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Found 140 publication records. Showing 140 according to the selection in the facets
Hits ?▲ |
Authors |
Title |
Venue |
Year |
Link |
Author keywords |
28 | Tadahiro Shibutani, Qiang Yu, Masaki Shiratori |
Effect of Creep Properties on Pressure Induced Tin Whisker Formation. ![Search on Bibsonomy](Pics/bibsonomy.png) |
SSIRI ![In: Second International Conference on Secure System Integration and Reliability Improvement, SSIRI 2008, July 14-17, 2008, Yokohama, Japan, pp. 197-198, 2008, IEEE Computer Society, 978-0-7695-3266-0. The full citation details ...](Pics/full.jpeg) |
2008 |
DBLP DOI BibTeX RDF |
lead-free, tin whisker, creep, tin-copper, tin-lead, pressure |
26 | Marwa S. S. Basyoni, Mostafa M. Salah, Mohamed Mousa, Ahmed Shaker, Abdelhalim Zekry, Mohamed Abouelatta, Mohammad T. Alshammari, Kawther A. Al-Dhlan, Christian Gontrand |
On the Investigation of Interface Defects of Solar Cells: Lead-Based vs Lead-Free Perovskite. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Access ![In: IEEE Access 9, pp. 130221-130232, 2021. The full citation details ...](Pics/full.jpeg) |
2021 |
DBLP DOI BibTeX RDF |
|
26 | S. B. Park, Rahul Joshi |
Comparison of thermo-mechanical behavior of lead-free copper and tin-lead column grid array packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 48(5), pp. 763-772, 2008. The full citation details ...](Pics/full.jpeg) |
2008 |
DBLP DOI BibTeX RDF |
|
26 | Desmond Y. R. Chong, F. X. Che, John H. L. Pang, Kellin Ng, Jane Y. N. Tan, Patrick T. H. Low |
Drop impact reliability testing for lead-free and lead-based soldered IC packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 46(7), pp. 1160-1171, 2006. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
|
26 | F. A. Stam, E. Davitt |
Effects of thermomechanical cycling on lead and lead-free (SnPb and SnAgCu) surface mount solder joints. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 41(11), pp. 1815-1822, 2001. The full citation details ...](Pics/full.jpeg) |
2001 |
DBLP DOI BibTeX RDF |
|
20 | Ming-Hung Shu, Bi-Min Hsu, Min-Chuan Hu |
Optimal combination of soldering conditions of BGA for halogen-free and lead-free SMT-green processes. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 52(11), pp. 2690-2700, 2012. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
|
20 | Cho-Liang Chung, Liang-Tien Lu, Yao-Jung Lee |
Influence of halogen-free compound and lead-free solder paste on on-board reliability of green CSP (chip scale package). ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 45(12), pp. 1916-1923, 2005. The full citation details ...](Pics/full.jpeg) |
2005 |
DBLP DOI BibTeX RDF |
|
16 | Md Ferdous Wahid, Md. Shahriar Rahman, Nowshad Ahmed, Abdullah Al Mamun, Md. Nuralam Howlader, Tarpan Paul, Md. Motiur Rahman Tareq, Md. Sazedur Rahman, Md. Mizanur Rahman |
Performance Enhancement of Lead-Free CsSnI3 Perovskite Solar Cell: Design and Simulation With Different Electron Transport Layers. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Access ![In: IEEE Access 12, pp. 8296-8312, 2024. The full citation details ...](Pics/full.jpeg) |
2024 |
DBLP DOI BibTeX RDF |
|
16 | Saeed Baghaee Ivriq, Kjeld Laursen, Aske Møller Jørgensen, Tanmay Mondal, Milad Zamani, Yasser Rezaeiyan, Brian Corbett, Bo Brummerstedt Iversen, Farshad Moradi |
A System-Level Feasibility Study of a Lead-Free Ultrasonically Powered Light Delivery Implant for Optogenetics. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Adv. Intell. Syst. ![In: Adv. Intell. Syst. 6(3), March 2024. The full citation details ...](Pics/full.jpeg) |
2024 |
DBLP DOI BibTeX RDF |
|
16 | Cheng-Ying Li, Ze-Hui Chen, Hsueh-Yu Kao, Sheng-Kai Chang, Po-Yu Hsiao, Yen-Hsiang Huang, Yu-Chieh Huang, Sheng-Yuan Chu, Chia-Ling Wei, Yun-Hui Liu, Kuang-Wei Cheng, Cheng-Che Tsai |
Design and Development of a Low-Power Wireless MEMS Lead-Free Piezoelectric Accelerometer System. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Instrum. Meas. ![In: IEEE Trans. Instrum. Meas. 72, pp. 1-11, 2023. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
16 | Samah Al-Qaisi, Abdelazim M. Mebed, Muhammad Mushtaq, D. P. Rai, Tahani A. Alrebdi, Rais Ahmad Sheikh, Habib Rached, R. Ahmed, Muhammad Faizan, S. Bouzgarrou, Muhammad Anjum Javed |
A theoretical investigation of the lead-free double perovskites halides Rb2XCl6 (X = Se, Ti) for optoelectronic and thermoelectric applications. ![Search on Bibsonomy](Pics/bibsonomy.png) |
J. Comput. Chem. ![In: J. Comput. Chem. 44(19), pp. 1690-1703, 2023. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
16 | Min-Ku Lee, Byung-Hoon Kim, Gyoung-Ja Lee |
Lead-Free Piezoelectric Acceleration Sensor Built Using a (K,Na)NbO3 Bulk Ceramic Modified by Bi-Based Perovskites. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Sensors ![In: Sensors 23(2), pp. 1029, January 2023. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
16 | A. Maoucha, Fayçal Djeffal, Hichem Ferhati |
Numerical Investigation of a New Double-Absorber Lead-free Perovskite Solar Cell via SCAPS-1D. ![Search on Bibsonomy](Pics/bibsonomy.png) |
CCE ![In: 20th International Conference on Electrical Engineering, Computing Science and Automatic Control, CCE 2023, Mexico City, Mexico, October 25-27, 2023, pp. 1-5, 2023, IEEE, 979-8-3503-0676-7. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
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16 | Swapnadeep Poddar, Zhesi Chen, Zichao Ma, Yuting Zhang, Chak Lam Jonathan Chan, Beitao Ren, Qianpeng Zhang, Daquan Zhang, Guozhen Shen, Haibo Zeng 0002, Zhiyong Fan |
Robust Lead-Free Perovskite Nanowire Array-Based Artificial Synapses Exemplifying Gestalt Principle of Closure via a Letter Recognition Scheme. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Adv. Intell. Syst. ![In: Adv. Intell. Syst. 4(7), 2022. The full citation details ...](Pics/full.jpeg) |
2022 |
DBLP DOI BibTeX RDF |
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16 | Swapnadeep Poddar, Zhesi Chen, Zichao Ma, Yuting Zhang, Chak Lam Jonathan Chan, Beitao Ren, Qianpeng Zhang, Daquan Zhang, Guozhen Shen, Haibo Zeng 0002, Zhiyong Fan |
Robust Lead-Free Perovskite Nanowire Array-Based Artificial Synapses Exemplifying Gestalt Principle of Closure via a Letter Recognition Scheme. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Adv. Intell. Syst. ![In: Adv. Intell. Syst. 4(7), 2022. The full citation details ...](Pics/full.jpeg) |
2022 |
DBLP DOI BibTeX RDF |
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16 | Gabriel Barrientos, Giacomo Clementi, Carlo Trigona, Merieme Ouhabaz, Ludovic Gauthier-Manuel, Djaffar Belharet, Samuel Margueron, Ausrine Bartasyte, Graziella Malandrino, Salvatore Baglio |
Lead-Free LiNbO3 Thick Film MEMS Kinetic Cantilever Beam Sensor/Energy Harvester. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Sensors ![In: Sensors 22(2), pp. 559, 2022. The full citation details ...](Pics/full.jpeg) |
2022 |
DBLP DOI BibTeX RDF |
|
16 | Danjela Kuscer, Brigita Kmet, Silvo Drnovsek, Julien Bustillo, Franck Levassort |
Lead-Free Sodium Potassium Niobate-Based Multilayer Structures for Ultrasound Transducer Applications. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Sensors ![In: Sensors 22(9), pp. 3223, 2022. The full citation details ...](Pics/full.jpeg) |
2022 |
DBLP DOI BibTeX RDF |
|
16 | J. Lakshmi Prasanna, Ekta Goel, Amarjit Kumar, Atul Kumar |
Computational Study of Perovskite/Perovskite Lead-free Tandem Solar Cell Devices. ![Search on Bibsonomy](Pics/bibsonomy.png) |
iSES ![In: IEEE International Symposium on Smart Electronic Systems, iSES 2022, Warangal, India, December 18-22, 2022, pp. 257-262, 2022, IEEE, 979-8-3503-9922-6. The full citation details ...](Pics/full.jpeg) |
2022 |
DBLP DOI BibTeX RDF |
|
16 | Dalel Missaoui, Ayda Bouhamed, Khawla Jeder, Amina Ben Ayed, Anouar Njeh, Olfa Kanoun |
Flexible Lead-Free BCT/PDMS-Based Nanogenerator as Piezoelectric Energy Harvester. ![Search on Bibsonomy](Pics/bibsonomy.png) |
SSD ![In: 19th International Multi-Conference on Systems, Signals & Devices, SSD 2022, Sétif, Algeria, May 6-10, 2022, pp. 416-420, 2022, IEEE, 978-1-6654-7108-4. The full citation details ...](Pics/full.jpeg) |
2022 |
DBLP DOI BibTeX RDF |
|
16 | Syed Abdul Moiz, Ahmed Naif M. Alahmadi, Abdulah Jeza Aljohani |
Design of a Novel Lead-Free Perovskite Solar Cell for 17.83% Efficiency. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Access ![In: IEEE Access 9, pp. 54254-54263, 2021. The full citation details ...](Pics/full.jpeg) |
2021 |
DBLP DOI BibTeX RDF |
|
16 | Kyungmin Kim, Jinhee Yoo, Hae Gyun Lim, Mina Lee 0005, Sung-Min Park 0001, Hyung Ham Kim |
Lead-Free Piezoelectric Composite With Lithium Niobate and Barium Titanate Fabricated by Interdigital Pair Bonding Technique. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Access ![In: IEEE Access 9, pp. 85894-85902, 2021. The full citation details ...](Pics/full.jpeg) |
2021 |
DBLP DOI BibTeX RDF |
|
16 | Tomas Janusas, Sigita Urbaite, Arvydas Palevicius, Sohrab Nasiri, Giedrius Janusas |
Biologically Compatible Lead-Free Piezoelectric Composite for Acoustophoresis Based Particle Manipulation Techniques. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Sensors ![In: Sensors 21(2), pp. 483, 2021. The full citation details ...](Pics/full.jpeg) |
2021 |
DBLP DOI BibTeX RDF |
|
16 | Dong-Jin Shin, Woo-Seok Kang, Dong-Hwan Lim, Bo-Kun Koo, Min-Soo Kim, Soon-Jong Jeong, In-Sung Kim |
Lead-Free AE Sensor Based on BZT-BCT Ceramics. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Sensors ![In: Sensors 21(21), pp. 7100, 2021. The full citation details ...](Pics/full.jpeg) |
2021 |
DBLP DOI BibTeX RDF |
|
16 | Chien-Min Hun, Ching-Ho Tien, Kuan-Lin Lee, Hong-Ye Lai, Lung-Chien Chen |
The Effects of Temperature on the Growth of a Lead-Free Perovskite-Like (CH3NH3)3Sb2Br9 Single Crystal for An MSM Photodetector Application. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Sensors ![In: Sensors 21(13), pp. 4475, 2021. The full citation details ...](Pics/full.jpeg) |
2021 |
DBLP DOI BibTeX RDF |
|
16 | Paola Sabrina Barbato, Valeria Casuscelli, Paolo Aprea, Rossana Scaldaferri, Domenico Caputo |
Assessing lead-free barium zirconate titanate-barium calcium titanate thin films ferroelectric properties in planar configuration. ![Search on Bibsonomy](Pics/bibsonomy.png) |
RTSI ![In: 6th IEEE International Forum on Research and Technology for Society and Industry, RTSI 2021, Naples, Italy, September 6-9, 2021, pp. 121-125, 2021, IEEE, 978-1-6654-4135-3. The full citation details ...](Pics/full.jpeg) |
2021 |
DBLP DOI BibTeX RDF |
|
16 | Shangfen Huang, Haixia Li, Jun Liu, Jun Tao, Otilia Manta |
The application prospects of lead-free piezoelectric ceramics in the field of transducers. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICIIP ![In: ICIIP 2021: 2021 6th International Conference on Intelligent Information Processing, Bucharest, Romania, July 29-31, 2021, pp. 338-342, 2021, ACM, 978-1-4503-9063-7. The full citation details ...](Pics/full.jpeg) |
2021 |
DBLP DOI BibTeX RDF |
|
16 | Sarra Missaoui, Ayda Bouhamed, Mohamed Hassan Khedri, Hamadi Khemakhem, Olfa Kanoun |
Enhanced piezoelectric performance of lead free BCZT based flexible nanogenerator. ![Search on Bibsonomy](Pics/bibsonomy.png) |
SSD ![In: 18th International Multi-Conference on Systems, Signals & Devices, SSD 2021, Monastir, Tunisia, March 22-25, 2021, pp. 889-894, 2021, IEEE, 978-1-6654-1493-7. The full citation details ...](Pics/full.jpeg) |
2021 |
DBLP DOI BibTeX RDF |
|
16 | Amina Ben Ayed, Ayda Bouhamed, Hanen Nouri, Hamadi Khemakhem, Olfa Kanoun |
Tuning the Performance of Flexible Lead-Free Zn-BCZT/PVDF-HFP Piezoelectric Nanogenerator. ![Search on Bibsonomy](Pics/bibsonomy.png) |
SSD ![In: 18th International Multi-Conference on Systems, Signals & Devices, SSD 2021, Monastir, Tunisia, March 22-25, 2021, pp. 884-888, 2021, IEEE, 978-1-6654-1493-7. The full citation details ...](Pics/full.jpeg) |
2021 |
DBLP DOI BibTeX RDF |
|
16 | Mariya P. Aleksandrova, Ivailo M. Pandiev |
Application of Thin Film Ultralow-Power Lead-Free Perovskite Solar Energy Harvesters in Power Management Systems. ![Search on Bibsonomy](Pics/bibsonomy.png) |
MIXDES ![In: 2021 28th International Conference on Mixed Design of Integrated Circuits and System, Lodz, Poland, June 24-26, 2021, pp. 197-202, 2021, IEEE, 978-83-63578-20-6. The full citation details ...](Pics/full.jpeg) |
2021 |
DBLP DOI BibTeX RDF |
|
16 | Chien-Ming Huang 0004, Anto Raj, Michael D. Osterman, Michael G. Pecht |
Assembly Options and Challenges for Electronic Products With Lead-Free Exemption. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Access ![In: IEEE Access 8, pp. 134194-134208, 2020. The full citation details ...](Pics/full.jpeg) |
2020 |
DBLP DOI BibTeX RDF |
|
16 | Ondrej Rubes, Zdenek Machu, Oldrich Sevecek, Zdenek Hadas |
Crack Protective Layered Architecture of Lead-Free Piezoelectric Energy Harvester in Bistable Configuration. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Sensors ![In: Sensors 20(20), pp. 5808, 2020. The full citation details ...](Pics/full.jpeg) |
2020 |
DBLP DOI BibTeX RDF |
|
16 | Neetu Kumari, Micky Rakotondrabe |
Development, presentation and tests of a hybrid thermal vibrational energy harvester based on lead free piezoelectric material. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICECOCS ![In: 2nd IEEE International Conference on Electronics, Control, Optimization and Computer Science, ICECOCS 2020, Kenitra, Morocco, December 2-3, 2020, pp. 1-6, 2020, IEEE, 978-1-7281-6921-7. The full citation details ...](Pics/full.jpeg) |
2020 |
DBLP DOI BibTeX RDF |
|
16 | Ayda Bouhamed, Qin Binyu, Olfa Kanoun |
Flexible lead-free piezoelectric polymer composite nanogenerator with enhanced crystallinity. ![Search on Bibsonomy](Pics/bibsonomy.png) |
SSD ![In: 17th International Multi-Conference on Systems, Signals & Devices, SSD 2020, Monastir, Tunisia, July 20-23, 2020, pp. 130-134, 2020, IEEE, 978-1-7281-1080-6. The full citation details ...](Pics/full.jpeg) |
2020 |
DBLP DOI BibTeX RDF |
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16 | Ruimin Chen, Laiming Jiang, Tianfu Zhang, Takayuki Matsuok, Masato Yamazaki, Xuejun Qian, Gengxi Lu, Ahmad Safari, Jianguo Zhu 0004, K. Kirk Shung, Teng Ma, Qifa Zhou |
Eco-Friendly Highly Sensitive Transducers Based on a New KNN-NTK-FM Lead-Free Piezoelectric Ceramic for High-Frequency Biomedical Ultrasonic Imaging Applications. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Biomed. Eng. ![In: IEEE Trans. Biomed. Eng. 66(6), pp. 1580-1587, 2019. The full citation details ...](Pics/full.jpeg) |
2019 |
DBLP DOI BibTeX RDF |
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16 | H. Alex Hsain |
Electronic Waste and the Special Case of Lead-Free Piezoelectrics: A Call for Legislative Action. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ISTAS ![In: 2019 IEEE International Symposium on Technology and Society, ISTAS 2019, Medford, MA, USA, November 15-16, 2019, pp. 1-5, 2019, IEEE, 978-1-7281-5480-0. The full citation details ...](Pics/full.jpeg) |
2019 |
DBLP DOI BibTeX RDF |
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16 | A. A. El-Daly, A. A. Ibrahiem |
Influence of rotating magnetic field on solidification microstructure and tensile properties of Sn-Bi lead-free solders. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 81, pp. 352-361, 2018. The full citation details ...](Pics/full.jpeg) |
2018 |
DBLP DOI BibTeX RDF |
|
16 | Mei-Ling Wu, Jia-Shen Lan |
Reliability and failure analysis of SAC 105 and SAC 1205N lead-free solder alloys during drop test events. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 80, pp. 213-222, 2018. The full citation details ...](Pics/full.jpeg) |
2018 |
DBLP DOI BibTeX RDF |
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16 | Shi-Qian Liu, Stuart D. McDonald, Keith W. Sweatman, Kazuhiro Nogita |
The effects of precipitation strengthening and solid solution strengthening on strain rate sensitivity of lead-free solders: Review. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 84, pp. 170-180, 2018. The full citation details ...](Pics/full.jpeg) |
2018 |
DBLP DOI BibTeX RDF |
|
16 | T. Fujiwara, K. Yamamoto, Hidehiko Kimura |
Quantification of lead-free solder fatigue by EBSD analysis. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 88-90, pp. 691-694, 2018. The full citation details ...](Pics/full.jpeg) |
2018 |
DBLP DOI BibTeX RDF |
|
16 | A. E. Hammad |
Enhancing the ductility and mechanical behavior of Sn-1.0Ag-0.5Cu lead-free solder by adding trace amount of elements Ni and Sb. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 87, pp. 133-141, 2018. The full citation details ...](Pics/full.jpeg) |
2018 |
DBLP DOI BibTeX RDF |
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16 | Junshan Zhang, Wei Ren, Yantao Liu, Xiaoqing Wu, Chunlong Fei, Yi Quan, Qifa Zhou |
Fabrication and Characterization of High-Frequency Ultrasound Transducers Based on Lead-Free BNT-BT Tape-Casting Thick Film. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Sensors ![In: Sensors 18(9), pp. 3166, 2018. The full citation details ...](Pics/full.jpeg) |
2018 |
DBLP DOI BibTeX RDF |
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16 | Paul Wild, Tobias Grözinger, Dominik Lorenz, André Zimmermann |
Void Formation and Their Effect on Reliability of Lead-Free Solder Joints on MID and PCB Substrates. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Reliab. ![In: IEEE Trans. Reliab. 66(4), pp. 1229-1237, 2017. The full citation details ...](Pics/full.jpeg) |
2017 |
DBLP DOI BibTeX RDF |
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16 | Huizhen Huang, Gewang Shuai, Xiuqin Wei, Chuanqiang Yin |
Effects of sulfur addition on the wettability and corrosion resistance of Sn-0.7Cu lead-free solder. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 74, pp. 15-21, 2017. The full citation details ...](Pics/full.jpeg) |
2017 |
DBLP DOI BibTeX RDF |
|
16 | Aleksandra Fortier, Michael G. Pecht |
A perspective of the IPC report on lead-free electronics in military/aerospace applications. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 69, pp. 66-70, 2017. The full citation details ...](Pics/full.jpeg) |
2017 |
DBLP DOI BibTeX RDF |
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16 | Muhammad Aamir 0006, Riaz Muhammad 0005, Naseer Ahmed, Muhammad Waqas 0001 |
Impact of thermal aging on the intermetallic compound particle size and mechanical properties of lead free solder for green electronics. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 78, pp. 311-318, 2017. The full citation details ...](Pics/full.jpeg) |
2017 |
DBLP DOI BibTeX RDF |
|
16 | Mingna Wang, Jianqiu Wang, Wei Ke |
Corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder joints. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 73, pp. 69-75, 2017. The full citation details ...](Pics/full.jpeg) |
2017 |
DBLP DOI BibTeX RDF |
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16 | M. S. Haslinda, Aizat Abas, F. Che Ani, A. Jalar, Abdullah Aziz Saad, Mohd Zulkifly Abdullah |
Discrete phase method particle simulation of ultra-fine package assembly with SAC305-TiO2 nano-reinforced lead free solder at different weighted percentages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 79, pp. 336-351, 2017. The full citation details ...](Pics/full.jpeg) |
2017 |
DBLP DOI BibTeX RDF |
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16 | Shunfeng Cheng, Chien-Ming Huang 0004, Michael G. Pecht |
A review of lead-free solders for electronics applications. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 75, pp. 77-95, 2017. The full citation details ...](Pics/full.jpeg) |
2017 |
DBLP DOI BibTeX RDF |
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16 | J. Thambi, U. Tetzlaff, Andreas Schiessl, Klaus-Dieter Lang, M. Waltz |
High cycle fatigue behaviour and generalized fatigue model development of lead-free solder alloy based on local stress approach. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 66, pp. 98-105, 2016. The full citation details ...](Pics/full.jpeg) |
2016 |
DBLP DOI BibTeX RDF |
|
16 | M. I. I. Ramli, N. Saud, M. A. A. Mohd Salleh, Mohd Nazree Derman, R. Mohd Said |
Effect of TiO2 additions on Sn-0.7Cu-0.05Ni lead-free composite solder. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 65, pp. 255-264, 2016. The full citation details ...](Pics/full.jpeg) |
2016 |
DBLP DOI BibTeX RDF |
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16 | Bakhtiar Ali, Mohd Faizul Mohd Sabri, Iswadi Jauhari, Nazatul Liana Sukiman |
Impact toughness, hardness and shear strength of Fe and Bi added Sn-1Ag-0.5Cu lead-free solders. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 63, pp. 224-230, 2016. The full citation details ...](Pics/full.jpeg) |
2016 |
DBLP DOI BibTeX RDF |
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16 | Alexandrine Guédon-Gracia, Hélène Frémont, Bernard Plano, Jean-Yves Delétage, Kirsten Weide-Zaage |
Effects of salt spray test on lead-free solder alloy. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 64, pp. 242-247, 2016. The full citation details ...](Pics/full.jpeg) |
2016 |
DBLP DOI BibTeX RDF |
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16 | Muhannad Mustafa, Jeffrey C. Suhling, Pradeep Lall |
Experimental determination of fatigue behavior of lead free solder joints in microelectronic packaging subjected to isothermal aging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 56, pp. 136-147, 2016. The full citation details ...](Pics/full.jpeg) |
2016 |
DBLP DOI BibTeX RDF |
|
16 | Michael G. Pecht, Tadahiro Shibutani, Lifeng Wu |
A reliability assessment guide for the transition planning to lead-free electronics for companies whose products are RoHS exempted or excluded. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 62, pp. 113-123, 2016. The full citation details ...](Pics/full.jpeg) |
2016 |
DBLP DOI BibTeX RDF |
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16 | Van Nhat Le, Lahouari Benabou, Victor Etgens, Quang Bang Tao |
Finite element analysis of the effect of process-induced voids on the fatigue lifetime of a lead-free solder joint under thermal cycling. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 65, pp. 243-254, 2016. The full citation details ...](Pics/full.jpeg) |
2016 |
DBLP DOI BibTeX RDF |
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16 | Ashish Tripathy, Sumit Pramanik, Ayan Manna, Satyanarayan Bhuyan, Nabila Farhana Azrin Shah, Zamri Radzi, Noor Azuan Abu Osman |
Design and Development for Capacitive Humidity Sensor Applications of Lead-Free Ca, Mg, Fe, Ti-Oxides-Based Electro-Ceramics with Improved Sensing Properties via Physisorption. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Sensors ![In: Sensors 16(7), pp. 1135, 2016. The full citation details ...](Pics/full.jpeg) |
2016 |
DBLP DOI BibTeX RDF |
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16 | Xiaomeng Li, Xiaoqing Wu, Peng Shi 0016, Zuo-Guang Ye |
Lead-Free Piezoelectric Diaphragm Biosensors Based on Micro-Machining Technology and Chemical Solution Deposition. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Sensors ![In: Sensors 16(1), pp. 69, 2016. The full citation details ...](Pics/full.jpeg) |
2016 |
DBLP DOI BibTeX RDF |
|
16 | Li Gu, Di Zhou, Jun Cheng Cao |
Piezoelectric Active Humidity Sensors Based on Lead-Free NaNbO3 Piezoelectric Nanofibers. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Sensors ![In: Sensors 16(6), pp. 833, 2016. The full citation details ...](Pics/full.jpeg) |
2016 |
DBLP DOI BibTeX RDF |
|
16 | Marco Laurenti, Denis Perrone, Alessio Verna, Candido Fabrizio Pirri, Alessandro Chiolerio |
Development of a Flexible Lead-Free Piezoelectric Transducer for Health Monitoring in the Space Environment. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Micromachines ![In: Micromachines 6(11), pp. 1729-1744, 2015. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
16 | Edwin Lillie, Peter Sandborn, David Humphrey |
Assessing the value of a lead-free solder control plan using cost-based FMEA. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 55(6), pp. 969-979, 2015. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
16 | F. X. Che, John H. L. Pang |
Study on reliability of PQFP assembly with lead free solder joints under random vibration test. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 55(12), pp. 2769-2776, 2015. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
16 | Chong Leong Gan, Uda Hashim |
Fundamentals of Lead-Free Solder Interconnect Technology (from Microstructures to Reliability). Springer (2015). XIII pp. 253, ISBN: 978-1-4614-9265-8 (Print), 978-1-4614-9266-5 (Online). ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 55(5), pp. 852, 2015. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
16 | R. Mahmudi, D. Farasheh |
Impression creep behavior of Zn-4Al-3Mg-xSn high-temperature lead-free solders. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 55(12), pp. 2542-2548, 2015. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
16 | Yongxin Zhu, Xiaoyan Li, Chao Wang, Ruiting Gao |
A new creep-fatigue life model of lead-free solder joint. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 55(7), pp. 1097-1100, 2015. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
16 | Alexey Vl. Filimonov, Ekaterina Yu Koroleva, Alexander Naberezhnov, Sergej B. Vakhrushev, Tikhon Yu Vergentiev |
Ultrabroadband Dielectric Spectroscopy of Lead-Free Relaxor Ferroelectric Na1/2Bi1/2TiO3. ![Search on Bibsonomy](Pics/bibsonomy.png) |
NEW2AN ![In: Internet of Things, Smart Spaces, and Next Generation Networks and Systems - 15th International Conference, NEW2AN 2015, and 8th Conference, ruSMART 2015, St. Petersburg, Russia, August 26-28, 2015, Proceedings, pp. 793-798, 2015, Springer, 978-3-319-23125-9. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
16 | Ahmad Mayyas, Awni Qasaimeh, Peter Borgesen, Michael Meilunas |
Effects of latent damage of recrystallization on lead free solder joints. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 54(2), pp. 447-456, 2014. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
16 | Emmanuelle S. Freitas, Wislei R. Osório, José E. Spinelli, Amauri Garcia |
Mechanical and corrosion resistances of a Sn-0.7 wt.%Cu lead-free solder alloy. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 54(6-7), pp. 1392-1400, 2014. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
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16 | Jürgen Eckermann, Shahid Mehmood, Helen Davies, Nick P. Lavery, Stephen G. R. Brown, Johann Sienz, A. Jones, P. Sommerfeld |
Computational modeling of creep-based fatigue as a means of selecting lead-free solder alloys. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 54(6-7), pp. 1235-1242, 2014. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
16 | R. Mahmudi, D. Farasheh |
Microstructure and elevated-temperature shear strength of Zn-4Al-3Mg-xSn high-temperature lead-free solders. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 54(8), pp. 1592-1597, 2014. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
16 | Chaoran Yang, Fubin Song, S. W. Ricky Lee |
Impact of Ni concentration on the intermetallic compound formation and brittle fracture strength of Sn-Cu-Ni (SCN) lead-free solder joints. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 54(2), pp. 435-446, 2014. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
16 | Yee-Wen Yen, Ruo-Syun Syu, Chih-Ming Chen 0002, Chien-Chung Jao, Guan-Da Chen |
Interfacial reactions of Sn-58Bi and Sn-0.7Cu lead-free solders with Alloy 42 substrate. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 54(1), pp. 233-238, 2014. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
16 | Yongxin Zhu, Xiaoyan Li, Ruiting Gao, Chao Wang |
Low-cycle fatigue failure behavior and life evaluation of lead-free solder joint under high temperature. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 54(12), pp. 2922-2928, 2014. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
16 | Mathias Ekpu, Raj S. Bhatti, Michael I. Okereke, Sabuj Mallik, Kenny C. Otiaba |
Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 54(1), pp. 239-244, 2014. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
16 | Fang Liu, Guang Meng |
Random vibration reliability of BGA lead-free solder joint. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 54(1), pp. 226-232, 2014. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
16 | Liang Zhang, Ji-guang Han, Yong-huan Guo, Cheng-wen He |
Anand model and FEM analysis of SnAgCuZn lead-free solder joints in wafer level chip scale packaging devices. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 54(1), pp. 281-286, 2014. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
16 | Jun Shen, Zhongming Cao, Dajun Zhai, Mali Zhao, Peipei He |
Effect of isothermal aging and low density current on intermetallic compound growth rate in lead-free solder interface. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 54(1), pp. 252-258, 2014. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
16 | Hideharu Kato, Shingo Nakata, Noriaki Ikenaga, Hiroaki Sugita |
Improvement of Chip Evacuation in Drilling of Lead-Free Brass Using Micro Drill. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Int. J. Autom. Technol. ![In: Int. J. Autom. Technol. 8(6), pp. 874-879, 2014. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
16 | Nicola Delmonte, Francesco Giuliani, Paolo Cova |
Finite element modeling and characterization of lead-free solder joints fatigue life during power cycling of surface mounting power devices. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 53(9-11), pp. 1611-1616, 2013. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
16 | Yao Yao 0003, Leon M. Keer |
Cohesive fracture mechanics based numerical analysis to BGA packaging and lead free solders under drop impact. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 53(4), pp. 629-637, 2013. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
16 | Vithyacharan Retnasamy, Zaliman Sauli, Nurul Izza Mohd Nor, Moganraj Palianysamy, Rizalafande Che Ismail, Ong Tee Say, Hussin Kamarudin |
Different Shear Height Stress Evaluation on -0.7Cu Based Lead Free Solder. ![Search on Bibsonomy](Pics/bibsonomy.png) |
UKSim ![In: 15th International Conference on Computer Modelling and Simulation, UKSim 2013, Cambridge, United Kingdom, April 10-12, 2013, pp. 317-320, 2013, IEEE, 978-1-4673-6421-8. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
16 | Tingbi Luo, Anmin Hu, Jing Hu, Ming Li, Dali Mao |
Microstructure and mechanical properties of Sn-Zn-Bi-Cr lead-free solder. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 52(3), pp. 585-588, 2012. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
|
16 | Dhafer Abdulameer Shnawah, Suhana Binti Mohd Said, Mohd Faizul Mohd Sabri, Irfan Anjum Badruddin, Fa Xing Che |
Novel Fe-containing Sn-1Ag-0.5Cu lead-free solder alloy with further enhanced elastic compliance and plastic energy dissipation ability for mobile products. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 52(11), pp. 2701-2708, 2012. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
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16 | Salomeh Tabatabaei, Ashavani Kumar, Haleh Ardebili, Peter J. Loos, Pulickel M. Ajayan |
Synthesis of Au-Sn alloy nanoparticles for lead-free electronics with unique combination of low and high melting temperatures. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 52(11), pp. 2685-2689, 2012. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
|
16 | Emeka H. Amalu, Ndy N. Ekere |
High-temperature fatigue life of flip chip lead-free solder joints at varying component stand-off height. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 52(12), pp. 2982-2994, 2012. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
|
16 | Liang Zhang, Cheng-wen He, Yong-huan Guo, Ji-guang Han, Yong-wei Zhang, Xu-yan Wang |
Development of SnAg-based lead free solders in electronics packaging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 52(3), pp. 559-578, 2012. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
|
16 | P. Ratanapreechachai, Isaku Kanno, M. Sato |
Sputtering Deposition of Lead-free Piezoelectric (K, Na)NbO3 Thin Films. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICETET ![In: 2012 Fifth International Conference on Emerging Trends in Engineering and Technology, Himeji, Japan, November 5-7, 2012, pp. 44-47, 2012, IEEE, 978-1-4799-0276-7. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
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16 | Seiji Nakashima, Yusuke Takada, Taiki Ito, Syota Seto, Hironori Fujisawa, Masafumi Kobune, Masaru Shimizu |
Preparation and Characterization of High Quality Lead-free BiFeO3 Thin Films by Sputtering Process. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICETET ![In: 2012 Fifth International Conference on Emerging Trends in Engineering and Technology, Himeji, Japan, November 5-7, 2012, pp. 128-131, 2012, IEEE, 978-1-4799-0276-7. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
|
16 | Pradeep Lall, Chandan Bhat, Madhura Hande, Vikrant More, Rahul Vaidya, Kai Goebel |
Prognostication of Residual Life and Latent Damage Assessment in Lead-Free Electronics Under Thermomechanical Loads. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Ind. Electron. ![In: IEEE Trans. Ind. Electron. 58(7), pp. 2605-2616, 2011. The full citation details ...](Pics/full.jpeg) |
2011 |
DBLP DOI BibTeX RDF |
|
16 | Davide Di Maio, Owen Thomas, Milos Dusek, Christopher Hunt |
Novel Testing Instrument for Lead-Free Solder Characterization. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Instrum. Meas. ![In: IEEE Trans. Instrum. Meas. 60(10), pp. 3444-3450, 2011. The full citation details ...](Pics/full.jpeg) |
2011 |
DBLP DOI BibTeX RDF |
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16 | H. Tsukamoto, T. Nishimura, S. Suenaga, Stuart D. McDonald, Keith W. Sweatman, Kazuhiro Nogita |
The influence of solder composition on the impact strength of lead-free solder ball grid array joints. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 51(3), pp. 657-667, 2011. The full citation details ...](Pics/full.jpeg) |
2011 |
DBLP DOI BibTeX RDF |
|
16 | Y. A. Su, Long Bin Tan, T. Y. Tee, Vincent B. C. Tan |
Rate-dependent properties of Sn-Ag-Cu based lead-free solder joints for WLCSP. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 50(4), pp. 564-576, 2010. The full citation details ...](Pics/full.jpeg) |
2010 |
DBLP DOI BibTeX RDF |
|
16 | Krishna Tunga, Suresh K. Sitaraman |
Laser moiré interferometry for fatigue life prediction of lead-free solders. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 50(12), pp. 2026-2036, 2010. The full citation details ...](Pics/full.jpeg) |
2010 |
DBLP DOI BibTeX RDF |
|
16 | E. Kamara, Hua Lu 0003, Chris Bailey 0001, Chris Hunt, Davide Di Maio, Owen Thomas |
A multi-disciplinary study of vibration based reliability of lead-free electronic interconnects. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 50(9-11), pp. 1706-1710, 2010. The full citation details ...](Pics/full.jpeg) |
2010 |
DBLP DOI BibTeX RDF |
|
16 | Elena Aksel, Jacob L. Jones |
Advances in Lead-Free Piezoelectric Materials for Sensors and Actuators. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Sensors ![In: Sensors 10(3), pp. 1935-1954, 2010. The full citation details ...](Pics/full.jpeg) |
2010 |
DBLP DOI BibTeX RDF |
|
16 | Sabine Körbel, Christian Elsässer |
Cu Substitutionals and Defect Complexes in the Lead-Free Ferroelectric KNN. ![Search on Bibsonomy](Pics/bibsonomy.png) |
High Performance Computing in Science and Engineering ![In: High Performance Computing in Science and Engineering '10 - Transactions of the High Performance Computing Center, Stuttgart (HLRS) 2010., pp. 181-188, 2010, Springer, 978-3-642-15747-9. The full citation details ...](Pics/full.jpeg) |
2010 |
DBLP DOI BibTeX RDF |
|
16 | Matthias Scheller Lichtenauer, Silvania Avelar, Grzegorz Toporek |
Segmentation of Images of Lead Free Solder. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICISP ![In: Image and Signal Processing, 4th International Conference, ICISP 2010, Trois-Rivières, QC, Canada, June 30-July 2, 2010. Proceedings, pp. 165-172, 2010, Springer, 978-3-642-13680-1. The full citation details ...](Pics/full.jpeg) |
2010 |
DBLP DOI BibTeX RDF |
|
16 | Yi-Wun Wang, Y. W. Lin, C. Robert Kao |
Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free solders and different Cu substrates. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 49(3), pp. 248-252, 2009. The full citation details ...](Pics/full.jpeg) |
2009 |
DBLP DOI BibTeX RDF |
|
16 | Pradeep Lall, Madhura Hande, Chandan Bhat, Vikrant More, Rahul Vaidya |
Prognostication of system-state in lead-free electronics equipment under cyclic and steady-state thermo-mechanical loads. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 49(8), pp. 825-838, 2009. The full citation details ...](Pics/full.jpeg) |
2009 |
DBLP DOI BibTeX RDF |
|
16 | Feng Gao, Hiroshi Nishikawa, Tadashi Takemoto, Jianmin Qu |
Mechanical properties versus temperature relation of individual phases in Sn-3.0Ag-0.5Cu lead-free solder alloy. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 49(3), pp. 296-302, 2009. The full citation details ...](Pics/full.jpeg) |
2009 |
DBLP DOI BibTeX RDF |
|
16 | S. T. Jenq, Hsuan-Hu Chang, Yi-Shao Lai, Tsung-Yueh Tsai |
High strain rate compression behavior for Sn-37Pb eutectic alloy, lead-free Sn-1Ag-0.5Cu and Sn-3Ag-0.5Cu alloys. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 49(3), pp. 310-317, 2009. The full citation details ...](Pics/full.jpeg) |
2009 |
DBLP DOI BibTeX RDF |
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