Hits ?▲ |
Authors |
Title |
Venue |
Year |
Link |
Author keywords |
18 | Tianwei Hu, Yi Li, Yan-Cheong Chan, Fengshun Wu |
Effect of nano Al2O3 particles doping on electromigration and mechanical properties of Sn-58Bi solder joints. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 55(8), pp. 1226-1233, 2015. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
18 | Baojun Tang, Kris Croes, Nicolas Jourdan, Jürgen Bömmels, Zsolt Tökei, Ingrid De Wolf, Eric Wilcox, Timothy McMullen |
Constant voltage electromigration for advanced BEOL copper interconnects. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IRPS ![In: IEEE International Reliability Physics Symposium, IRPS 2015, Monterey, CA, USA, April 19-23, 2015, pp. 2, 2015, IEEE, 978-1-4673-7362-3. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
18 | L. D. Chen, B. L. Lin, M.-H. Hsieh, C. W. Chang, J. S. Tsai, J. C. Peng, C. C. Chiu, Y.-H. Lee |
Study of a new electromigration failure mechanism by novel test structure. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IRPS ![In: IEEE International Reliability Physics Symposium, IRPS 2015, Monterey, CA, USA, April 19-23, 2015, pp. 2, 2015, IEEE, 978-1-4673-7362-3. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
18 | M. H. Lin, A. S. Oates |
Mechanisms of electromigration under AC and pulsed-DC stress in Cu/low-k dual damascene interconnects. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IRPS ![In: IEEE International Reliability Physics Symposium, IRPS 2015, Monterey, CA, USA, April 19-23, 2015, pp. 2, 2015, IEEE, 978-1-4673-7362-3. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
18 | Vivek Mishra, Sachin S. Sapatnekar |
Circuit delay variability due to wire resistance evolution under AC electromigration. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IRPS ![In: IEEE International Reliability Physics Symposium, IRPS 2015, Monterey, CA, USA, April 19-23, 2015, pp. 3, 2015, IEEE, 978-1-4673-7362-3. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
18 | Fen Chen, Erik McCullen, Cathryn Christiansen, Michael A. Shinosky, Roger Dufresne, Prakash Periasamy, Rick Kontra, Carole Graas, Gary StOnge |
Diagnostic electromigration reliability evaluation with a local sensing structure. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IRPS ![In: IEEE International Reliability Physics Symposium, IRPS 2015, Monterey, CA, USA, April 19-23, 2015, pp. 2, 2015, IEEE, 978-1-4673-7362-3. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
18 | Giulio Marti, Lucile Arnaud, David Ney, Yves Wouters |
Interconnect design study for electromigration reliability improvement. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IRPS ![In: IEEE International Reliability Physics Symposium, IRPS 2015, Monterey, CA, USA, April 19-23, 2015, pp. 2, 2015, IEEE, 978-1-4673-7362-3. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
18 | Christine S. Hau-Riege, You-Wen Yau, Kevin Caffey, Rajneesh Kumar, YangYang Sun, Andy Bao, Milind Shah, Lily Zhao, Omar Bchir, Ahmer Syed, Steve Bezuk |
The electromigration behavior of copper pillars for different current directions and pillar shapes. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IRPS ![In: IEEE International Reliability Physics Symposium, IRPS 2015, Monterey, CA, USA, April 19-23, 2015, pp. 5, 2015, IEEE, 978-1-4673-7362-3. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
18 | Baozhen Li, K. Paul Muller, James D. Warnock, Leon J. Sigal, Dinesh Badami |
A case study of electromigration reliability: From design point to system operations. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IRPS ![In: IEEE International Reliability Physics Symposium, IRPS 2015, Monterey, CA, USA, April 19-23, 2015, pp. 2, 2015, IEEE, 978-1-4673-7362-3. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
18 | Palkesh Jain, Sachin S. Sapatnekar, Jordi Cortadella |
Stochastic and topologically aware electromigration analysis for clock skew. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IRPS ![In: IEEE International Reliability Physics Symposium, IRPS 2015, Monterey, CA, USA, April 19-23, 2015, pp. 3, 2015, IEEE, 978-1-4673-7362-3. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
18 | Hai-Bao Chen, Sheldon X.-D. Tan, Xin Huang 0003, Valeriy Sukharev |
New electromigration modeling and analysis considering time-varying temperature and current densities. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ASP-DAC ![In: The 20th Asia and South Pacific Design Automation Conference, ASP-DAC 2015, Chiba, Japan, January 19-22, 2015, pp. 352-357, 2015, IEEE, 978-1-4799-7792-5. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
18 | Jiwoo Pak, Bei Yu 0001, David Z. Pan |
Electromigration-aware redundant via insertion. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ASP-DAC ![In: The 20th Asia and South Pacific Design Automation Conference, ASP-DAC 2015, Chiba, Japan, January 19-22, 2015, pp. 544-549, 2015, IEEE, 978-1-4799-7792-5. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
18 | Palkesh Jain, Sachin S. Sapatnekar, Jordi Cortadella |
A retargetable and accurate methodology for logic-IP-internal electromigration assessment. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ASP-DAC ![In: The 20th Asia and South Pacific Design Automation Conference, ASP-DAC 2015, Chiba, Japan, January 19-22, 2015, pp. 346-351, 2015, IEEE, 978-1-4799-7792-5. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
18 | Gracieli Posser, Lucas de Paris, Vivek Mishra, Palkesh Jain, Ricardo Reis 0001, Sachin S. Sapatnekar |
Reducing the signal Electromigration effects on different logic gates by cell layout optimization. ![Search on Bibsonomy](Pics/bibsonomy.png) |
LASCAS ![In: IEEE 6th Latin American Symposium on Circuits & Systems, LASCAS 2015, Montevideo, Uruguay, February 24-27, 2015, pp. 1-4, 2015, IEEE, 978-1-4799-8332-2. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
18 | Gracieli Posser, Vivek Mishra, Palkesh Jain, Ricardo Reis 0001, Sachin S. Sapatnekar |
Impact on performance, power, area and wirelength using electromigration-aware cells. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICECS ![In: 2015 IEEE International Conference on Electronics, Circuits, and Systems, ICECS 2015, Cairo, Egypt, December 6-9, 2015, pp. 129-132, 2015, IEEE, 978-1-5090-0246-7. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
18 | Tiantao Lu, Ankur Srivastava 0001 |
Electromigration-aware Clock Tree Synthesis for TSV-based 3D-ICs. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ACM Great Lakes Symposium on VLSI ![In: Proceedings of the 25th edition on Great Lakes Symposium on VLSI, GLVLSI 2015, Pittsburgh, PA, USA, May 20 - 22, 2015, pp. 27-32, 2015, ACM, 978-1-4503-3474-7. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
18 | Lihua Liang, Yuanxiang Zhang, Richard Rao |
Impact of geometry parameter on electromigration reliability in FCBGA package. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ISQED ![In: Sixteenth International Symposium on Quality Electronic Design, ISQED 2015, Santa Clara, CA, USA, March 2-4, 2015, pp. 316-321, 2015, IEEE, 978-1-4799-7581-5. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
18 | Ricardo Martins 0003, Nuno Lourenço 0003, António Canelas, Nuno Horta |
Electromigration-aware analog Router with multilayer multiport terminal structures. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Integr. ![In: Integr. 47(4), pp. 532-547, 2014. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
18 | Jiwoo Pak, Sung Kyu Lim, David Z. Pan |
Electromigration Study for Multiscale Power/Ground Vias in TSV-Based 3-D ICs. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. ![In: IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 33(12), pp. 1873-1885, 2014. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
18 | Boukary Ouattara, Lise Doyen, David Ney, Habib Mehrez, Pirouz Bazargan-Sabet |
Power grid redundant path contribution in system on chip (SoC) robustness against electromigration. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 54(9-10), pp. 1702-1706, 2014. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
18 | Wolfhard H. Zisser, Hajdin Ceric, Josef Weinbub, Siegfried Selberherr |
Electromigration reliability of open TSV structures. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 54(9-10), pp. 2133-2137, 2014. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
18 | Wee Loon Ng, Kheng Chok Tee, Junfeng Liu, Yong Chiang Ee, Oliver Aubel, Chuan Seng Tan, Kin Leong Pey |
Robust Electromigration reliability through engineering optimization. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 54(9-10), pp. 1666-1670, 2014. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
18 | Baozhen Li, Cathryn Christiansen, Dinesh Badami, Chih-Chao Yang |
Electromigration challenges for advanced on-chip Cu interconnects. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 54(4), pp. 712-724, 2014. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
18 | Chin-Li Kao, Tei-Chen Chen, Yi-Shao Lai, Ying-Ta Chiu |
Investigation of electromigration reliability of redistribution lines in wafer-level chip-scale packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 54(11), pp. 2471-2478, 2014. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
18 | Robert Nürnberg, Andrea Sacconi |
An unfitted finite element method for the numerical approximation of void electromigration. ![Search on Bibsonomy](Pics/bibsonomy.png) |
J. Comput. Appl. Math. ![In: J. Comput. Appl. Math. 270, pp. 531-544, 2014. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
18 | Ricardo Martins 0003, Nuno Lourenço 0003, António Canelas, Nuno Horta |
Electromigration-aware and IR-Drop avoidance routing in analog multiport terminal structures. ![Search on Bibsonomy](Pics/bibsonomy.png) |
DATE ![In: Design, Automation & Test in Europe Conference & Exhibition, DATE 2014, Dresden, Germany, March 24-28, 2014, pp. 1-6, 2014, European Design and Automation Association, 978-3-9815370-2-4. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
18 | Gracieli Posser, Vivek Mishra, Ricardo Augusto da Luz Reis, Sachin S. Sapatnekar |
Analyzing the electromigration effects on different metal layers and different wire lengths. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICECS ![In: 21st IEEE International Conference on Electronics, Circuits and Systems, ICECS 2014, Marseille, France, December 7-10, 2014, pp. 682-685, 2014, IEEE, 978-1-4799-4242-8. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
18 | Valeriy Sukharev, Xin Huang 0003, Hai-Bao Chen, Sheldon X.-D. Tan |
IR-drop based electromigration assessment: parametric failure chip-scale analysis. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICCAD ![In: The IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2014, San Jose, CA, USA, November 3-6, 2014, pp. 428-433, 2014, IEEE, 978-1-4799-6277-8. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
18 | Gracieli Posser, Vivek Mishra, Palkesh Jain, Ricardo Reis 0001, Sachin S. Sapatnekar |
A systematic approach for analyzing and optimizing cell-internal signal electromigration. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICCAD ![In: The IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2014, San Jose, CA, USA, November 3-6, 2014, pp. 486-491, 2014, IEEE, 978-1-4799-6277-8. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
18 | Taeyoung Kim 0001, Bowen Zheng, Hai-Bao Chen, Qi Zhu 0002, Valeriy Sukharev, Sheldon X.-D. Tan |
Lifetime optimization for real-time embedded systems considering electromigration effects. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICCAD ![In: The IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2014, San Jose, CA, USA, November 3-6, 2014, pp. 434-439, 2014, IEEE, 978-1-4799-6277-8. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
18 | Wei-Ting Jonas Chan, Andrew B. Kahng, Siddhartha Nath |
Methodology for electromigration signoff in the presence of adaptive voltage scaling. ![Search on Bibsonomy](Pics/bibsonomy.png) |
SLIP ![In: ACM/IEEE International Workshop on System Level Interconnect Prediction, SLIP 2014, San Francisco, CA, USA, June 1, 2014, pp. 6:1-6:7, 2014, IEEE Computer Society, 978-1-4503-3053-4. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
18 | Qiaosha Zou, Tao Zhang 0032, Cong Xu, Yuan Xie 0001 |
TSV power supply array electromigration lifetime analysis in 3D ICS. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ACM Great Lakes Symposium on VLSI ![In: Great Lakes Symposium on VLSI 2014, GLSVLSI '14, Houston, TX, USA - May 21 - 23, 2014, pp. 239-240, 2014, ACM, 978-1-4503-2816-6. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
18 | Di-An Li, Malgorzata Marek-Sadowska |
Estimating true worst currents for power grid electromigration analysis. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ISQED ![In: Fifteenth International Symposium on Quality Electronic Design, ISQED 2014, Santa Clara, CA, USA, March 3-5, 2014, pp. 708-714, 2014, IEEE, 978-1-4799-3945-9. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
18 | Zhong Guan, Malgorzata Marek-Sadowska, Sani R. Nassif |
Statistical analysis of process variation induced SRAM electromigration degradation. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ISQED ![In: Fifteenth International Symposium on Quality Electronic Design, ISQED 2014, Santa Clara, CA, USA, March 3-5, 2014, pp. 700-707, 2014, IEEE, 978-1-4799-3945-9. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
18 | Michael Hook, Di Erick Xu, Michael Mayer |
Electromigration testing of wire bonds. ![Search on Bibsonomy](Pics/bibsonomy.png) |
CCECE ![In: IEEE 27th Canadian Conference on Electrical and Computer Engineering, CCECE 2014, Toronto, ON, Canada, May 4-7, 2014, pp. 1-6, 2014, IEEE, 978-1-4799-3099-9. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
18 | Xin Huang 0003, Tan Yu, Valeriy Sukharev, Sheldon X.-D. Tan |
Physics-based Electromigration Assessment for Power Grid Networks. ![Search on Bibsonomy](Pics/bibsonomy.png) |
DAC ![In: The 51st Annual Design Automation Conference 2014, DAC '14, San Francisco, CA, USA, June 1-5, 2014, pp. 80:1-80:6, 2014, ACM, 978-1-4503-2730-5. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
18 | Thomas Frank, Stéphane Moreau, Cédrick Chappaz, Patrick Leduc, Lucile Arnaud, Aurélie Thuaire, Emmanuel Chery, F. Lorut, Lorena Anghel, Gilles Poupon |
Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 53(1), pp. 17-29, 2013. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
18 | Ted Sun, Ayhan A. Mutlu, Mahmudur Rahman |
A new statistical methodology predicting chip failure probability considering electromigration. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 53(12), pp. 1979-1986, 2013. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
18 | M. K. Lim, Vassilios A. Chouliaras, Chee Lip Gan, Vincent M. Dwyer |
Bidirectional electromigration failure. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 53(9-11), pp. 1261-1265, 2013. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
18 | Yuanqing Cheng, Aida Todri-Sanial, Alberto Bosio, Luigi Dillio, Patrick Girard 0001, Arnaud Virazel, Pascal Vivet, Marc Belleville |
A novel method to mitigate TSV electromigration for 3D ICs. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ISVLSI ![In: IEEE Computer Society Annual Symposium on VLSI, ISVLSI 2013, Natal, Brazil, August 5-7, 2013, pp. 121-126, 2013, IEEE Computer Socity, 978-1-4799-1331-2. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
18 | Andrew B. Kahng, Siddhartha Nath, Tajana Rosing |
On potential design impacts of electromigration awareness. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ASP-DAC ![In: 18th Asia and South Pacific Design Automation Conference, ASP-DAC 2013, Yokohama, Japan, January 22-25, 2013, pp. 527-532, 2013, IEEE, 978-1-4673-3029-9. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
18 | Jens Lienig |
Electromigration and its impact on physical design in future technologies. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ISPD ![In: International Symposium on Physical Design, ISPD'13, Stateline, NV, USA, March 24-27, 2013, pp. 33-40, 2013, ACM, 978-1-4503-1954-6. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
18 | Mohammad Fawaz, Sandeep Chatterjee, Farid N. Najm |
A vectorless framework for power grid electromigration checking. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICCAD ![In: The IEEE/ACM International Conference on Computer-Aided Design, ICCAD'13, San Jose, CA, USA, November 18-21, 2013, pp. 553-560, 2013, IEEE, 978-1-4799-1069-4. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
18 | Jiwoo Pak, Sung Kyu Lim, David Z. Pan |
Electromigration study for multi-scale power/ground vias in TSV-based 3D ICs. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICCAD ![In: The IEEE/ACM International Conference on Computer-Aided Design, ICCAD'13, San Jose, CA, USA, November 18-21, 2013, pp. 379-386, 2013, IEEE, 978-1-4799-1069-4. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
18 | Xin Zhao 0001, Yang Wan, Michael Scheuermann, Sung Kyu Lim |
Transient modeling of TSV-wire electromigration and lifetime analysis of power distribution network for 3D ICs. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICCAD ![In: The IEEE/ACM International Conference on Computer-Aided Design, ICCAD'13, San Jose, CA, USA, November 18-21, 2013, pp. 363-370, 2013, IEEE, 978-1-4799-1069-4. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
18 | Sandeep Chatterjee, Mohammad Fawaz, Farid N. Najm |
Redundancy-aware electromigration checking for mesh power grids. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICCAD ![In: The IEEE/ACM International Conference on Computer-Aided Design, ICCAD'13, San Jose, CA, USA, November 18-21, 2013, pp. 540-547, 2013, IEEE, 978-1-4799-1069-4. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
18 | Ted Sun, Ayhan A. Mutlu, Mahmud Rahman |
Statistical Electromigration analysis of a chip with the consideration of a within-die temperature map. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ISCAS ![In: 2013 IEEE International Symposium on Circuits and Systems (ISCAS2013), Beijing, China, May 19-23, 2013, pp. 2343-2346, 2013, IEEE, 978-1-4673-5760-9. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
18 | Zhong Guan, Malgorzata Marek-Sadowska, Sani R. Nassif |
SRAM bit-line electromigration mechanism and its prevention scheme. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ISQED ![In: International Symposium on Quality Electronic Design, ISQED 2013, Santa Clara, CA, USA, March 4-6, 2013, pp. 286-293, 2013, IEEE, 978-1-4673-4951-2. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
18 | Yun-Chih Tsai, Tai-Hung Li, Tai-Chen Chen, Chung-Wei Yeh |
Electromigration- and obstacle-avoiding routing tree construction. ![Search on Bibsonomy](Pics/bibsonomy.png) |
VLSI-DAT ![In: 2013 International Symposium on VLSI Design, Automation, and Test, VLSI-DAT 2013, Hsinchu, Taiwan, April 22-24, 2013, pp. 1-4, 2013, IEEE, 978-1-4673-4435-7. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
18 | Vivek Mishra, Sachin S. Sapatnekar |
The impact of electromigration in copper interconnects on power grid integrity. ![Search on Bibsonomy](Pics/bibsonomy.png) |
DAC ![In: The 50th Annual Design Automation Conference 2013, DAC '13, Austin, TX, USA, May 29 - June 07, 2013, pp. 88:1-88:6, 2013, ACM, 978-1-4503-2071-9. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
18 | Iris Hui-Ru Jiang, Hua-Yu Chang, Chih-Long Chang |
WiT: Optimal Wiring Topology for Electromigration Avoidance. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Very Large Scale Integr. Syst. ![In: IEEE Trans. Very Large Scale Integr. Syst. 20(4), pp. 581-592, 2012. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
|
18 | Meng Keong Lim, Jingyuan Lin, Yong Chiang Ee, Chee Mang Ng, Jun Wei, Chee Lip Gan |
Experimental characterization and modelling of electromigration lifetime under unipolar pulsed current stress. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 52(8), pp. 1553-1558, 2012. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
|
18 | Roberto Lacerda de Orio, Hajdin Ceric, Siegfried Selberherr |
Electromigration failure in a copper dual-damascene structure with a through silicon via. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 52(9-10), pp. 1981-1986, 2012. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
|
18 | Feifei He, Cher Ming Tan |
Electromigration reliability of interconnections in RF low noise amplifier circuit. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 52(2), pp. 446-454, 2012. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
|
18 | Vincent M. Dwyer |
Diffusivity variation in Electromigration failure. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 52(9-10), pp. 1960-1965, 2012. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
|
18 | Xiaodao Chen, Chen Liao, Tongquan Wei, Shiyan Hu |
An Interconnect Reliability-Driven Routing Technique for Electromigration Failure Avoidance. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Dependable Secur. Comput. ![In: IEEE Trans. Dependable Secur. Comput. 9(5), pp. 770-776, 2012. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
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18 | SaiDeepa Rayaprolu, Srinivasa Vemuru, Mohammed Y. Niamat |
Efficient AFT implementation in FPGAs to detect potential electromigration failures. ![Search on Bibsonomy](Pics/bibsonomy.png) |
EIT ![In: 2012 IEEE International Conference on Electro/Information Technology, Indianapolis, IN, USA, May 6-8, 2012, pp. 1-6, 2012, IEEE, 978-1-4673-0819-9. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
|
18 | Mehmet Kayaalp 0001, Fahrettin Koc, Oguz Ergin |
Exploiting Bus Level and Bit Level Inactivity for Preventing Wire Degradation due to Electromigration. ![Search on Bibsonomy](Pics/bibsonomy.png) |
DSD ![In: 15th Euromicro Conference on Digital System Design, DSD 2012, Cesme, Izmir, Turkey, September 5-8, 2012, pp. 280-287, 2012, IEEE Computer Society, 978-1-4673-2498-4. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
|
18 | Tatsuhiko Ohata, Yasuhisa Naitoh, Masayo Horikawa, Dong F. Wang, Ryutaro Maeda |
Fabrication of nanogap electrode using electromigration method during metal deposition. ![Search on Bibsonomy](Pics/bibsonomy.png) |
NEMS ![In: 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012, Kyoto, Japan, March 5-8, 2012, pp. 290-293, 2012, IEEE, 978-1-4673-1122-9. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
|
18 | Y. C. Chen, Chia Wei Chu, Tzu-Yuan Chao, Y. T. Cheng, Chih Chen |
The electromigration investigation of Cu-Ni nanocomposites. ![Search on Bibsonomy](Pics/bibsonomy.png) |
NEMS ![In: 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012, Kyoto, Japan, March 5-8, 2012, pp. 515-518, 2012, IEEE, 978-1-4673-1122-9. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
|
18 | Jiwoo Pak, Sung Kyu Lim, David Z. Pan |
Electromigration-aware routing for 3D ICs with stress-aware EM modeling. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICCAD ![In: 2012 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2012, San Jose, CA, USA, November 5-8, 2012, pp. 325-332, 2012, ACM, 978-1-4577-1398-9. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
|
18 | Jing Xie 0006, Vijaykrishnan Narayanan, Yuan Xie 0001 |
Mitigating electromigration of power supply networks using bidirectional current stress. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ACM Great Lakes Symposium on VLSI ![In: Great Lakes Symposium on VLSI 2012, GLSVLSI'12, Salt Lake City, UT, USA, May 3-4, 2012, pp. 299-302, 2012, ACM, 978-1-4503-1244-8. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
|
18 | Amir Hosseini, Vahid Shabro |
Electromigration-aware dynamic routing algorithm for network-on-chip applications. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Int. J. High Perform. Syst. Archit. ![In: Int. J. High Perform. Syst. Archit. 3(1), pp. 56-63, 2011. The full citation details ...](Pics/full.jpeg) |
2011 |
DBLP DOI BibTeX RDF |
|
18 | Hsin-Hsiung Huang, Jui-Hung Hung, Cheng-Chiang Lin, Tsai-Ming Hsieh |
Wire Planning for Electromigration and Interference Avoidance in Analog Circuits. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEICE Trans. Fundam. Electron. Commun. Comput. Sci. ![In: IEICE Trans. Fundam. Electron. Commun. Comput. Sci. 94-A(11), pp. 2402-2411, 2011. The full citation details ...](Pics/full.jpeg) |
2011 |
DBLP DOI BibTeX RDF |
|
18 | Biswajit Patra, Nayan Chandak, Amlan Chakrabarti |
An Efficient Methodology for Full Chip Signal ElectroMigration Analysis for Advanced Technology Node Designs. ![Search on Bibsonomy](Pics/bibsonomy.png) |
J. Low Power Electron. ![In: J. Low Power Electron. 7(3), pp. 420-425, 2011. The full citation details ...](Pics/full.jpeg) |
2011 |
DBLP DOI BibTeX RDF |
|
18 | Vincent M. Dwyer |
Analysis of critical-length data from Electromigration failure studies. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 51(9-11), pp. 1568-1572, 2011. The full citation details ...](Pics/full.jpeg) |
2011 |
DBLP DOI BibTeX RDF |
|
18 | Fei Su, Ronghai Mao, Xiaoyan Wang, Guangzhou Wang, Haiyan Pan |
Creep behaviour of Sn-3.8Ag-0.7Cu under the effect of electromigration: Experiments and modelling. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 51(5), pp. 1020-1024, 2011. The full citation details ...](Pics/full.jpeg) |
2011 |
DBLP DOI BibTeX RDF |
|
18 | R. L. de Orio, Hajdin Ceric, Siegfried Selberherr |
A compact model for early electromigration failures of copper dual-damascene interconnects. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 51(9-11), pp. 1573-1577, 2011. The full citation details ...](Pics/full.jpeg) |
2011 |
DBLP DOI BibTeX RDF |
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18 | Kiju Lee, Keun-Soo Kim, Yutaka Tsukada, Katsuaki Suganuma, Kimihiro Yamanaka, Soichi Kuritani, Minoru Ueshima |
Influence of crystallographic orientation of Sn-Ag-Cu on electromigration in flip-chip joint. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 51(12), pp. 2290-2297, 2011. The full citation details ...](Pics/full.jpeg) |
2011 |
DBLP DOI BibTeX RDF |
|
18 | Zheng Fan, Xinyong Tao, Xudong Cui, Xudong Fan, Xiaobin Zhang, Lixin Dong |
Electromigration-based deposition enabled by nanorobotic manipulation inside a transmission electron microscope. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICRA ![In: IEEE International Conference on Robotics and Automation, ICRA 2011, Shanghai, China, 9-13 May 2011, pp. 2686-2691, 2011, IEEE. The full citation details ...](Pics/full.jpeg) |
2011 |
DBLP DOI BibTeX RDF |
|
18 | Jin-Tai Yan, Zhi-Wei Chen |
Obstacle-aware multiple-source rectilinear Steiner tree with electromigration and IR-drop avoidance. ![Search on Bibsonomy](Pics/bibsonomy.png) |
DATE ![In: Design, Automation and Test in Europe, DATE 2011, Grenoble, France, March 14-18, 2011, pp. 449-454, 2011, IEEE, 978-1-61284-208-0. The full citation details ...](Pics/full.jpeg) |
2011 |
DBLP DOI BibTeX RDF |
|
18 | Ramachandran Venkatasubramanian, Doohwang Chang, Sule Ozev |
Analysis and Mitigation of Electromigration in RF Circuits: An LNA Case Study. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ETS ![In: 16th European Test Symposium, ETS 2011, Trondheim, Norway, May 23-27, 2011, pp. 215, 2011, IEEE Computer Society, 978-0-7695-4433-5. The full citation details ...](Pics/full.jpeg) |
2011 |
DBLP DOI BibTeX RDF |
|
18 | Y. Kuwabara, S. Nishimura, R. Zaharuddin, J. Shirakashi |
Investigation of electromigration in micrometer-scale metal wires by in-situ optical microscopy. ![Search on Bibsonomy](Pics/bibsonomy.png) |
NEMS ![In: 6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2011, Kaohsiung, Taiwan, February 20-23, 2011, pp. 681-684, 2011, IEEE, 978-1-61284-775-7. The full citation details ...](Pics/full.jpeg) |
2011 |
DBLP DOI BibTeX RDF |
|
18 | Mohit Pathak, Jiwoo Pak, David Z. Pan, Sung Kyu Lim |
Electromigration modeling and full-chip reliability analysis for BEOL interconnect in TSV-based 3D ICs. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICCAD ![In: 2011 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2011, San Jose, California, USA, November 7-10, 2011, pp. 555-562, 2011, IEEE Computer Society, 978-1-4577-1399-6. The full citation details ...](Pics/full.jpeg) |
2011 |
DBLP DOI BibTeX RDF |
|
18 | Di-An Li, Malgorzata Marek-Sadowska |
Variation-aware electromigration analysis of power/ground networks. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICCAD ![In: 2011 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2011, San Jose, California, USA, November 7-10, 2011, pp. 571-576, 2011, IEEE Computer Society, 978-1-4577-1399-6. The full citation details ...](Pics/full.jpeg) |
2011 |
DBLP DOI BibTeX RDF |
|
18 | Jaume Abella 0001, Xavier Vera |
Electromigration for microarchitects. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ACM Comput. Surv. ![In: ACM Comput. Surv. 42(2), pp. 9:1-9:18, 2010. The full citation details ...](Pics/full.jpeg) |
2010 |
DBLP DOI BibTeX RDF |
|
18 | H. W. Tseng, C. T. Lu, Y. H. Hsiao, P. L. Liao, Y. C. Chuang, T. Y. Chung, Cheng-Yi Liu |
Electromigration-induced failures at Cu/Sn/Cu flip-chip joint interfaces. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 50(8), pp. 1159-1162, 2010. The full citation details ...](Pics/full.jpeg) |
2010 |
DBLP DOI BibTeX RDF |
|
18 | Yung Chuen Tan, Cher Ming Tan, T. C. Ng |
Addressing the challenges in solder resistance measurement for electromigration test. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 50(9-11), pp. 1352-1354, 2010. The full citation details ...](Pics/full.jpeg) |
2010 |
DBLP DOI BibTeX RDF |
|
18 | Yung Chuen Tan, Cher Ming Tan, Xiaowu Zhang, Tai Chong Chai, D. Q. Yu |
Electromigration performance of Through Silicon Via (TSV) - A modeling approach. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 50(9-11), pp. 1336-1340, 2010. The full citation details ...](Pics/full.jpeg) |
2010 |
DBLP DOI BibTeX RDF |
|
18 | C. M. Fu, Cher Ming Tan, S. H. Wu, H. B. Yao |
Width dependence of the effectiveness of reservoir length in improving electromigration for Cu/Low-k interconnects. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 50(9-11), pp. 1332-1335, 2010. The full citation details ...](Pics/full.jpeg) |
2010 |
DBLP DOI BibTeX RDF |
|
18 | Lijuan Liu, Wei Zhou, Hongbo Zhang, Baoling Li, Ping Wu |
Electromigration behavior in Cu/Sn-8Zn-3Bi/Cu solder joint. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 50(2), pp. 251-257, 2010. The full citation details ...](Pics/full.jpeg) |
2010 |
DBLP DOI BibTeX RDF |
|
18 | Pridhvi Dandu, Xuejun Fan, Y. Liu, C. Diao |
Finite element modeling on electromigration of solder joints in wafer level packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 50(4), pp. 547-555, 2010. The full citation details ...](Pics/full.jpeg) |
2010 |
DBLP DOI BibTeX RDF |
|
18 | R. L. de Orio, Hajdin Ceric, Siegfried Selberherr |
Physically based models of electromigration: From Black's equation to modern TCAD models. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 50(6), pp. 775-789, 2010. The full citation details ...](Pics/full.jpeg) |
2010 |
DBLP DOI BibTeX RDF |
|
18 | X. Dong, P. Zhu, Zhonghua Li, Jun Sun, J. D. Boyd |
Electromigration-induced stress in a confined bamboo interconnect with randomly distributed grain sizes. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 50(3), pp. 391-397, 2010. The full citation details ...](Pics/full.jpeg) |
2010 |
DBLP DOI BibTeX RDF |
|
18 | R. L. J. M. Ubachs |
Electromigration in WLCSP solder bumps. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 50(9-11), pp. 1678-1683, 2010. The full citation details ...](Pics/full.jpeg) |
2010 |
DBLP DOI BibTeX RDF |
|
18 | Cher Ming Tan |
Electromigration in ULSI Interconnections ![Search on Bibsonomy](Pics/bibsonomy.png) |
|
2010 |
DOI RDF |
|
18 | Barath Vasudevan, Mohammed Y. Niamat, Mansoor Alam, Srinivasa Vemuru |
Analysis and test of electromigration failures in FPGAs. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ISCAS ![In: International Symposium on Circuits and Systems (ISCAS 2010), May 30 - June 2, 2010, Paris, France, pp. 3905-3908, 2010, IEEE, 978-1-4244-5308-5. The full citation details ...](Pics/full.jpeg) |
2010 |
DBLP DOI BibTeX RDF |
|
18 | John Quah, Dionisios Margetis |
Electromigration in Macroscopic Relaxation of Stepped Surfaces. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Multiscale Model. Simul. ![In: Multiscale Model. Simul. 8(2), pp. 667-700, 2009. The full citation details ...](Pics/full.jpeg) |
2009 |
DBLP DOI BibTeX RDF |
|
18 | Brook Huang-Lin Chao, Xuefeng Zhang, Seung-Hyun Chae, Paul S. Ho |
Recent advances on kinetic analysis of electromigration enhanced intermetallic growth and damage formation in Pb-free solder joints. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 49(3), pp. 253-263, 2009. The full citation details ...](Pics/full.jpeg) |
2009 |
DBLP DOI BibTeX RDF |
|
18 | Ming-Hwa R. Jen, Lee-Cheng Liu, Yi-Shao Lai |
Electromigration on void formation of Sn3Ag1.5Cu FCBGA solder joints. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 49(7), pp. 734-745, 2009. The full citation details ...](Pics/full.jpeg) |
2009 |
DBLP DOI BibTeX RDF |
|
18 | Arijit Roy 0001, Yuejin Hou, Cher Ming Tan |
Electromigration in width transition copper interconnect. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 49(9-11), pp. 1086-1089, 2009. The full citation details ...](Pics/full.jpeg) |
2009 |
DBLP DOI BibTeX RDF |
|
18 | Mircea R. Stan, Paolo Re |
Electromigration-aware design. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ECCTD ![In: 19th European Conference on Circuit Theory and Design, ECCTD 2009, Antalya, Turkey, August 23-27, 2009, pp. 786-789, 2009, IEEE, 978-1-4244-3896-9. The full citation details ...](Pics/full.jpeg) |
2009 |
DBLP DOI BibTeX RDF |
|
18 | Shidong Li, Mohd F. Abdulhamid, Cemal Basaran |
Simulating Damage Mechanics of Electromigration and Thermomigration. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Simul. ![In: Simul. 84(8-9), pp. 391-401, 2008. The full citation details ...](Pics/full.jpeg) |
2008 |
DBLP DOI BibTeX RDF |
|
18 | Jaume Abella 0001, Xavier Vera, Osman S. Unsal, Oguz Ergin, Antonio González 0001, James W. Tschanz |
Refueling: Preventing Wire Degradation due to Electromigration. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Micro ![In: IEEE Micro 28(6), pp. 37-46, 2008. The full citation details ...](Pics/full.jpeg) |
2008 |
DBLP DOI BibTeX RDF |
|
18 | Yong Liu, Lihua Liang, Scott Irving, Timwah Luk |
3D Modeling of electromigration combined with thermal-mechanical effect for IC device and package. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 48(6), pp. 811-824, 2008. The full citation details ...](Pics/full.jpeg) |
2008 |
DBLP DOI BibTeX RDF |
|
18 | Yuan Li, Leo van Marwijk, Som Nath |
Fast electromigration wafer mapping for wafer fab process monitoring and improvement. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 48(8-9), pp. 1388-1392, 2008. The full citation details ...](Pics/full.jpeg) |
2008 |
DBLP DOI BibTeX RDF |
|
18 | M. H. Lin, M. T. Lin, Tahui Wang |
Effects of length scaling on electromigration in dual-damascene copper interconnects. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 48(4), pp. 569-577, 2008. The full citation details ...](Pics/full.jpeg) |
2008 |
DBLP DOI BibTeX RDF |
|
18 | Jin-Tai Yan, Zhi-Wei Chen |
Electromigration-aware rectilinear Steiner tree construction for analog circuits. ![Search on Bibsonomy](Pics/bibsonomy.png) |
APCCAS ![In: IEEE Asia Pacific Conference on Circuits and Systems, APCCAS 2008, Macao, China, November 30 2008 - December 3, 2008, pp. 1692-1695, 2008, IEEE, 978-1-4244-2342-2. The full citation details ...](Pics/full.jpeg) |
2008 |
DBLP DOI BibTeX RDF |
|
18 | Syed M. Alam, Chee Lip Gan, Carl V. Thompson, Donald E. Troxel |
Reliability computer-aided design tool for full-chip electromigration analysis and comparison with different interconnect metallizations. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. J. ![In: Microelectron. J. 38(4-5), pp. 463-473, 2007. The full citation details ...](Pics/full.jpeg) |
2007 |
DBLP DOI BibTeX RDF |
|
18 | Alessandro Marras, Maurizio Impronta, Ilaria De Munari, M. G. Valentini, Andrea Scorzoni |
Reliability assessment of multi-via Cu-damascene structures by wafer-level isothermal electromigration tests. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 47(9-11), pp. 1492-1496, 2007. The full citation details ...](Pics/full.jpeg) |
2007 |
DBLP DOI BibTeX RDF |
|