Search results for "packages"

Hits ?▲	Authors	Title	Venue	Year	Link
14	Andy Sayler, Dirk Grunwald, John Black, Elizabeth White, Matthew Monaco	Supporting CS education via virtualization and packages: tools for successfully accommodating "bring-your-own-device" at scale.	SIGCSE	2014	DBLP DOI BibTeX RDF
14	Quan Pham, Tanu Malik, Ian T. Foster	Auditing and Maintaining Provenance in Software Packages.	IPAW	2014	DBLP DOI BibTeX RDF
14	Araz Taeihagh, René Bañares-Alcántara	Towards Proactive and Flexible Agent-Based Generation of Policy Packages for Active Transportation.	HICSS	2014	DBLP DOI BibTeX RDF
14	Iren Valova, Andrew Embry, MacKinley Trudeau, Gueorgui Gueorguiev	Evolving Vacation Packages: Genetic Algorithms for Entertainment.	Complex Adaptive Systems	2014	DBLP DOI BibTeX RDF
14	Jitender Kumar Chhabra, Anshu Parashar	Prediction of changeability for object oriented classes and packages by mining change history.	CCECE	2014	DBLP DOI BibTeX RDF
14	Yuki Manabe 0001, Daniel M. Germán, Katsuro Inoue	Analyzing the Relationship between the License of Packages and Their Files in Free and Open Source Software.	OSS	2014	DBLP DOI BibTeX RDF
14	R. Muhammad Atif Azad, Conor Ryan	The Best Things Don't Always Come in Small Packages: Constant Creation in Grammatical Evolution.	EuroGP	2014	DBLP DOI BibTeX RDF
14	Maëlick Claes, Tom Mens, Philippe Grosjean	maintaineR: A Web-Based Dashboard for Maintainers of CRAN Packages.	ICSME	2014	DBLP DOI BibTeX RDF
14	Nurendra Choudhary, Venkatesh Choppella, Raghu Reddy, Thirumal Ravula	Any Time Virtual Labs: On Portable Media and as Debian Packages.	T4E	2014	DBLP DOI BibTeX RDF
14	Vladimir V. Bytev, Mikhail Yu. Kalmykov, Bernd A. Kniehl	HYPERDIRE, HYPERgeometric functions DIfferential REduction: MATHEMATICA-based packages for differential reduction of generalized hypergeometric functions pFp-1, F1, F2, F3, F4.	Comput. Phys. Commun.	2013	DBLP DOI BibTeX RDF
14	Weifeng Pan 0001, Bo Jiang, Bing Li 0010	Refactoring Software Packages via Community Detection in Complex Software Networks.	Int. J. Autom. Comput.	2013	DBLP DOI BibTeX RDF
14	Emanuel J. V. Gonçalves, Julio Saez-Rodriguez	Cyrface: An interface from Cytoscape to R that provides a user interface to R packages.	F1000Research	2013	DBLP DOI BibTeX RDF
14	Stylianos Dosopoulos, Bo Zhao, Jin-Fa Lee	Non-conformal and parallel discontinuous Galerkin time domain method for Maxwell's equations: EM analysis of IC packages.	J. Comput. Phys.	2013	DBLP DOI BibTeX RDF
14	Hanan Ahmed Abdulhameed	Can E-Training Packages Develop Webquests Designing Skills for Teachers of Gifted Students?	Int. J. Knowl. Soc. Res.	2013	DBLP DOI BibTeX RDF
14	Chetan Jhurani, Travis M. Austin, Michael A. Heroux, James M. Willenbring	Supporting 64-bit global indices in Epetra and other Trilinos packages - Techniques used and lessons learned.	CoRR	2013	DBLP BibTeX RDF
14	Vladimir V. Bytev, Bernd A. Kniehl	HYPERgeometric functions DIfferential REduction: MATHEMATICA based packages for differential reduction of generalized hypergeometric functions: Horn hypergeometric functions of two variables.	CoRR	2013	DBLP BibTeX RDF
14	Carsten Schneider	Modern Summation Methods for Loop Integrals in Quantum Field Theory: The Packages Sigma, EvaluateMultiSums and SumProduction.	CoRR	2013	DBLP BibTeX RDF
14	Vladimir V. Bytev, Mikhail Yu. Kalmykov, Sven-Olaf Moch	HYPERDIRE: HYPERgeometric functions DIfferential REduction: MATHEMATICA based packages for differential reduction of generalized hypergeometric functions: $F_D$ and $F_S$ Horn-type hypergeometric functions of three variables.	CoRR	2013	DBLP BibTeX RDF
14	Shahram Esmaeilsabzali, Rupak Majumdar, Thomas Wies, Damien Zufferey	A Notion of Dynamic Interface for Depth-Bounded Object-Oriented Packages.	CoRR	2013	DBLP BibTeX RDF
14	Firouz Abdullah Al-Wassai, N. V. Kalyankar	Image Fusion Technologies In Commercial Remote Sensing Packages.	CoRR	2013	DBLP BibTeX RDF
14	Ivan Girotto, Axel Kohlmeyer, David Grellscheid, Shawn T. Brown	Advanced Techniques for Scientific Programming and Collaborative Development of Open Source Software Packages at the International Centre for Theoretical Physics (ICTP).	CoRR	2013	DBLP BibTeX RDF
14	Thomas Haigh	Software and souls; programs and packages.	Commun. ACM	2013	DBLP DOI BibTeX RDF
14	B. Pardo, A. Gasse, A. Fargeix, Jiri Jakovenko, Robert J. Werkhoven, Xavier Perpiñà, Xavier Jordà, Miquel Vellvehí, T. Van Weelden, P. Bancken	Thermal resistance investigations on new leadframe-based LED packages and boards.	Microelectron. Reliab.	2013	DBLP DOI BibTeX RDF
14	Peyman Rafiee, Golta Khatibi, N. Nelhiebel, Rainer Pelzer	Application of quantitative modal analysis for investigation of thermal degradation of microelectronic packages.	Microelectron. Reliab.	2013	DBLP DOI BibTeX RDF
14	B. Wang, Jeroen De Coster, Martine Wevers, Ingrid De Wolf	A novel method to measure the internal pressure of MEMS thin-film packages.	Microelectron. Reliab.	2013	DBLP DOI BibTeX RDF
14	Toru Ikeda, Toshifumi Kanno, Nobuyuki Shishido, Noriyuki Miyazaki, Hiroyuki Tanaka, Takuya Hatao	Non-linear analyses of strain in flip chip packages improved by the measurement using the digital image correlation method.	Microelectron. Reliab.	2013	DBLP DOI BibTeX RDF
14	Huai-Hui Ren, Xi-Shu Wang, Su Jia	Fracture analysis on die attach adhesives for stacked packages based on in-situ testing and cohesive zone model.	Microelectron. Reliab.	2013	DBLP DOI BibTeX RDF
14	C. Robert Kao, Albert T. Wu, King-Ning Tu, Yi-Shao Lai	Reliability of micro-interconnects in 3D IC packages.	Microelectron. Reliab.	2013	DBLP DOI BibTeX RDF
14	Weifeng Pan 0001, Bo Jiang, Youyang Xu	Refactoring packages of object-oriented software using genetic algorithm based community detection technique.	Int. J. Comput. Appl. Technol.	2013	DBLP DOI BibTeX RDF
14	Nathalie Kae-Nune, Stephanie Pesseguier	Qualification and testing process to implement anti-counterfeiting technologies into IC packages.	DATE	2013	DBLP DOI BibTeX RDF
14	Sayuri Kohara, Akihiro Horibe, Kuniaki Sueoka, Keiji Matsumoto, Fumiaki Yamada, Hiroyuki Mori, Yasumitsu Orii	Thermo-mechanical evaluation of 3D packages.	3DIC	2013	DBLP DOI BibTeX RDF
14	Pasquale Ardimento, Marta Cimitile, Giuseppe Visaggio	Distributed Software Development with Knowledge Experience Packages.	OTM Workshops	2013	DBLP DOI BibTeX RDF
14	Yasunobu Nohara, Naoki Nakashima, Ashir Ahmed, Masahiro Kuroda, Sozo Inoue, Partha Pratim Ghosh, Rafiqul Islam Maruf, Tatsuo Hiramatsu	Portable Health Clinic Packages for Base of Pyramid.	MedInfo	2013	DBLP BibTeX RDF
14	Enrique Barra, Aldo Gordillo, Daniel Gallego, Juan Quemada	Integration of SCORM packages into web games.	FIE	2013	DBLP DOI BibTeX RDF
14	Olivier Berger, Christian Bac	Authoritative Linked Data Descriptions of Debian Source Packages Using ADMS.SW.	OSS	2013	DBLP DOI BibTeX RDF
14	Chao-Chun Chen, Nguyen Huu Tinh Giang, Tzu-Chao Lin, Min-Hsiung Hung	MC framework: High-performance distributed framework for standalone data analysis packages over Hadoop-based cloud.	GrC	2013	DBLP DOI BibTeX RDF
14	Jovani L. Favero, P. L. C. Lage	The dual-quadrature method of generalized moments using automatic integration packages.	Comput. Chem. Eng.	2012	DBLP DOI BibTeX RDF
14	Shohei Ohsawa, Toshiyuki Amagasa, Hiroyuki Kitagawa	RDF packages: a scheme for efficient reasoning and querying over large-scale RDF data.	Int. J. Web Inf. Syst.	2012	DBLP DOI BibTeX RDF
14	Katharina Meier, Nathan Schmid, Wilfred F. van Gunsteren	Interfacing the GROMOS (bio)molecular simulation software to quantum-chemical program packages.	J. Comput. Chem.	2012	DBLP DOI BibTeX RDF
14	Jonatan Taminau, Stijn Meganck, Cosmin Lazar, David Steenhoff, Alain Coletta, Colin Molter, Robin Duque, Virginie de Schaetzen, David Y. Weiss Solís, Hugues Bersini, Ann Nowé	Unlocking the potential of publicly available microarray data using inSilicoDb and inSilicoMerging R/Bioconductor packages.	BMC Bioinform.	2012	DBLP DOI BibTeX RDF
14	Vahab Nafisi, Landon Urquhart, Marcelo C. Santos, Felipe G. Nievinski, Johannes Böhm, Dudy D. Wijaya, Harald Schuh, Alireza Azmoudeh Ardalan, Thomas Hobiger, Ryuichi Ichikawa, Florian Zus, Jens Wickert, Pascal Gegout	Comparison of Ray-Tracing Packages for Troposphere Delays.	IEEE Trans. Geosci. Remote. Sens.	2012	DBLP DOI BibTeX RDF
14	Pedro Gómez-Gasquet, Raúl Rodríguez-Rodríguez, Rubén Darío Franco, Ángel Ortiz Bas	A collaborative scheduling GA for products-packages service within extended selling chains environment.	J. Intell. Manuf.	2012	DBLP DOI BibTeX RDF
14	Luís Ferreira 0001, Goran D. Putnik, Maria Manuela Cruz-Cunha, Zlata Putnik	Towards Effective Tourism Dynamic Packages.	Inf. Resour. Manag. J.	2012	DBLP DOI BibTeX RDF
14	Philip J. Guo	CDE: A Tool for Creating Portable Experimental Software Packages.	Comput. Sci. Eng.	2012	DBLP DOI BibTeX RDF
14	Manuel Travassos Valdez, Carlos Machado Ferreira, Fernando Pires Maciel Barbosa	Software Packages to Support Electrical Engineering Virtual Lab.	Int. J. Online Eng.	2012	DBLP DOI BibTeX RDF
14	Harry Ku, R. Fulcher	Using computer software packages to enhance the teaching in Engineering Management Science: Part 3 - simulation.	Comput. Appl. Eng. Educ.	2012	DBLP DOI BibTeX RDF
14	Harry Ku, R. Fulcher	Using computer software packages to enhance the teaching in Engineering Management Science - part 2: Programming techniques.	Comput. Appl. Eng. Educ.	2012	DBLP DOI BibTeX RDF
14	Yi-Shao Lai, Meng-Kai Shih, Chang-Chi Lee, Tong Hong Wang	Structural design guideline to minimize extreme low-k delamination potential in 40 nm flip-chip packages.	Microelectron. Reliab.	2012	DBLP DOI BibTeX RDF
14	Sébastien Jacques, A. Caldeira, N. Batut, A. Schellmanns, R. Leroy, L. Gonthier	Lifetime prediction modeling of non-insulated TO-220AB packages with lead-based solder joints during power cycling.	Microelectron. Reliab.	2012	DBLP DOI BibTeX RDF
14	Chien-Pan Liu, Yen-Fu Liu, Chang-Hung Li, Hung-Chieh Cheng, Yi-Chun Kung, Jeng-Yu Lin	A novel decapsulation technique for failure analysis of epoxy molded IC packages with Cu wire bonds.	Microelectron. Reliab.	2012	DBLP DOI BibTeX RDF
14	Ralf Schmidt, Christian König, P. Prenosil	Novel wire bond material for advanced power module packages.	Microelectron. Reliab.	2012	DBLP DOI BibTeX RDF
14	Michael Goroll, Reinhard Pufall	Determination of adhesion and delamination prediction for semiconductor packages by using Grey Scale Correlation and Cohesive Zone Modelling.	Microelectron. Reliab.	2012	DBLP DOI BibTeX RDF
14	Kyung-Woon Jang, Jin-Hyoung Park, Soon-Bok Lee, Kyung-Wook Paik	A study on thermal cycling (T/C) reliability of anisotropic conductive film (ACF) flip chip assembly for thin chip-on-board (COB) packages.	Microelectron. Reliab.	2012	DBLP DOI BibTeX RDF
14	Ming-Yi Tsai, C. H. Chen, C. S. Kang	Thermal measurements and analyses of low-cost high-power LED packages and their modules.	Microelectron. Reliab.	2012	DBLP DOI BibTeX RDF
14	Kyoung-Lim Suk, Ho-Young Son, Chang-Kyu Chung, Joong Do Kim, Jin-Woo Lee, Kyung-Wook Paik	Flexible Chip-on-Flex (COF) and embedded Chip-in-Flex (CIF) packages by applying wafer level package (WLP) technology using anisotropic conductive films (ACFs).	Microelectron. Reliab.	2012	DBLP DOI BibTeX RDF
14	Kyoung-Lim Suk, Kyosung Choo, Sung Jin Kim, Jong-Soo Kim, Kyung-Wook Paik	Studies on various chip-on-film (COF) packages using ultra fine pitch two-metal layer flexible printed circuits (two-metal layer FPCs).	Microelectron. Reliab.	2012	DBLP DOI BibTeX RDF
14	Wu-Hu Li, S. W. Joelle Ong	Cu diffusion in Ag-plated Cu leadframe packages.	Microelectron. Reliab.	2012	DBLP DOI BibTeX RDF
14	Yung-Sen Lin, Jian-Zhi Xu, Shih-Wei Tien, Shih-Chan Hung, Wei-Li Yuan, Tsair-Wang Chung, Char-Ming Huang	Enhanced anisotropic conductive film (ACF) void-free bonding for Chip-On-Glass (COG) packages by means of low temperature plasmas.	Microelectron. Reliab.	2012	DBLP DOI BibTeX RDF
14	Mustapha Faqir, T. Batten, T. Mrotzek, S. Knippscheer, M. Massiot, M. Buchta, Hervé Blanck, S. Rochette, Olivier Vendier, Martin Kuball	Improved thermal management for GaN power electronics: Silver diamond composite packages.	Microelectron. Reliab.	2012	DBLP DOI BibTeX RDF
14	Rainer Dudek, Reinhard Pufall, Bettina Seiler, Bernd Michel	Studies on the reliability of power packages based on strength and fracture criteria.	Microelectron. Reliab.	2012	DBLP DOI BibTeX RDF
14	Bongtae Han	Measurements of True Leak Rates of MEMS Packages.	Sensors	2012	DBLP DOI BibTeX RDF
14	Wandi Kruger	Strategic business-IT alignment of application software packages: bridging the information technology gap.	South Afr. Comput. J.	2012	DBLP DOI BibTeX RDF
14	Min Xie 0002, Laks V. S. Lakshmanan, Peter T. Wood	Composite recommendations: from items to packages.	Frontiers Comput. Sci.	2012	DBLP DOI BibTeX RDF
14	Ferruccio Damiani, Arnd Poetzsch-Heffter, Yannick Welsch	A type system for checking specialization of packages in object-oriented programming.	SAC	2012	DBLP DOI BibTeX RDF
14	Juan S. Ordonez, Philip Dautel, Martin Schuettler, Thomas Stieglitz	Hermetic glass soldered micro-packages for a vision prosthesis.	EMBC	2012	DBLP DOI BibTeX RDF
14	François Jacquenet, Marc Bernard	(Generic) Packages for Logic Programs.	ICTAI	2012	DBLP DOI BibTeX RDF
14	Matthew Sessoms, Kemafor Anyanwu	SkyPackage: From Finding Items to Finding a Skyline of Packages on the Semantic Web.	JIST	2012	DBLP DOI BibTeX RDF
14	Stefan Theurich, Markus Stoess, Martin Wollschlaeger, Leon Urbas	Communication and information engineering of FDI equipment packages.	ETFA	2012	DBLP DOI BibTeX RDF
14	Shailesh Shrestha, Zbigniew Bochenek, Claire Smith	Artificial Neural Network (ANN) beyond cots remote sensing packages: Implementation of Extreme Learning Machine (ELM) in MATLAB.	IGARSS	2012	DBLP DOI BibTeX RDF
14	Cyrille Artho, Kuniyasu Suzaki, Roberto Di Cosmo, Ralf Treinen, Stefano Zacchiroli	Why do software packages conflict?	MSR	2012	DBLP DOI BibTeX RDF
14	Raymond Nguyen, Richard C. Holt	Life and death of software packages: an evolutionary study of Debian.	CASCON	2012	DBLP BibTeX RDF
14	Hong-Dar Lin, Singa Wang Chiu	Flaw detection of domed surfaces in LED packages by machine vision system.	Expert Syst. Appl.	2011	DBLP DOI BibTeX RDF
14	Martyn Plummer	Portable C++ for R Packages.	R J.	2011	DBLP DOI BibTeX RDF
14	N. Jagannathan, R. Palaninathan	Thermomechanical Modeling of Electronic packages.	Int. J. Model. Simul. Sci. Comput.	2011	DBLP DOI BibTeX RDF
14	Mahmoud O. Elish, Ali H. Al-Yafei, Muhammed Al-Mulhem	Empirical comparison of three metrics suites for fault prediction in packages of object-oriented systems: A case study of Eclipse.	Adv. Eng. Softw.	2011	DBLP DOI BibTeX RDF
14	Jaap Boender	Formal verification of a theory of packages.	Electron. Commun. Eur. Assoc. Softw. Sci. Technol.	2011	DBLP DOI BibTeX RDF
14	Lorena Blasco-Arcas, José-Ignacio Aznar-Baranda, Blanca Hernández Ortega, José Ruíz-Mas	IPTV as a services distribution channel: The importance of interactivity and personalization in the purchasing of news-on-demand packages.	Ind. Manag. Data Syst.	2011	DBLP DOI BibTeX RDF
14	Harry Ku, R. Fulcher, Wei Xiang 0001	Using computer software packages to enhance the teaching of engineering management science: Part 1 - Critical path networks.	Comput. Appl. Eng. Educ.	2011	DBLP DOI BibTeX RDF
14	Zhouchen Lin	Some Software Packages for Partial SVD Computation	CoRR	2011	DBLP BibTeX RDF
14	Vladimir V. Bytev, Mikhail Yu. Kalmykov, Bernd A. Kniehl	HYPERDIRE: HYPERgeometric functions DIfferential REduction: MATHEMATICA based packages for differential reduction of generalized hypergeometric functions pFq, F1,F2,F3,F4.	CoRR	2011	DBLP BibTeX RDF
14	Yukun Wu, Le Zhang 0004	Comparison of Two Academic Software packages for Analyzing Two-Dimensional gel Images.	J. Bioinform. Comput. Biol.	2011	DBLP DOI BibTeX RDF
14	Haixia Shang, Jianxin Gao, Pascual Ian Nicholson, Steve Kenny	An investigation of reliability of solder joints in microelectronic packages by high temperature moiré method.	Microelectron. Reliab.	2011	DBLP DOI BibTeX RDF
14	Yao Hsu, Chih-Yen Su, Wen-Fang Wu	Quantitative reliability analysis of flip-chip packages under thermal-cyclic loading and in consideration of parameter uncertainties.	Microelectron. Reliab.	2011	DBLP DOI BibTeX RDF
14	Hsiu-Jen Lin, Tung-Han Chuang	Interfacial microstructure and bonding strength of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-xZn solder BGA packages with immersion Ag surface finish.	Microelectron. Reliab.	2011	DBLP DOI BibTeX RDF
14	Abigail Agwai, Ibrahim Guven, Erdogan Madenci	Crack propagation in multilayer thin-film structures of electronic packages using the peridynamic theory.	Microelectron. Reliab.	2011	DBLP DOI BibTeX RDF
14	Apostolos Ampatzoglou, Apostolos Kritikos, George Kakarontzas, Ioannis Stamelos	An empirical investigation on the reusability of design patterns and software packages.	J. Syst. Softw.	2011	DBLP DOI BibTeX RDF
14	Anil S. Jadhav, Rajendra M. Sonar	Framework for evaluation and selection of the software packages: A hybrid knowledge based system approach.	J. Syst. Softw.	2011	DBLP DOI BibTeX RDF
14	Heewan Park, Hyun-il Lim, Seokwoo Choi, Taisook Han	Detecting Common Modules in Java Packages Based on Static Object Trace Birthmark.	Comput. J.	2011	DBLP DOI BibTeX RDF
14	Susan P. Holmes, Alexander V. Alekseyenko, Alden Timme, Tyrrell Nelson, Pankaj Jay Pasricha, Alfred Spormann	Visualization and Statistical Comparisons of Microbial Communities Using R Packages on Phylochip Data.	Pacific Symposium on Biocomputing	2011	DBLP BibTeX RDF
14	Konstantin O. Petrosyants, Nikita I. Rjabov	Thermal analysis of the ball grid array packages.	EWDTS	2011	DBLP DOI BibTeX RDF
14	Afonso Araújo Neto, Marco Vieira	Selecting Software Packages for Secure Database Installations.	ARES	2011	DBLP DOI BibTeX RDF
14	Vlad Olaru, Anca Hangan, Gheorghe Sebestyen-Pal	Java Support Packages and Benchmarks for Multi-core Processors.	HPCC	2011	DBLP DOI BibTeX RDF
14	Pierpaolo Di Bitonto, Teresa Roselli, Veronica Rossano, Cristina De Serio	Using the SCORM Standard to Build Adaptive Content Packages in RELOAD.	DMS	2011	DBLP BibTeX RDF
14	Matthew Rowe 0001, Milan Stankovic, Aba-Sah Dadzie, Mariann Hardey (eds.)	Proceedings of the ESWC2011 Workshop on 'Making Sense of Microposts': Big things come in small packages, Heraklion, Crete, Greece, May 30, 2011	#MSM	2011	DBLP BibTeX RDF
14	Hamidreza Eskandari, Ehsan Mahmoodi, Hamed Fallah, Christopher D. Geiger	Performance analysis of comercial simulation-based optimization packages: Optquest and Witness Optimizer.	WSC	2011	DBLP DOI BibTeX RDF
14	Philip J. Guo, Dawson R. Engler	CDE: Using System Call Interposition to Automatically Create Portable Software Packages.	USENIX Annual Technical Conference	2011	DBLP BibTeX RDF
14	Fabiana Lorenzi, Stanley Loh, Mara Abel	PersonalTour: A Recommender System for Travel Packages.	IAT	2011	DBLP DOI BibTeX RDF
14	Izzatdin Abdul Aziz, Andrzej M. Goscinski, Michael Hobbs	Performance Evaluation of Open Source Seismic Data Processing Packages.	ICA3PP (1)	2011	DBLP DOI BibTeX RDF
14	Yonggan Li, Yinlei Tian	The Biorthogonality Quality of the Multivariate Multiwavelet Packages with Multi-scale Factor.	CSEE (4)	2011	DBLP DOI BibTeX RDF
14	Katrin Weller, Evelyn Dröge, Cornelius Puschmann	Citation Analysis in Twitter: Approaches for Defining and Measuring Information Flows within Tweets during Scientific Conferences.	#MSM	2011	DBLP BibTeX RDF