | Rong Zhang, S. W. Ricky Lee |
Moldless encapsulation for LED wafer level packaging using integrated DRIE trenches. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 52(5), pp. 922-932, 2012. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
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14 | Liang Zhang, Cheng-wen He, Yong-huan Guo, Ji-guang Han, Yong-wei Zhang, Xu-yan Wang |
Development of SnAg-based lead free solders in electronics packaging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 52(3), pp. 559-578, 2012. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
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14 | Byung-seung Yim, Yumi Kwon, Seung Hoon Oh, Jooheon Kim, Yong-Eui Shin, Seong Hyuk Lee, Jongmin Kim 0004 |
Characteristics of solderable electrically conductive adhesives (ECAs) for electronic packaging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 52(6), pp. 1165-1173, 2012. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
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14 | Young Dae Ko, Injoon Noh, Hark Hwang |
Cost benefits from standardization of the packaging glass bottles. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Comput. Ind. Eng. ![In: Comput. Ind. Eng. 62(3), pp. 693-702, 2012. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
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14 | Mariska Kleemans, Paul Hendriks Vettehen, Johannes W. J. Beentjes, Rob Eisinga |
The Influence of Age and Gender on Preferences for Negative Content and Tabloid Packaging in Television News Stories. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Commun. Res. ![In: Commun. Res. 39(5), pp. 679-697, 2012. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
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14 | Michael Banck |
Packaging free software chemistry programs in Debian GNU/Linux: past, present and future. ![Search on Bibsonomy](Pics/bibsonomy.png) |
J. Cheminformatics ![In: J. Cheminformatics 4(S-1), pp. 4, 2012. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
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14 | Aditya N. Das, Rakesh Murthy, Dan O. Popa, Harry E. Stephanou |
A Multiscale Assembly and Packaging System for Manufacturing of Complex Micro-Nano Devices. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans Autom. Sci. Eng. ![In: IEEE Trans Autom. Sci. Eng. 9(1), pp. 160-170, 2012. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
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14 | Ron Roche |
Essential iOS Build and Release - A Comprehensive Guide to Building, Packaging, and Distribution. ![Search on Bibsonomy](Pics/bibsonomy.png) |
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2012 |
RDF |
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14 | Naeem Akhter |
Tracking Planar-textured Objects - On the Way to Transport Objects in Packaging Industry by Throwing and Catching. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICPRAM (2) ![In: ICPRAM 2012 - Proceedings of the 1st International Conference on Pattern Recognition Applications and Methods, Volume 2, Vilamoura, Algarve, Portugal, 6-8 February, 2012, pp. 316-321, 2012, SciTePress, 978-989-8425-99-7. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP BibTeX RDF |
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14 | Yu Wang 0034, Zhe Cheng, Junxuan Hou, Dongjian Cai, Bin Chen |
Quality inspection improvement for cheese packaging using machine vision. ![Search on Bibsonomy](Pics/bibsonomy.png) |
EIT ![In: 2012 IEEE International Conference on Electro/Information Technology, Indianapolis, IN, USA, May 6-8, 2012, pp. 1-5, 2012, IEEE, 978-1-4673-0819-9. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
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14 | Pavel Dzitac, Abdul Md. Mazid |
A depth sensor to control pick-and-place robots for fruit packaging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICARCV ![In: 12th International Conference on Control Automation Robotics & Vision, ICARCV 2012, Guangzhou, China, December 5-7, 2012, pp. 949-954, 2012, IEEE, 978-1-4673-1871-6. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
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14 | Asla Medeiros Sá, Karina Rodriguez-Echavarria, Martin Griffin, Derek Covill, Jaime Kaminski, David Arnold 0001 |
Parametric 3D-fitted Frames for Packaging Heritage Artefacts. ![Search on Bibsonomy](Pics/bibsonomy.png) |
VAST ![In: 13th International Symposium on Virtual Reality, Archaeology, and Cultural Heritage, incorporating the 10th Eurographics Workshop on Graphics and Cultural Heritage, VAST 2012, Brighton, UK, November 19-21, 2012, pp. 105-112, 2012, Eurographics Association, 978-3-905674-39-2. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
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14 | Martin Schuettler, Fabian Kohler, Juan S. Ordonez, Thomas Stieglitz |
Hermetic electronic packaging of an implantable brain-machine-interface with transcutaneous optical data communication. ![Search on Bibsonomy](Pics/bibsonomy.png) |
EMBC ![In: Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2012, San Diego, CA, USA, August 28 - September 1, 2012, pp. 3886-3889, 2012, IEEE, 978-1-4244-4119-8. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
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14 | Shem Lachhman, Christian A. Zorman, Wen H. Ko |
Multi-layered poly-dimethylsiloxane as a non-hermetic packaging material for medical MEMS. ![Search on Bibsonomy](Pics/bibsonomy.png) |
EMBC ![In: Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2012, San Diego, CA, USA, August 28 - September 1, 2012, pp. 1655-1658, 2012, IEEE, 978-1-4244-4119-8. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
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14 | Artin Petrossians, John J. Whalen, James D. Weiland, Florian Mansfeld |
Electrodeposition of platinum-iridium alloy nanowires for hermetic packaging of microelectronics. ![Search on Bibsonomy](Pics/bibsonomy.png) |
EMBC ![In: Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2012, San Diego, CA, USA, August 28 - September 1, 2012, pp. 727-730, 2012, IEEE, 978-1-4244-4119-8. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
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14 | David Welch 0002, Jennifer Blain Christen |
CMOS biosensor system for on-chip cell culture with read-out circuitry and microfluidic packaging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
EMBC ![In: Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2012, San Diego, CA, USA, August 28 - September 1, 2012, pp. 4990-4993, 2012, IEEE, 978-1-4244-4119-8. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
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14 | Juan Aceros, Ming Yin, David A. Borton, William R. Patterson, Christopher W. Bull, Arto V. Nurmikko |
Polymeric packaging for fully implantable wireless neural microsensors. ![Search on Bibsonomy](Pics/bibsonomy.png) |
EMBC ![In: Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2012, San Diego, CA, USA, August 28 - September 1, 2012, pp. 743-746, 2012, IEEE, 978-1-4244-4119-8. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
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14 | Ratchadawan Nimnual, Settachai Chaisanit |
M-learning for Eco-Packaging using KM. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICITST ![In: 7th International Conference for Internet Technology and Secured Transactions, ICITST 2012, London, United Kingdom, December 10-12, 2012, pp. 793-794, 2012, IEEE, 978-1-4673-5325-0. The full citation details ...](Pics/full.jpeg) |
2012 |
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14 | Jifeng Cui, Yong Zhang 0002, Chao Li 0012, Chunxiao Xing |
A Packaging Approach for Massive Amounts of Small Geospatial Files with HDFS. ![Search on Bibsonomy](Pics/bibsonomy.png) |
WAIM ![In: Web-Age Information Management - 13th International Conference, WAIM 2012, Harbin, China, August 18-20, 2012. Proceedings, pp. 210-215, 2012, Springer, 978-3-642-32280-8. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
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14 | Srinivasa Reddy Kuppireddi, Sayanu Pamidighantam, V. Janardhana, Oddvar Søråsen, J. S. Roy, R. G. Kulkarn |
Evaluation of SU8 photo polymer for microwave packaging applications. ![Search on Bibsonomy](Pics/bibsonomy.png) |
NORCHIP ![In: NORCHIP 2012, Copenhagen, Denmark, November 12-13, 2012, pp. 1-4, 2012, IEEE, 978-1-4673-2221-8. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
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14 | Shunsuke Makino, Takaharu Shimada, Kouichi Hirata, Kouki Yonezawa, Kimihito Ito |
A trim distance between positions as packaging signals in H3N2 influenza viruses. ![Search on Bibsonomy](Pics/bibsonomy.png) |
SCIS&ISIS ![In: The 6th International Conference on Soft Computing and Intelligent Systems (SCIS), and The 13th International Symposium on Advanced Intelligence Systems (ISIS), Kobe, Japan, November 20-24, 2012, pp. 1702-1707, 2012, IEEE, 978-1-4673-2742-8. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
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14 | Hyunmin Do, Chanhun Park, Jin Ho Kyung |
Dual arm robot for packaging and assembling of IT products. ![Search on Bibsonomy](Pics/bibsonomy.png) |
CASE ![In: 2012 IEEE International Conference on Automation Science and Engineering, CASE 2012, Seoul, Korea (South), August 20-24, 2012, pp. 1067-1070, 2012, IEEE, 978-1-4673-0429-0. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
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14 | Imran Khan, James Chong, Ridha Ben Mrad, Siyuan He, Michael J. Schertzer |
Performance of an electrostatic actuated micromirror in a vacuum and non-vacuum packaging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IECON ![In: 38th Annual Conference on IEEE Industrial Electronics Society, IECON 2012, Montreal, QC, Canada, October 25-28, 2012, pp. 3987-3990, 2012, IEEE, 978-1-4673-2419-9. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
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14 | Keith D. Underwood, Eric Borch |
Exploiting communication and packaging locality for cost-effective large scale networks. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICS ![In: International Conference on Supercomputing, ICS'12, Venice, Italy, June 25-29, 2012, pp. 291-300, 2012, ACM, 978-1-4503-1316-2. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
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14 | Nathan L. Ward, Xiaoyi Mu, Gustavo Serrano, Elizabeth Covington, Cagliyan Kurdak, Edward T. Zellers, Andrew J. Mason, Wen Li |
Adaptable chip-level microfluidic packaging for a micro-scale gas chromatograph. ![Search on Bibsonomy](Pics/bibsonomy.png) |
NEMS ![In: 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012, Kyoto, Japan, March 5-8, 2012, pp. 57-60, 2012, IEEE, 978-1-4673-1122-9. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
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14 | Songtao Jia, Min Miao, Runiu Fang, Shichao Guo, Duwei Hu, Yufeng Jin |
A 3D micro-channel cooling system embedded in LTCC packaging substrate. ![Search on Bibsonomy](Pics/bibsonomy.png) |
NEMS ![In: 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012, Kyoto, Japan, March 5-8, 2012, pp. 649-652, 2012, IEEE, 978-1-4673-1122-9. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
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14 | C. P. Wong |
Recent advances on nano-materials for advanced packaging applications. ![Search on Bibsonomy](Pics/bibsonomy.png) |
NEMS ![In: 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012, Kyoto, Japan, March 5-8, 2012, 2012, IEEE, 978-1-4673-1122-9. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
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14 | Norbert Pluschke, Peter Beckedahl |
Novel packaging technology for power modules. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ISIE ![In: 21st IEEE International Symposium on Industrial Electronics, ISIE 2012, Hangzhou, China, 28-31 May, 2012, pp. 420-424, 2012, IEEE. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
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14 | Asei Miyamoto, Taichi Hashimoto, Kenichi Makimura, Kensuke Kanda, Takayuki Fujita, Kazusuke Maenaka |
Wafer Level Packaging for MEMS Geiger Counter. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICETET ![In: 2012 Fifth International Conference on Emerging Trends in Engineering and Technology, Himeji, Japan, November 5-7, 2012, pp. 66-69, 2012, IEEE, 978-1-4799-0276-7. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
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14 | Maw-Tyan Sheen, Shin-Fuh Wang, Jun-Han Lee |
A new scheme of low-cost TO-based butterfly-type laser module packaging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
WOCC ![In: 21st Annual Wireless and Optical Communications Conference, WOCC 2012, Kaohsiung, Taiwan, April 19-21, 2012, pp. 198-200, 2012, IEEE, 978-1-4673-0940-0. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
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14 | Lin Li 0008, Xiaowen Liu, Andrew J. Mason |
Die-level photolithography and etchless parylene packaging processes for on-CMOS electrochemical biosensors. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ISCAS ![In: 2012 IEEE International Symposium on Circuits and Systems, ISCAS 2012, Seoul, Korea (South), May 20-23, 2012, pp. 2401-2404, 2012, IEEE, 978-1-4673-0218-0. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
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14 | Michael Roytman, Uday V. Shanbhag, Judith B. Cardell, C. Lindsay Anderson |
Packaging Energy and Reserves Bids through Risk Penalties for Enhanced Reliability in Co-optimized Markets. ![Search on Bibsonomy](Pics/bibsonomy.png) |
HICSS ![In: 45th Hawaii International International Conference on Systems Science (HICSS-45 2012), Proceedings, 4-7 January 2012, Grand Wailea, Maui, HI, USA, pp. 1915-1922, 2012, IEEE Computer Society, 978-0-7695-4525-7. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
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14 | Stefano Caselli, Michele Pattera, Massimo Ricci |
Towards Manufacturing Execution Systems for the Food and Beverage Packaging Industry. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICINCO (2) ![In: ICINCO 2012 - Proceedings of the 9th International Conference on Informatics in Control, Automation and Robotics, Volume 2, Rome, Italy, 28 - 31 July, 2012, pp. 552-556, 2012, SciTePress, 978-989-8565-22-8. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP BibTeX RDF |
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14 | Richard Crisp, Bill Gervasi, Wael Zohni, Bel Haba |
Cost-minimized double die DRAM packaging for ultra-high performance DDR3 and DDR4 multi-rank server DIMMs. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ISQED ![In: Thirteenth International Symposium on Quality Electronic Design, ISQED 2012, Santa Clara, CA, USA, March 19-21, 2012, pp. 437-444, 2012, IEEE, 978-1-4673-1034-5. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
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14 | Jens Taprogge, Felix Beyeler, Alexander Steinecker, Bradley J. Nelson |
Parallel Packaging of Micro Electro Mechanical Systems (MEMS) Using Self-alignment. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IPAS ![In: Precision Assembly Technologies and Systems - 6th IFIP WG 5.5 International Precision Assembly Seminar, IPAS 2012, Chamonix, France, February 12-15, 2012. Proceedings, pp. 28-35, 2012, Springer, 978-3-642-28162-4. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
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14 | Siva Kothamasu |
Embedded Tutorial ET3: Packaging Trends, Die Package Co-Design Flow and Challenges. ![Search on Bibsonomy](Pics/bibsonomy.png) |
VLSI Design ![In: 25th International Conference on VLSI Design, Hyderabad, India, January 7-11, 2012, pp. 35, 2012, IEEE Computer Society, 978-1-4673-0438-2. The full citation details ...](Pics/full.jpeg) |
2012 |
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