Search results for "Packaging"

Hits ?▲	Authors	Title	Venue	Year	Link
14	Maurits Diephuis, Svyatoslav Voloshynovskiy, Taras Holotyak, Nabil Stendardo, Bruno Keel	A framework for fast and secure packaging identification on mobile phones.	Media Watermarking, Security, and Forensics	2014	DBLP DOI BibTeX RDF
14	John W. Poulton, William J. Dally, Xi Chen 0033, John G. Eyles, Thomas H. Greer, Stephen G. Tell, John M. Wilson 0002, C. Thomas Gray	A 0.54 pJ/b 20 Gb/s Ground-Referenced Single-Ended Short-Reach Serial Link in 28 nm CMOS for Advanced Packaging Applications.	IEEE J. Solid State Circuits	2013	DBLP DOI BibTeX RDF
14	Ping Yang, Dongjing Liu, Yanfang Zhao, Yunqing Tang, Huan Wang	Approach on the Life-Prediction of Solder Joint for Electronic Packaging Under Combined Loading.	IEEE Trans. Reliab.	2013	DBLP DOI BibTeX RDF
14	Paul W. Coteus, Shawn Hall, Todd Takken, Rick A. Rand, S. Tian, Gerard V. Kopcsay, Randy Bickford, Francis P. Giordano, Christopher Marroquin, Mark J. Jeanson	Packaging the IBM Blue Gene/Q supercomputer.	IBM J. Res. Dev.	2013	DBLP DOI BibTeX RDF
14	Wei-Ling Wang, Chiao-Tzu Huang, Shu-Jen Wang, Chia-Pao Chang, Hui-Wen Liao	Application of RFID on equipment parts readiness management system of semiconductor packaging plant.	Int. J. Inf. Technol. Manag.	2013	DBLP DOI BibTeX RDF
14	Huang-Kuang Kung, Hung-Shyong Chen, Ming-Cheng Lu	The wire sag problem in wire bonding technology for semiconductor packaging.	Microelectron. Reliab.	2013	DBLP DOI BibTeX RDF
14	Charles E. Bauer, Herbert J. Neuhaus	Embedded packaging and assembly; Reliability and supply chain implications.	Microelectron. Reliab.	2013	DBLP DOI BibTeX RDF
14	Didier Chicot, K. Tilkin, K. Jankowski, Artur Wymyslowski	Reliability analysis of solder joints due to creep and fatigue in microelectronic packaging using microindentation technique.	Microelectron. Reliab.	2013	DBLP DOI BibTeX RDF
14	Pierre-Louis Charvet, P. Nicolas, D. Bloch, B. Savornin	MEMS packaging reliability assessment: Residual Gas Analysis of gaseous species trapped inside MEMS cavities.	Microelectron. Reliab.	2013	DBLP DOI BibTeX RDF
14	Gang Chen 0028, Ze-Sheng Zhang, Yun-Hui Mei, Xin Li 0039, Guo-Quan Lu, Xu Chen	Ratcheting behavior of sandwiched assembly joined by sintered nanosilver for power electronics packaging.	Microelectron. Reliab.	2013	DBLP DOI BibTeX RDF
14	Peter Dietrich	Trends in automotive power semiconductor packaging.	Microelectron. Reliab.	2013	DBLP DOI BibTeX RDF
14	J. Keller, Raul Mrossko, H. Dobrinski, J. Stürmann, Ralf Döring, Rainer Dudek, Sven Rzepka, Bernd Michel	Effect of moisture swelling on MEMS packaging and integrated sensors.	Microelectron. Reliab.	2013	DBLP DOI BibTeX RDF
14	C. Y. Khor, Mohd Zulkifly Abdullah	Analysis of fluid/structure interaction: Influence of silicon chip thickness in moulded packaging.	Microelectron. Reliab.	2013	DBLP DOI BibTeX RDF
14	Yao Yao 0003, Leon M. Keer	Cohesive fracture mechanics based numerical analysis to BGA packaging and lead free solders under drop impact.	Microelectron. Reliab.	2013	DBLP DOI BibTeX RDF
14	Wen-Hwa Chen, Ching-Feng Yu, Hsien-Chie Cheng, Yu-min Tsai, Su-Tsai Lu	IMC growth reaction and its effects on solder joint thermal cycling reliability of 3D chip stacking packaging.	Microelectron. Reliab.	2013	DBLP DOI BibTeX RDF
14	Xingming Long, Rui-Jin Liao, Jing Zhou, Zhi Zeng	Thermal uniformity of packaging multiple light-emitting diodes embedded in aluminum-core printed circuit boards.	Microelectron. Reliab.	2013	DBLP DOI BibTeX RDF
14	Xiang Xi, Xuezhong Wu, Yulie Wu, Yongmeng Zhang, Yi Tao, Yu Zheng 0003, Dingbang Xiao	Structural-Acoustic Coupling Effects on the Non-Vacuum Packaging Vibratory Cylinder Gyroscope.	Sensors	2013	DBLP DOI BibTeX RDF
14	Yong-Liang Yang, Qi-Xing Huang	TrayGen: Arranging Objects for Exhibition and Packaging.	Comput. Graph. Forum	2013	DBLP DOI BibTeX RDF
14	Juhi Agarwal, R. H. Goudar, Nishkarsh Sharma, Pratik Kumar, Vishesh Parshav, Robin Sharma, Sreenivasa Rao	Cost effective dynamic packaging systems in E-tourism using semantic web.	ICACCI	2013	DBLP DOI BibTeX RDF
14	Clara Ceppa, Gian Paolo Marino	A Virtual Web Net to Eco-manage Food Packaging Waste.	CSDM	2013	DBLP DOI BibTeX RDF
14	Marius Bazu, Virgil Emil Ilian, Dragos Varsescu, Lucian Galateanu, Vili Sikio, Meelis Reimets, Volker Uhl, Manuel Weiss	Reliability tests for discriminating between technological variants of QFN packaging.	ESSDERC	2013	DBLP DOI BibTeX RDF
14	Manja Lohse, Britta Wrede, Lars Schillingmann	Enabling robots to make use of the structure of human actions - A user study employing Acoustic Packaging.	RO-MAN	2013	DBLP DOI BibTeX RDF
14	Jürgen Blume, Alexander Bannat, Gerhard Rigoll, M. Rooker, A. Angerer, Claus Lenz	Programming concept for an industrial HRI packaging cell.	RO-MAN	2013	DBLP DOI BibTeX RDF
14	Sébastien Destercke, Patrice Buche, Brigitte Charnomordic, Valérie Guillard	Decision support system using flexible query and reliability assessment - application to biodegradable and biosourced packaging design.	FUZZ-IEEE	2013	DBLP DOI BibTeX RDF
14	Katsuya Kikuchi, Fumiki Kato, Shunsuke Nemoto, Hiroshi Nakagawa, Masahiro Aoyagi, Youtaro Yasu, Kohji Koshiji	Investigation of optimized high-density flip-chip interconnect design including micro Au bumps for 3-D stacked LSI packaging.	3DIC	2013	DBLP DOI BibTeX RDF
14	Kentaro Mori, Yoshihiro Ono, Shinji Watanabe 0004, Toshikazu Ishikawa, Michiaki Sugiyama, Satoshi Imasu, Toshihiko Ochiai, Ryo Mori, Tsuyoshi Kida, Tomoaki Hashimoto, Hideki Tanaka, Michitaka Kimura	High density and reliable packaging technology with Non Conductive Film for 3D/TSV.	3DIC	2013	DBLP DOI BibTeX RDF
14	Yuri Sylvester, Luke Hunter, Bruce Johnson, Raleigh Estrada	3D X-ray microscopy: A near-SEM non-destructive imaging technology used in the development of 3D IC packaging.	3DIC	2013	DBLP DOI BibTeX RDF
14	Seung Hwan Park, Cheong-Sool Park, Jun-Seok Kim, Sung-Shick Kim, Jun-Geol Baek, Daewoong An	Data Mining Approaches for Packaging Yield Prediction in the Post-fabrication Process.	BigData Congress	2013	DBLP DOI BibTeX RDF
14	Yichao Xu, Guanjiang Wang, Xin Sun 0003, Runiu Fang, Min Miao, Yufeng Jin	In-line testing of blind TSVs for 3D IC integration and M/NEMS packaging.	NEMS	2013	DBLP DOI BibTeX RDF
14	Mengying Zhang, Lidong Du, Zhan Zhao, Zhen Fang 0003	Low-stress packaging for a MEMS atmosphere pressure sensor.	NEMS	2013	DBLP DOI BibTeX RDF
14	Xu Mao, Zhiqiang Fang, Zhe Zhang, Jinling Yan, Zhimei Qi, Fuhua Yang	Sn-rich Au-Sn hermetic packaging at wafer level and its application in SPR sensor.	NEMS	2013	DBLP DOI BibTeX RDF
14	Camilla Baj-Rossi, Enver G. Kilinc, Sara S. Ghoreishizadeh, Daniele Casarino, Tanja Rezzonico Jost, Catherine Dehollain, Fabio Grassi, Laura Pastorino, Giovanni De Micheli, Sandro Carrara	Fabrication and packaging of a fully implantable biosensor array.	BioCAS	2013	DBLP DOI BibTeX RDF
14	Roman P. Bazylevych, Lubov Bazylevych	The methodology and algorithms for solving the very large-scale physical design automation problems: Partitioning, packaging, placement and routing.	MECO	2013	DBLP DOI BibTeX RDF
14	Ricardo Morales, Francisco J. Badesa, Nicolás García Aracil, Richard Bormann, Jan Fischer, Birgit Graf	Bimanual Robot Manipulation and Packaging of Shoes in Footwear Industry.	ROBOT (1)	2013	DBLP DOI BibTeX RDF
14	Zhengyu Ba, X. Yuan, Lei Jia, Xinjun Sheng, Zhenhua Xiong, Han Ding 0001	A Novel Conductive Particle Dispersing Method via EHDA for POB-COG Packaging.	ICIRA (2)	2013	DBLP DOI BibTeX RDF
14	John W. Poulton, William J. Dally, Xi Chen 0033, John G. Eyles, Thomas H. Greer, Stephen G. Tell, C. Thomas Gray	A 0.54pJ/b 20Gb/s ground-referenced single-ended short-haul serial link in 28nm CMOS for advanced packaging applications.	ISSCC	2013	DBLP DOI BibTeX RDF
14	Luigi Biagiotti, Claudio Melchiorri, M. Pilati, G. Mazzuchetti, G. Collepalumbo, P. Ragazzini	Integration of robotic systems in a packaging machine: A tool for design and simulation of efficient motion trajectories.	ETFA	2013	DBLP DOI BibTeX RDF
14	Casey Robinson, Douglas Thain	Automated packaging of bioinformatics workflows for portability and durability using makeflow.	WORKS@SC	2013	DBLP DOI BibTeX RDF
14	Kawai Chui, Hsiang-Lin Yeh, Wen-Chun Lan, Yu-Han Cheng	Clausal-Packaging of Path of Motion in Second Language Acquisition of Russian and Spanish.	PACLIC	2013	DBLP BibTeX RDF
14	Shane Loughlin, John McGrory	A method of classifying industrial assembly and packaging equipment.	INDIN	2013	DBLP DOI BibTeX RDF
14	Miroslav Kotzev	Probing and fixturing techniques for wideband multiport measurements in digital packaging.		2013	RDF
14	Giacomo Langfelder, Stefano Dellea, Federico Zaraga, Dario Cucchi, Mikel Azpeitia Urquia	The Dependence of Fatigue in Microelectromechanical Systems on the Environment and the Industrial Packaging.	IEEE Trans. Ind. Electron.	2012	DBLP DOI BibTeX RDF
14	Richard Bloss	PACK EXPO show highlighted how important robotics are to packaging.	Ind. Robot	2012	DBLP DOI BibTeX RDF
14	Martin George Wynn, Oludotun Olubanjo	Demand-supply chain management: systems implications in an SME packaging business in the UK.	Int. J. Manuf. Res.	2012	DBLP DOI BibTeX RDF
14	Patrick W. Ruch, Thomas Brunschwiler, Werner Escher, Stephan Paredes, Bruno Michel	Bionic Packaging: A Promising Paradigm for Future Computing.	ERCIM News	2012	DBLP BibTeX RDF
14	Jun Wang 0029, Yasir Khan, L. X. Lu, Z. W. Wang	Inner resonance of a coupled hyperbolic tangent nonlinear oscillator arising in a packaging system.	Appl. Math. Comput.	2012	DBLP DOI BibTeX RDF
14	Osanori Koyama, Ryou Sougen, Keisuke Ikushima, Makoto Yamada, Yutaka Katsuyama	Optical Fan-Out Adapter for Compact Packaging of Components by a Jacket Removing System with a CO2 Laser.	IEICE Trans. Commun.	2012	DBLP DOI BibTeX RDF
14	Thomas Strach, Frank E. Bosco, Kenneth L. Christian, Kevin R. Covi, Martin Eckert, Gregory R. Edlund, Roland Frech, Hubert Harrer, Andreas Huber, Dierk Kaller, Martin Kindscher, A. Z. Muszynski, G. A. Peterson, Claudio Siviero, Jochen Supper, Otto A. Torreiter, Thomas-Michael Winkel	Electronic packaging of the IBM System z196 enterprise-class server processor cage.	IBM J. Res. Dev.	2012	DBLP DOI BibTeX RDF
14	Daisuke Inoue, Yoshitaka Yanagihara, Hiroshi Ueno, Shin'ichiro Nishida	Model Tests of Regolith Packaging Mechanism.	J. Robotics Mechatronics	2012	DBLP DOI BibTeX RDF
14	Mu-Chien Chou, Regina W. Y. Wang	Displayability: An assessment of differentiation design for the findability of bottle packaging.	Displays	2012	DBLP DOI BibTeX RDF
14	He-Yau Kang, Amy H. I. Lee, Cheng-Yan Yang	A fuzzy ANP model for supplier selection as applied to IC packaging.	J. Intell. Manuf.	2012	DBLP DOI BibTeX RDF
14	Tolga Aydinliyim, Michael S. Pangburn	Reducing Packaging Waste and Cost via Consumer Price Discounts.	Decis. Sci.	2012	DBLP DOI BibTeX RDF
14	George J. Besseris	Profiling effects in industrial data mining by non-parametric DOE methods: An application on screening checkweighing systems in packaging operations.	Eur. J. Oper. Res.	2012	DBLP DOI BibTeX RDF
14	Dario Pacciarelli, Andrea D'Ariano	Increasing the Reliability of Production Schedules in a Pharmaceutical Packaging Department.	J. Medical Syst.	2012	DBLP DOI BibTeX RDF
14	Ching-Hsiang Chang, Yeong-Lin Lai, Chih-Cheng Chen	Implement the RFID Position Based System of Automatic Tablets Packaging Machine for Patient Safety.	J. Medical Syst.	2012	DBLP DOI BibTeX RDF
14	E. J. Cheng, Yu-Lin Shen	Thermal expansion behavior of through-silicon-via structures in three-dimensional microelectronic packaging.	Microelectron. Reliab.	2012	DBLP DOI BibTeX RDF
14	Andrej Ivankovic, Kris Vanstreels, Daniel Vanderstraeten, Guy Brizar, Renaud Gillon, Eddy Blansaer, Bart Vandevelde	Comparison of experimental methods for the extraction of the elastic modulus of molding compounds used in IC packaging.	Microelectron. Reliab.	2012	DBLP DOI BibTeX RDF
14	Cheng-Yi Liu, S. W. Ricky Lee, Moo Whan Shin, Yi-Shao Lai	Reliability of high-power LED packaging and assembly.	Microelectron. Reliab.	2012	DBLP DOI BibTeX RDF
14	Minseok Ha, Samuel Graham	Development of a thermal resistance model for chip-on-board packaging of high power LED arrays.	Microelectron. Reliab.	2012	DBLP DOI BibTeX RDF
14	Harrie A. C. Tilmans, Jeroen De Coster, Philippe Hélin, Vladimir Cherman, Anne Jourdain, Piet De Moor, Bart Vandevelde, Nga P. Pham, Joseph Zekry, Ann Witvrouw, Ingrid De Wolf	MEMS packaging and reliability: An undividable couple.	Microelectron. Reliab.	2012	DBLP DOI BibTeX RDF
14	E. R. Weltevreden, S. J. Tesarski, Artur Wymyslowski, Müge Erinc, Alexander W. J. Gielen	A multi-scale approach of the thermo-mechanical properties of silica-filled epoxies used in electronic packaging.	Microelectron. Reliab.	2012	DBLP DOI BibTeX RDF
14	Michael Ferrara, Michael Stephens, Leslie Marchut, Chris Yang, Ventony Fryar, Preston Scott	Analysis of in situ monitored thermal cycling benefits for wireless packaging early reliability evaluation.	Microelectron. Reliab.	2012	DBLP DOI BibTeX RDF
14	C. Y. Khor, Mohd Zulkifly Abdullah, H. J. Tony Tan, W. C. Leong, D. Ramdan	Investigation of the fluid/structure interaction phenomenon in IC packaging.	Microelectron. Reliab.	2012	DBLP DOI BibTeX RDF
14	Tadatomo Suga, Jenn-Ming Song, Yi-Shao Lai	Guest Editorial - Low Temperature Processing for Microelectronics and Microsystems Packaging.	Microelectron. Reliab.	2012	DBLP DOI BibTeX RDF
14	Rong Zhang, S. W. Ricky Lee	Moldless encapsulation for LED wafer level packaging using integrated DRIE trenches.	Microelectron. Reliab.	2012	DBLP DOI BibTeX RDF
14	Liang Zhang, Cheng-wen He, Yong-huan Guo, Ji-guang Han, Yong-wei Zhang, Xu-yan Wang	Development of SnAg-based lead free solders in electronics packaging.	Microelectron. Reliab.	2012	DBLP DOI BibTeX RDF
14	Byung-seung Yim, Yumi Kwon, Seung Hoon Oh, Jooheon Kim, Yong-Eui Shin, Seong Hyuk Lee, Jongmin Kim 0004	Characteristics of solderable electrically conductive adhesives (ECAs) for electronic packaging.	Microelectron. Reliab.	2012	DBLP DOI BibTeX RDF
14	Young Dae Ko, Injoon Noh, Hark Hwang	Cost benefits from standardization of the packaging glass bottles.	Comput. Ind. Eng.	2012	DBLP DOI BibTeX RDF
14	Mariska Kleemans, Paul Hendriks Vettehen, Johannes W. J. Beentjes, Rob Eisinga	The Influence of Age and Gender on Preferences for Negative Content and Tabloid Packaging in Television News Stories.	Commun. Res.	2012	DBLP DOI BibTeX RDF
14	Michael Banck	Packaging free software chemistry programs in Debian GNU/Linux: past, present and future.	J. Cheminformatics	2012	DBLP DOI BibTeX RDF
14	Aditya N. Das, Rakesh Murthy, Dan O. Popa, Harry E. Stephanou	A Multiscale Assembly and Packaging System for Manufacturing of Complex Micro-Nano Devices.	IEEE Trans Autom. Sci. Eng.	2012	DBLP DOI BibTeX RDF
14	Ron Roche	Essential iOS Build and Release - A Comprehensive Guide to Building, Packaging, and Distribution.		2012	RDF
14	Naeem Akhter	Tracking Planar-textured Objects - On the Way to Transport Objects in Packaging Industry by Throwing and Catching.	ICPRAM (2)	2012	DBLP BibTeX RDF
14	Yu Wang 0034, Zhe Cheng, Junxuan Hou, Dongjian Cai, Bin Chen	Quality inspection improvement for cheese packaging using machine vision.	EIT	2012	DBLP DOI BibTeX RDF
14	Pavel Dzitac, Abdul Md. Mazid	A depth sensor to control pick-and-place robots for fruit packaging.	ICARCV	2012	DBLP DOI BibTeX RDF
14	Asla Medeiros Sá, Karina Rodriguez-Echavarria, Martin Griffin, Derek Covill, Jaime Kaminski, David Arnold 0001	Parametric 3D-fitted Frames for Packaging Heritage Artefacts.	VAST	2012	DBLP DOI BibTeX RDF
14	Martin Schuettler, Fabian Kohler, Juan S. Ordonez, Thomas Stieglitz	Hermetic electronic packaging of an implantable brain-machine-interface with transcutaneous optical data communication.	EMBC	2012	DBLP DOI BibTeX RDF
14	Shem Lachhman, Christian A. Zorman, Wen H. Ko	Multi-layered poly-dimethylsiloxane as a non-hermetic packaging material for medical MEMS.	EMBC	2012	DBLP DOI BibTeX RDF
14	Artin Petrossians, John J. Whalen, James D. Weiland, Florian Mansfeld	Electrodeposition of platinum-iridium alloy nanowires for hermetic packaging of microelectronics.	EMBC	2012	DBLP DOI BibTeX RDF
14	David Welch 0002, Jennifer Blain Christen	CMOS biosensor system for on-chip cell culture with read-out circuitry and microfluidic packaging.	EMBC	2012	DBLP DOI BibTeX RDF
14	Juan Aceros, Ming Yin, David A. Borton, William R. Patterson, Christopher W. Bull, Arto V. Nurmikko	Polymeric packaging for fully implantable wireless neural microsensors.	EMBC	2012	DBLP DOI BibTeX RDF
14	Ratchadawan Nimnual, Settachai Chaisanit	M-learning for Eco-Packaging using KM.	ICITST	2012	DBLP BibTeX RDF
14	Jifeng Cui, Yong Zhang 0002, Chao Li 0012, Chunxiao Xing	A Packaging Approach for Massive Amounts of Small Geospatial Files with HDFS.	WAIM	2012	DBLP DOI BibTeX RDF
14	Srinivasa Reddy Kuppireddi, Sayanu Pamidighantam, V. Janardhana, Oddvar Søråsen, J. S. Roy, R. G. Kulkarn	Evaluation of SU8 photo polymer for microwave packaging applications.	NORCHIP	2012	DBLP DOI BibTeX RDF
14	Shunsuke Makino, Takaharu Shimada, Kouichi Hirata, Kouki Yonezawa, Kimihito Ito	A trim distance between positions as packaging signals in H3N2 influenza viruses.	SCIS&ISIS	2012	DBLP DOI BibTeX RDF
14	Hyunmin Do, Chanhun Park, Jin Ho Kyung	Dual arm robot for packaging and assembling of IT products.	CASE	2012	DBLP DOI BibTeX RDF
14	Imran Khan, James Chong, Ridha Ben Mrad, Siyuan He, Michael J. Schertzer	Performance of an electrostatic actuated micromirror in a vacuum and non-vacuum packaging.	IECON	2012	DBLP DOI BibTeX RDF
14	Keith D. Underwood, Eric Borch	Exploiting communication and packaging locality for cost-effective large scale networks.	ICS	2012	DBLP DOI BibTeX RDF
14	Nathan L. Ward, Xiaoyi Mu, Gustavo Serrano, Elizabeth Covington, Cagliyan Kurdak, Edward T. Zellers, Andrew J. Mason, Wen Li	Adaptable chip-level microfluidic packaging for a micro-scale gas chromatograph.	NEMS	2012	DBLP DOI BibTeX RDF
14	Songtao Jia, Min Miao, Runiu Fang, Shichao Guo, Duwei Hu, Yufeng Jin	A 3D micro-channel cooling system embedded in LTCC packaging substrate.	NEMS	2012	DBLP DOI BibTeX RDF
14	C. P. Wong	Recent advances on nano-materials for advanced packaging applications.	NEMS	2012	DBLP DOI BibTeX RDF
14	Norbert Pluschke, Peter Beckedahl	Novel packaging technology for power modules.	ISIE	2012	DBLP DOI BibTeX RDF
14	Asei Miyamoto, Taichi Hashimoto, Kenichi Makimura, Kensuke Kanda, Takayuki Fujita, Kazusuke Maenaka	Wafer Level Packaging for MEMS Geiger Counter.	ICETET	2012	DBLP DOI BibTeX RDF
14	Maw-Tyan Sheen, Shin-Fuh Wang, Jun-Han Lee	A new scheme of low-cost TO-based butterfly-type laser module packaging.	WOCC	2012	DBLP DOI BibTeX RDF
14	Lin Li 0008, Xiaowen Liu, Andrew J. Mason	Die-level photolithography and etchless parylene packaging processes for on-CMOS electrochemical biosensors.	ISCAS	2012	DBLP DOI BibTeX RDF
14	Michael Roytman, Uday V. Shanbhag, Judith B. Cardell, C. Lindsay Anderson	Packaging Energy and Reserves Bids through Risk Penalties for Enhanced Reliability in Co-optimized Markets.	HICSS	2012	DBLP DOI BibTeX RDF
14	Stefano Caselli, Michele Pattera, Massimo Ricci	Towards Manufacturing Execution Systems for the Food and Beverage Packaging Industry.	ICINCO (2)	2012	DBLP BibTeX RDF
14	Richard Crisp, Bill Gervasi, Wael Zohni, Bel Haba	Cost-minimized double die DRAM packaging for ultra-high performance DDR3 and DDR4 multi-rank server DIMMs.	ISQED	2012	DBLP DOI BibTeX RDF
14	Jens Taprogge, Felix Beyeler, Alexander Steinecker, Bradley J. Nelson	Parallel Packaging of Micro Electro Mechanical Systems (MEMS) Using Self-alignment.	IPAS	2012	DBLP DOI BibTeX RDF
14	Siva Kothamasu	Embedded Tutorial ET3: Packaging Trends, Die Package Co-Design Flow and Challenges.	VLSI Design	2012	DBLP DOI BibTeX RDF