Search results for "Electromigration"

Hits ?▲	Authors	Title	Venue	Year	Link
18	Tianwei Hu, Yi Li, Yan-Cheong Chan, Fengshun Wu	Effect of nano Al2O3 particles doping on electromigration and mechanical properties of Sn-58Bi solder joints.	Microelectron. Reliab.	2015	DBLP DOI BibTeX RDF
18	Baojun Tang, Kris Croes, Nicolas Jourdan, Jürgen Bömmels, Zsolt Tökei, Ingrid De Wolf, Eric Wilcox, Timothy McMullen	Constant voltage electromigration for advanced BEOL copper interconnects.	IRPS	2015	DBLP DOI BibTeX RDF
18	L. D. Chen, B. L. Lin, M.-H. Hsieh, C. W. Chang, J. S. Tsai, J. C. Peng, C. C. Chiu, Y.-H. Lee	Study of a new electromigration failure mechanism by novel test structure.	IRPS	2015	DBLP DOI BibTeX RDF
18	M. H. Lin, A. S. Oates	Mechanisms of electromigration under AC and pulsed-DC stress in Cu/low-k dual damascene interconnects.	IRPS	2015	DBLP DOI BibTeX RDF
18	Vivek Mishra, Sachin S. Sapatnekar	Circuit delay variability due to wire resistance evolution under AC electromigration.	IRPS	2015	DBLP DOI BibTeX RDF
18	Fen Chen, Erik McCullen, Cathryn Christiansen, Michael A. Shinosky, Roger Dufresne, Prakash Periasamy, Rick Kontra, Carole Graas, Gary StOnge	Diagnostic electromigration reliability evaluation with a local sensing structure.	IRPS	2015	DBLP DOI BibTeX RDF
18	Giulio Marti, Lucile Arnaud, David Ney, Yves Wouters	Interconnect design study for electromigration reliability improvement.	IRPS	2015	DBLP DOI BibTeX RDF
18	Christine S. Hau-Riege, You-Wen Yau, Kevin Caffey, Rajneesh Kumar, YangYang Sun, Andy Bao, Milind Shah, Lily Zhao, Omar Bchir, Ahmer Syed, Steve Bezuk	The electromigration behavior of copper pillars for different current directions and pillar shapes.	IRPS	2015	DBLP DOI BibTeX RDF
18	Baozhen Li, K. Paul Muller, James D. Warnock, Leon J. Sigal, Dinesh Badami	A case study of electromigration reliability: From design point to system operations.	IRPS	2015	DBLP DOI BibTeX RDF
18	Palkesh Jain, Sachin S. Sapatnekar, Jordi Cortadella	Stochastic and topologically aware electromigration analysis for clock skew.	IRPS	2015	DBLP DOI BibTeX RDF
18	Hai-Bao Chen, Sheldon X.-D. Tan, Xin Huang 0003, Valeriy Sukharev	New electromigration modeling and analysis considering time-varying temperature and current densities.	ASP-DAC	2015	DBLP DOI BibTeX RDF
18	Jiwoo Pak, Bei Yu 0001, David Z. Pan	Electromigration-aware redundant via insertion.	ASP-DAC	2015	DBLP DOI BibTeX RDF
18	Palkesh Jain, Sachin S. Sapatnekar, Jordi Cortadella	A retargetable and accurate methodology for logic-IP-internal electromigration assessment.	ASP-DAC	2015	DBLP DOI BibTeX RDF
18	Gracieli Posser, Lucas de Paris, Vivek Mishra, Palkesh Jain, Ricardo Reis 0001, Sachin S. Sapatnekar	Reducing the signal Electromigration effects on different logic gates by cell layout optimization.	LASCAS	2015	DBLP DOI BibTeX RDF
18	Gracieli Posser, Vivek Mishra, Palkesh Jain, Ricardo Reis 0001, Sachin S. Sapatnekar	Impact on performance, power, area and wirelength using electromigration-aware cells.	ICECS	2015	DBLP DOI BibTeX RDF
18	Tiantao Lu, Ankur Srivastava 0001	Electromigration-aware Clock Tree Synthesis for TSV-based 3D-ICs.	ACM Great Lakes Symposium on VLSI	2015	DBLP DOI BibTeX RDF
18	Lihua Liang, Yuanxiang Zhang, Richard Rao	Impact of geometry parameter on electromigration reliability in FCBGA package.	ISQED	2015	DBLP DOI BibTeX RDF
18	Ricardo Martins 0003, Nuno Lourenço 0003, António Canelas, Nuno Horta	Electromigration-aware analog Router with multilayer multiport terminal structures.	Integr.	2014	DBLP DOI BibTeX RDF
18	Jiwoo Pak, Sung Kyu Lim, David Z. Pan	Electromigration Study for Multiscale Power/Ground Vias in TSV-Based 3-D ICs.	IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.	2014	DBLP DOI BibTeX RDF
18	Boukary Ouattara, Lise Doyen, David Ney, Habib Mehrez, Pirouz Bazargan-Sabet	Power grid redundant path contribution in system on chip (SoC) robustness against electromigration.	Microelectron. Reliab.	2014	DBLP DOI BibTeX RDF
18	Wolfhard H. Zisser, Hajdin Ceric, Josef Weinbub, Siegfried Selberherr	Electromigration reliability of open TSV structures.	Microelectron. Reliab.	2014	DBLP DOI BibTeX RDF
18	Wee Loon Ng, Kheng Chok Tee, Junfeng Liu, Yong Chiang Ee, Oliver Aubel, Chuan Seng Tan, Kin Leong Pey	Robust Electromigration reliability through engineering optimization.	Microelectron. Reliab.	2014	DBLP DOI BibTeX RDF
18	Baozhen Li, Cathryn Christiansen, Dinesh Badami, Chih-Chao Yang	Electromigration challenges for advanced on-chip Cu interconnects.	Microelectron. Reliab.	2014	DBLP DOI BibTeX RDF
18	Chin-Li Kao, Tei-Chen Chen, Yi-Shao Lai, Ying-Ta Chiu	Investigation of electromigration reliability of redistribution lines in wafer-level chip-scale packages.	Microelectron. Reliab.	2014	DBLP DOI BibTeX RDF
18	Robert Nürnberg, Andrea Sacconi	An unfitted finite element method for the numerical approximation of void electromigration.	J. Comput. Appl. Math.	2014	DBLP DOI BibTeX RDF
18	Ricardo Martins 0003, Nuno Lourenço 0003, António Canelas, Nuno Horta	Electromigration-aware and IR-Drop avoidance routing in analog multiport terminal structures.	DATE	2014	DBLP DOI BibTeX RDF
18	Gracieli Posser, Vivek Mishra, Ricardo Augusto da Luz Reis, Sachin S. Sapatnekar	Analyzing the electromigration effects on different metal layers and different wire lengths.	ICECS	2014	DBLP DOI BibTeX RDF
18	Valeriy Sukharev, Xin Huang 0003, Hai-Bao Chen, Sheldon X.-D. Tan	IR-drop based electromigration assessment: parametric failure chip-scale analysis.	ICCAD	2014	DBLP DOI BibTeX RDF
18	Gracieli Posser, Vivek Mishra, Palkesh Jain, Ricardo Reis 0001, Sachin S. Sapatnekar	A systematic approach for analyzing and optimizing cell-internal signal electromigration.	ICCAD	2014	DBLP DOI BibTeX RDF
18	Taeyoung Kim 0001, Bowen Zheng, Hai-Bao Chen, Qi Zhu 0002, Valeriy Sukharev, Sheldon X.-D. Tan	Lifetime optimization for real-time embedded systems considering electromigration effects.	ICCAD	2014	DBLP DOI BibTeX RDF
18	Wei-Ting Jonas Chan, Andrew B. Kahng, Siddhartha Nath	Methodology for electromigration signoff in the presence of adaptive voltage scaling.	SLIP	2014	DBLP DOI BibTeX RDF
18	Qiaosha Zou, Tao Zhang 0032, Cong Xu, Yuan Xie 0001	TSV power supply array electromigration lifetime analysis in 3D ICS.	ACM Great Lakes Symposium on VLSI	2014	DBLP DOI BibTeX RDF
18	Di-An Li, Malgorzata Marek-Sadowska	Estimating true worst currents for power grid electromigration analysis.	ISQED	2014	DBLP DOI BibTeX RDF
18	Zhong Guan, Malgorzata Marek-Sadowska, Sani R. Nassif	Statistical analysis of process variation induced SRAM electromigration degradation.	ISQED	2014	DBLP DOI BibTeX RDF
18	Michael Hook, Di Erick Xu, Michael Mayer	Electromigration testing of wire bonds.	CCECE	2014	DBLP DOI BibTeX RDF
18	Xin Huang 0003, Tan Yu, Valeriy Sukharev, Sheldon X.-D. Tan	Physics-based Electromigration Assessment for Power Grid Networks.	DAC	2014	DBLP DOI BibTeX RDF
18	Thomas Frank, Stéphane Moreau, Cédrick Chappaz, Patrick Leduc, Lucile Arnaud, Aurélie Thuaire, Emmanuel Chery, F. Lorut, Lorena Anghel, Gilles Poupon	Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric.	Microelectron. Reliab.	2013	DBLP DOI BibTeX RDF
18	Ted Sun, Ayhan A. Mutlu, Mahmudur Rahman	A new statistical methodology predicting chip failure probability considering electromigration.	Microelectron. Reliab.	2013	DBLP DOI BibTeX RDF
18	M. K. Lim, Vassilios A. Chouliaras, Chee Lip Gan, Vincent M. Dwyer	Bidirectional electromigration failure.	Microelectron. Reliab.	2013	DBLP DOI BibTeX RDF
18	Yuanqing Cheng, Aida Todri-Sanial, Alberto Bosio, Luigi Dillio, Patrick Girard 0001, Arnaud Virazel, Pascal Vivet, Marc Belleville	A novel method to mitigate TSV electromigration for 3D ICs.	ISVLSI	2013	DBLP DOI BibTeX RDF
18	Andrew B. Kahng, Siddhartha Nath, Tajana Rosing	On potential design impacts of electromigration awareness.	ASP-DAC	2013	DBLP DOI BibTeX RDF
18	Jens Lienig	Electromigration and its impact on physical design in future technologies.	ISPD	2013	DBLP DOI BibTeX RDF
18	Mohammad Fawaz, Sandeep Chatterjee, Farid N. Najm	A vectorless framework for power grid electromigration checking.	ICCAD	2013	DBLP DOI BibTeX RDF
18	Jiwoo Pak, Sung Kyu Lim, David Z. Pan	Electromigration study for multi-scale power/ground vias in TSV-based 3D ICs.	ICCAD	2013	DBLP DOI BibTeX RDF
18	Xin Zhao 0001, Yang Wan, Michael Scheuermann, Sung Kyu Lim	Transient modeling of TSV-wire electromigration and lifetime analysis of power distribution network for 3D ICs.	ICCAD	2013	DBLP DOI BibTeX RDF
18	Sandeep Chatterjee, Mohammad Fawaz, Farid N. Najm	Redundancy-aware electromigration checking for mesh power grids.	ICCAD	2013	DBLP DOI BibTeX RDF
18	Ted Sun, Ayhan A. Mutlu, Mahmud Rahman	Statistical Electromigration analysis of a chip with the consideration of a within-die temperature map.	ISCAS	2013	DBLP DOI BibTeX RDF
18	Zhong Guan, Malgorzata Marek-Sadowska, Sani R. Nassif	SRAM bit-line electromigration mechanism and its prevention scheme.	ISQED	2013	DBLP DOI BibTeX RDF
18	Yun-Chih Tsai, Tai-Hung Li, Tai-Chen Chen, Chung-Wei Yeh	Electromigration- and obstacle-avoiding routing tree construction.	VLSI-DAT	2013	DBLP DOI BibTeX RDF
18	Vivek Mishra, Sachin S. Sapatnekar	The impact of electromigration in copper interconnects on power grid integrity.	DAC	2013	DBLP DOI BibTeX RDF
18	Iris Hui-Ru Jiang, Hua-Yu Chang, Chih-Long Chang	WiT: Optimal Wiring Topology for Electromigration Avoidance.	IEEE Trans. Very Large Scale Integr. Syst.	2012	DBLP DOI BibTeX RDF
18	Meng Keong Lim, Jingyuan Lin, Yong Chiang Ee, Chee Mang Ng, Jun Wei, Chee Lip Gan	Experimental characterization and modelling of electromigration lifetime under unipolar pulsed current stress.	Microelectron. Reliab.	2012	DBLP DOI BibTeX RDF
18	Roberto Lacerda de Orio, Hajdin Ceric, Siegfried Selberherr	Electromigration failure in a copper dual-damascene structure with a through silicon via.	Microelectron. Reliab.	2012	DBLP DOI BibTeX RDF
18	Feifei He, Cher Ming Tan	Electromigration reliability of interconnections in RF low noise amplifier circuit.	Microelectron. Reliab.	2012	DBLP DOI BibTeX RDF
18	Vincent M. Dwyer	Diffusivity variation in Electromigration failure.	Microelectron. Reliab.	2012	DBLP DOI BibTeX RDF
18	Xiaodao Chen, Chen Liao, Tongquan Wei, Shiyan Hu	An Interconnect Reliability-Driven Routing Technique for Electromigration Failure Avoidance.	IEEE Trans. Dependable Secur. Comput.	2012	DBLP DOI BibTeX RDF
18	SaiDeepa Rayaprolu, Srinivasa Vemuru, Mohammed Y. Niamat	Efficient AFT implementation in FPGAs to detect potential electromigration failures.	EIT	2012	DBLP DOI BibTeX RDF
18	Mehmet Kayaalp 0001, Fahrettin Koc, Oguz Ergin	Exploiting Bus Level and Bit Level Inactivity for Preventing Wire Degradation due to Electromigration.	DSD	2012	DBLP DOI BibTeX RDF
18	Tatsuhiko Ohata, Yasuhisa Naitoh, Masayo Horikawa, Dong F. Wang, Ryutaro Maeda	Fabrication of nanogap electrode using electromigration method during metal deposition.	NEMS	2012	DBLP DOI BibTeX RDF
18	Y. C. Chen, Chia Wei Chu, Tzu-Yuan Chao, Y. T. Cheng, Chih Chen	The electromigration investigation of Cu-Ni nanocomposites.	NEMS	2012	DBLP DOI BibTeX RDF
18	Jiwoo Pak, Sung Kyu Lim, David Z. Pan	Electromigration-aware routing for 3D ICs with stress-aware EM modeling.	ICCAD	2012	DBLP DOI BibTeX RDF
18	Jing Xie 0006, Vijaykrishnan Narayanan, Yuan Xie 0001	Mitigating electromigration of power supply networks using bidirectional current stress.	ACM Great Lakes Symposium on VLSI	2012	DBLP DOI BibTeX RDF
18	Amir Hosseini, Vahid Shabro	Electromigration-aware dynamic routing algorithm for network-on-chip applications.	Int. J. High Perform. Syst. Archit.	2011	DBLP DOI BibTeX RDF
18	Hsin-Hsiung Huang, Jui-Hung Hung, Cheng-Chiang Lin, Tsai-Ming Hsieh	Wire Planning for Electromigration and Interference Avoidance in Analog Circuits.	IEICE Trans. Fundam. Electron. Commun. Comput. Sci.	2011	DBLP DOI BibTeX RDF
18	Biswajit Patra, Nayan Chandak, Amlan Chakrabarti	An Efficient Methodology for Full Chip Signal ElectroMigration Analysis for Advanced Technology Node Designs.	J. Low Power Electron.	2011	DBLP DOI BibTeX RDF
18	Vincent M. Dwyer	Analysis of critical-length data from Electromigration failure studies.	Microelectron. Reliab.	2011	DBLP DOI BibTeX RDF
18	Fei Su, Ronghai Mao, Xiaoyan Wang, Guangzhou Wang, Haiyan Pan	Creep behaviour of Sn-3.8Ag-0.7Cu under the effect of electromigration: Experiments and modelling.	Microelectron. Reliab.	2011	DBLP DOI BibTeX RDF
18	R. L. de Orio, Hajdin Ceric, Siegfried Selberherr	A compact model for early electromigration failures of copper dual-damascene interconnects.	Microelectron. Reliab.	2011	DBLP DOI BibTeX RDF
18	Kiju Lee, Keun-Soo Kim, Yutaka Tsukada, Katsuaki Suganuma, Kimihiro Yamanaka, Soichi Kuritani, Minoru Ueshima	Influence of crystallographic orientation of Sn-Ag-Cu on electromigration in flip-chip joint.	Microelectron. Reliab.	2011	DBLP DOI BibTeX RDF
18	Zheng Fan, Xinyong Tao, Xudong Cui, Xudong Fan, Xiaobin Zhang, Lixin Dong	Electromigration-based deposition enabled by nanorobotic manipulation inside a transmission electron microscope.	ICRA	2011	DBLP DOI BibTeX RDF
18	Jin-Tai Yan, Zhi-Wei Chen	Obstacle-aware multiple-source rectilinear Steiner tree with electromigration and IR-drop avoidance.	DATE	2011	DBLP DOI BibTeX RDF
18	Ramachandran Venkatasubramanian, Doohwang Chang, Sule Ozev	Analysis and Mitigation of Electromigration in RF Circuits: An LNA Case Study.	ETS	2011	DBLP DOI BibTeX RDF
18	Y. Kuwabara, S. Nishimura, R. Zaharuddin, J. Shirakashi	Investigation of electromigration in micrometer-scale metal wires by in-situ optical microscopy.	NEMS	2011	DBLP DOI BibTeX RDF
18	Mohit Pathak, Jiwoo Pak, David Z. Pan, Sung Kyu Lim	Electromigration modeling and full-chip reliability analysis for BEOL interconnect in TSV-based 3D ICs.	ICCAD	2011	DBLP DOI BibTeX RDF
18	Di-An Li, Malgorzata Marek-Sadowska	Variation-aware electromigration analysis of power/ground networks.	ICCAD	2011	DBLP DOI BibTeX RDF
18	Jaume Abella 0001, Xavier Vera	Electromigration for microarchitects.	ACM Comput. Surv.	2010	DBLP DOI BibTeX RDF
18	H. W. Tseng, C. T. Lu, Y. H. Hsiao, P. L. Liao, Y. C. Chuang, T. Y. Chung, Cheng-Yi Liu	Electromigration-induced failures at Cu/Sn/Cu flip-chip joint interfaces.	Microelectron. Reliab.	2010	DBLP DOI BibTeX RDF
18	Yung Chuen Tan, Cher Ming Tan, T. C. Ng	Addressing the challenges in solder resistance measurement for electromigration test.	Microelectron. Reliab.	2010	DBLP DOI BibTeX RDF
18	Yung Chuen Tan, Cher Ming Tan, Xiaowu Zhang, Tai Chong Chai, D. Q. Yu	Electromigration performance of Through Silicon Via (TSV) - A modeling approach.	Microelectron. Reliab.	2010	DBLP DOI BibTeX RDF
18	C. M. Fu, Cher Ming Tan, S. H. Wu, H. B. Yao	Width dependence of the effectiveness of reservoir length in improving electromigration for Cu/Low-k interconnects.	Microelectron. Reliab.	2010	DBLP DOI BibTeX RDF
18	Lijuan Liu, Wei Zhou, Hongbo Zhang, Baoling Li, Ping Wu	Electromigration behavior in Cu/Sn-8Zn-3Bi/Cu solder joint.	Microelectron. Reliab.	2010	DBLP DOI BibTeX RDF
18	Pridhvi Dandu, Xuejun Fan, Y. Liu, C. Diao	Finite element modeling on electromigration of solder joints in wafer level packages.	Microelectron. Reliab.	2010	DBLP DOI BibTeX RDF
18	R. L. de Orio, Hajdin Ceric, Siegfried Selberherr	Physically based models of electromigration: From Black's equation to modern TCAD models.	Microelectron. Reliab.	2010	DBLP DOI BibTeX RDF
18	X. Dong, P. Zhu, Zhonghua Li, Jun Sun, J. D. Boyd	Electromigration-induced stress in a confined bamboo interconnect with randomly distributed grain sizes.	Microelectron. Reliab.	2010	DBLP DOI BibTeX RDF
18	R. L. J. M. Ubachs	Electromigration in WLCSP solder bumps.	Microelectron. Reliab.	2010	DBLP DOI BibTeX RDF
18	Cher Ming Tan	Electromigration in ULSI Interconnections		2010	DOI RDF
18	Barath Vasudevan, Mohammed Y. Niamat, Mansoor Alam, Srinivasa Vemuru	Analysis and test of electromigration failures in FPGAs.	ISCAS	2010	DBLP DOI BibTeX RDF
18	John Quah, Dionisios Margetis	Electromigration in Macroscopic Relaxation of Stepped Surfaces.	Multiscale Model. Simul.	2009	DBLP DOI BibTeX RDF
18	Brook Huang-Lin Chao, Xuefeng Zhang, Seung-Hyun Chae, Paul S. Ho	Recent advances on kinetic analysis of electromigration enhanced intermetallic growth and damage formation in Pb-free solder joints.	Microelectron. Reliab.	2009	DBLP DOI BibTeX RDF
18	Ming-Hwa R. Jen, Lee-Cheng Liu, Yi-Shao Lai	Electromigration on void formation of Sn3Ag1.5Cu FCBGA solder joints.	Microelectron. Reliab.	2009	DBLP DOI BibTeX RDF
18	Arijit Roy 0001, Yuejin Hou, Cher Ming Tan	Electromigration in width transition copper interconnect.	Microelectron. Reliab.	2009	DBLP DOI BibTeX RDF
18	Mircea R. Stan, Paolo Re	Electromigration-aware design.	ECCTD	2009	DBLP DOI BibTeX RDF
18	Shidong Li, Mohd F. Abdulhamid, Cemal Basaran	Simulating Damage Mechanics of Electromigration and Thermomigration.	Simul.	2008	DBLP DOI BibTeX RDF
18	Jaume Abella 0001, Xavier Vera, Osman S. Unsal, Oguz Ergin, Antonio González 0001, James W. Tschanz	Refueling: Preventing Wire Degradation due to Electromigration.	IEEE Micro	2008	DBLP DOI BibTeX RDF
18	Yong Liu, Lihua Liang, Scott Irving, Timwah Luk	3D Modeling of electromigration combined with thermal-mechanical effect for IC device and package.	Microelectron. Reliab.	2008	DBLP DOI BibTeX RDF
18	Yuan Li, Leo van Marwijk, Som Nath	Fast electromigration wafer mapping for wafer fab process monitoring and improvement.	Microelectron. Reliab.	2008	DBLP DOI BibTeX RDF
18	M. H. Lin, M. T. Lin, Tahui Wang	Effects of length scaling on electromigration in dual-damascene copper interconnects.	Microelectron. Reliab.	2008	DBLP DOI BibTeX RDF
18	Jin-Tai Yan, Zhi-Wei Chen	Electromigration-aware rectilinear Steiner tree construction for analog circuits.	APCCAS	2008	DBLP DOI BibTeX RDF
18	Syed M. Alam, Chee Lip Gan, Carl V. Thompson, Donald E. Troxel	Reliability computer-aided design tool for full-chip electromigration analysis and comparison with different interconnect metallizations.	Microelectron. J.	2007	DBLP DOI BibTeX RDF
18	Alessandro Marras, Maurizio Impronta, Ilaria De Munari, M. G. Valentini, Andrea Scorzoni	Reliability assessment of multi-via Cu-damascene structures by wafer-level isothermal electromigration tests.	Microelectron. Reliab.	2007	DBLP DOI BibTeX RDF